Details
| Original language | English |
|---|---|
| Title of host publication | Advances in Optical Thin Films VII |
| Editors | Michel Lequime, Detlev Ristau |
| Publisher | SPIE |
| ISBN (electronic) | 9781510645882 |
| Publication status | Published - 12 Sept 2021 |
| Event | Advances in Optical Thin Films VII 2021 - Virtual, Online, Spain Duration: 13 Sept 2021 → 17 Sept 2021 |
Publication series
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Volume | 11872 |
| ISSN (Print) | 0277-786X |
| ISSN (electronic) | 1996-756X |
Abstract
Hybrid integrated photonics open up new application perspectives due to compact size and the shift to cost-efficient components. Therefore, integration of optical and electro-optical functionalities into photonic chips has recently attracted great interest. Research has been directed towards miniaturization of demanding spectral transfer properties for individual applications.1 However, it remains challenging to implement highly complex transmission and reflection characteristics with few additional process steps. In this contribution, we report on our advancement in the field of optical thin-film coating fabrication, which enables a manufacturing process comparable to die assembly in electronics. We have combined a sacrificial-substrate approach with the production of miniaturized optical thin-film coatings by ion-beam sputtering. The concept is applicable to high precision coatings with more than 130 individual layers and adding up to over 26µm total film thickness. Segmentation down to sizes of 25µmx25µm pieces is realized by laser cutting of the coating. By completely removing the substrate afterwards, we achieve a freestanding thin-film and thus minimized thickness. Our measurements indicate no general performance loss compared to coatings on glass substrates. Additionally, the substrates refractive index and absorption do not have to be considered in the multilayer-coating design. Therefore, the design can be optimized and matched to the refractive index of specific waveguides on the chip. Furthermore, we demonstrate the compatibility to releasable transfer tape. With this, we aim for enabling a high-volume feed of miniaturized thin-film filters to an automated assembly process.
Keywords
- Automated assembly, Broad band monitor, Hybrid integrated photonics, Ion beam sputtering, Miniaturized thin-film coatings, PhoenixD, Sacrificial substrate, Substrate-free thin-film filters
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Computer Science(all)
- Computer Science Applications
- Mathematics(all)
- Applied Mathematics
- Engineering(all)
- Electrical and Electronic Engineering
Cite this
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- BibTeX
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Advances in Optical Thin Films VII. ed. / Michel Lequime; Detlev Ristau. SPIE, 2021. 118720G (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11872).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Applying sacrificial substrate technology to miniaturized precision optical thin-film coatings
AU - Rüsseler, Anna Karoline
AU - Carstens, Florian
AU - Jensen, Lars
AU - Bengsch, Sebastian
AU - Ristau, Detlev
N1 - Funding Information: The authors would like to thank the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) for funding this work under Germany’s Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453).
PY - 2021/9/12
Y1 - 2021/9/12
N2 - Hybrid integrated photonics open up new application perspectives due to compact size and the shift to cost-efficient components. Therefore, integration of optical and electro-optical functionalities into photonic chips has recently attracted great interest. Research has been directed towards miniaturization of demanding spectral transfer properties for individual applications.1 However, it remains challenging to implement highly complex transmission and reflection characteristics with few additional process steps. In this contribution, we report on our advancement in the field of optical thin-film coating fabrication, which enables a manufacturing process comparable to die assembly in electronics. We have combined a sacrificial-substrate approach with the production of miniaturized optical thin-film coatings by ion-beam sputtering. The concept is applicable to high precision coatings with more than 130 individual layers and adding up to over 26µm total film thickness. Segmentation down to sizes of 25µmx25µm pieces is realized by laser cutting of the coating. By completely removing the substrate afterwards, we achieve a freestanding thin-film and thus minimized thickness. Our measurements indicate no general performance loss compared to coatings on glass substrates. Additionally, the substrates refractive index and absorption do not have to be considered in the multilayer-coating design. Therefore, the design can be optimized and matched to the refractive index of specific waveguides on the chip. Furthermore, we demonstrate the compatibility to releasable transfer tape. With this, we aim for enabling a high-volume feed of miniaturized thin-film filters to an automated assembly process.
AB - Hybrid integrated photonics open up new application perspectives due to compact size and the shift to cost-efficient components. Therefore, integration of optical and electro-optical functionalities into photonic chips has recently attracted great interest. Research has been directed towards miniaturization of demanding spectral transfer properties for individual applications.1 However, it remains challenging to implement highly complex transmission and reflection characteristics with few additional process steps. In this contribution, we report on our advancement in the field of optical thin-film coating fabrication, which enables a manufacturing process comparable to die assembly in electronics. We have combined a sacrificial-substrate approach with the production of miniaturized optical thin-film coatings by ion-beam sputtering. The concept is applicable to high precision coatings with more than 130 individual layers and adding up to over 26µm total film thickness. Segmentation down to sizes of 25µmx25µm pieces is realized by laser cutting of the coating. By completely removing the substrate afterwards, we achieve a freestanding thin-film and thus minimized thickness. Our measurements indicate no general performance loss compared to coatings on glass substrates. Additionally, the substrates refractive index and absorption do not have to be considered in the multilayer-coating design. Therefore, the design can be optimized and matched to the refractive index of specific waveguides on the chip. Furthermore, we demonstrate the compatibility to releasable transfer tape. With this, we aim for enabling a high-volume feed of miniaturized thin-film filters to an automated assembly process.
KW - Automated assembly
KW - Broad band monitor
KW - Hybrid integrated photonics
KW - Ion beam sputtering
KW - Miniaturized thin-film coatings
KW - PhoenixD
KW - Sacrificial substrate
KW - Substrate-free thin-film filters
UR - http://www.scopus.com/inward/record.url?scp=85118916953&partnerID=8YFLogxK
U2 - 10.1117/12.2597003
DO - 10.1117/12.2597003
M3 - Conference contribution
AN - SCOPUS:85118916953
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Advances in Optical Thin Films VII
A2 - Lequime, Michel
A2 - Ristau, Detlev
PB - SPIE
T2 - Advances in Optical Thin Films VII 2021
Y2 - 13 September 2021 through 17 September 2021
ER -