Details
| Original language | English |
|---|---|
| Pages (from-to) | 1445-1450 |
| Number of pages | 6 |
| Journal | Microsystem technologies |
| Volume | 16 |
| Issue number | 8-9 |
| Publication status | Published - Aug 2010 |
Abstract
Taking advantage of high aspect ratio micro structure technology (HARMST) allows a cost competitive approach to batch fabricate a high number of tool electrodes for micro electro discharge machining (EDM). A new type of EDM tool micro electrode fabrication was developed using a combination of near UV lithography to directly polymerize a micromold made of SU-8™ in combination with electroplating. Applying SU-8™ for the fabrication of deep hollow micromolds, an ultra-thin resist film remains on the seed layer at the bottom of the mi- cromolds. This remaining undeveloped resist film at the bottom of the mold prevents the electro deposition on the conductive seed layer. The PVA Tepla PS4008 plasma ashing system was investigated to remove the resist residually from the SU-8™ micromolds before electroplating without destroying the micromold itself and to remove the entire micromold after the fabrication of the micro electrodes selectively.
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Computer Science(all)
- Hardware and Architecture
- Engineering(all)
- Electrical and Electronic Engineering
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In: Microsystem technologies, Vol. 16, No. 8-9, 08.2010, p. 1445-1450.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - Applying SU-8™ to the fabrication of micro electro discharge machining electrodes
AU - Traisigkhachol, Ornwasa
AU - Schmid, Hermann
AU - Wurz, Marc
AU - Gatzen, Hans H.
N1 - Funding Information: Funding: sponsored in part by the DFG (German Research Foundation) within the collaborative research center (DFG) 481/29-1 “New Tool Electrodes for Micro Electro Discharge Machining”, Conference: HARMST 2009.
PY - 2010/8
Y1 - 2010/8
N2 - Taking advantage of high aspect ratio micro structure technology (HARMST) allows a cost competitive approach to batch fabricate a high number of tool electrodes for micro electro discharge machining (EDM). A new type of EDM tool micro electrode fabrication was developed using a combination of near UV lithography to directly polymerize a micromold made of SU-8™ in combination with electroplating. Applying SU-8™ for the fabrication of deep hollow micromolds, an ultra-thin resist film remains on the seed layer at the bottom of the mi- cromolds. This remaining undeveloped resist film at the bottom of the mold prevents the electro deposition on the conductive seed layer. The PVA Tepla PS4008 plasma ashing system was investigated to remove the resist residually from the SU-8™ micromolds before electroplating without destroying the micromold itself and to remove the entire micromold after the fabrication of the micro electrodes selectively.
AB - Taking advantage of high aspect ratio micro structure technology (HARMST) allows a cost competitive approach to batch fabricate a high number of tool electrodes for micro electro discharge machining (EDM). A new type of EDM tool micro electrode fabrication was developed using a combination of near UV lithography to directly polymerize a micromold made of SU-8™ in combination with electroplating. Applying SU-8™ for the fabrication of deep hollow micromolds, an ultra-thin resist film remains on the seed layer at the bottom of the mi- cromolds. This remaining undeveloped resist film at the bottom of the mold prevents the electro deposition on the conductive seed layer. The PVA Tepla PS4008 plasma ashing system was investigated to remove the resist residually from the SU-8™ micromolds before electroplating without destroying the micromold itself and to remove the entire micromold after the fabrication of the micro electrodes selectively.
UR - http://www.scopus.com/inward/record.url?scp=77955849878&partnerID=8YFLogxK
U2 - 10.1007/s00542-009-1011-2
DO - 10.1007/s00542-009-1011-2
M3 - Article
AN - SCOPUS:77955849878
VL - 16
SP - 1445
EP - 1450
JO - Microsystem technologies
JF - Microsystem technologies
SN - 0946-7076
IS - 8-9
ER -