Details
Translated title of the contribution | Effects of heat sinks on the failure behavior of Ics |
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Original language | German |
Title of host publication | EMV 2016 |
Subtitle of host publication | Internationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit |
Editors | Heyno Garbe |
Pages | 45-52 |
Number of pages | 8 |
ISBN (electronic) | 9783863593964 |
Publication status | Published - 2016 |
Event | International Trade Fair and Congress for Electromagnetic Compatibility, EMV 2016 - Düsseldorf, Germany Duration: 23 Feb 2016 → 25 Feb 2016 |
Publication series
Name | EMV 2016 - Internationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit |
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Volume | 2016-February |
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
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EMV 2016 : Internationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit. ed. / Heyno Garbe. 2016. p. 45-52 (EMV 2016 - Internationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit; Vol. 2016-February).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Auswirkungen von Kühlkörpern auf das Ausfallverhalten von ICs
AU - Rogowski, Maik
AU - Peikert, Tim
AU - Garbe, Heyno
AU - Potthast, Stefan
PY - 2016
Y1 - 2016
UR - http://www.scopus.com/inward/record.url?scp=85051795717&partnerID=8YFLogxK
M3 - Aufsatz in Konferenzband
AN - SCOPUS:85051795717
T3 - EMV 2016 - Internationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit
SP - 45
EP - 52
BT - EMV 2016
A2 - Garbe, Heyno
T2 - Internationale Fachmesse und Kongress für Elektromagnetische Vertraglichkeit, EMV 2016
Y2 - 23 February 2016 through 25 February 2016
ER -