Bond Process Monitoring via Self-Sensing Piezoelectric Transducers

Michael Brökelmann; Jörg Wallaschek; Hans Hesse

doi:10.1109/FREQ.2004.1418440

Details

Original language	English
Title of host publication	Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004
Pages	125-129
Number of pages	5
Publication status	Published - 2005
Externally published	Yes
Event	2004 IEEE International Frequency Control Symposium and Exposition. A Conference of the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society (UFFC-S) - Montreal, Canada Duration: 23 Aug 2004 → 27 Aug 2004

Publication series

Name	Proceedings of the IEEE International Frequency Control Symposium
ISSN (Print)	1075-6787

Abstract

Process monitoring via self-sensing piezoelectric transducers was applied to wirebonding. Starting with a description of the state of the art in bond process monitoring, this paper introduces the concept of self-sensing piezoelectric transducers and reports first experimental results which have been obtained by using this technique.

Keywords

Bond quality, Piezoelectric transducer, Process monitoring, Self-sensing, Wirebond

ASJC Scopus subject areas

Engineering(all)
General Engineering

Cite this

Bond Process Monitoring via Self-Sensing Piezoelectric Transducers. / Brökelmann, Michael; Wallaschek, Jörg; Hesse, Hans.
Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004. 2005. p. 125-129 (Proceedings of the IEEE International Frequency Control Symposium).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Brökelmann, M, Wallaschek, J & Hesse, H 2005, Bond Process Monitoring via Self-Sensing Piezoelectric Transducers. in Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004. Proceedings of the IEEE International Frequency Control Symposium, pp. 125-129, 2004 IEEE International Frequency Control Symposium and Exposition. A Conference of the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society (UFFC-S), Montreal, Canada, 23 Aug 2004. https://doi.org/10.1109/FREQ.2004.1418440

Brökelmann, M., Wallaschek, J., & Hesse, H. (2005). Bond Process Monitoring via Self-Sensing Piezoelectric Transducers. In Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004 (pp. 125-129). (Proceedings of the IEEE International Frequency Control Symposium). https://doi.org/10.1109/FREQ.2004.1418440

Brökelmann M, Wallaschek J, Hesse H. Bond Process Monitoring via Self-Sensing Piezoelectric Transducers. In Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004. 2005. p. 125-129. (Proceedings of the IEEE International Frequency Control Symposium). doi: 10.1109/FREQ.2004.1418440

Brökelmann, Michael ; Wallaschek, Jörg ; Hesse, Hans. / Bond Process Monitoring via Self-Sensing Piezoelectric Transducers. Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004. 2005. pp. 125-129 (Proceedings of the IEEE International Frequency Control Symposium).

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abstract = "Process monitoring via self-sensing piezoelectric transducers was applied to wirebonding. Starting with a description of the state of the art in bond process monitoring, this paper introduces the concept of self-sensing piezoelectric transducers and reports first experimental results which have been obtained by using this technique.",

keywords = "Bond quality, Piezoelectric transducer, Process monitoring, Self-sensing, Wirebond",

author = "Michael Br{\"o}kelmann and J{\"o}rg Wallaschek and Hans Hesse",

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Download

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Research@Leibniz University