Details
| Original language | English |
|---|---|
| Title of host publication | 5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009 |
| Pages | 116-126 |
| Number of pages | 11 |
| Publication status | Published - 2009 |
| Externally published | Yes |
| Event | 5th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2009 - Denver, CO, United States Duration: 21 Apr 2009 → 23 Apr 2009 |
Publication series
| Name | 5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009 |
|---|
Abstract
LTCC (Low Temperature Cofired Ceramics) dielectrics have a higher permittivity than most of the common organic circuit boards. Combined with their good RF-performance and their nearly arbitrary layer count, these are excellent prerequisites for high packaging density. Thermal conductivity is ten times higher than that of organic substrates, which is very helpful when semiconductors need to be cooled either for power dissipation or for better noise performance at lower operating temperature. The well-established screen-printing process used in LTCC is a further benefit in the volume production of such modules. Over the last decade, low loss LTCC material systems have become available, which are very suitable for microwave and millimetre wave applications. Integrating the antenna into such microwave front-ends is a consequent step in order to avoid phase and amplitude uncertainties associated with connectors and cables. Yet, higher permittivity is not always an advantage. It allows reducing size in some antenna designs, but at the cost of limiting the bandwidth. However, LTCC, with its inherent possibilities of complex three-dimensional structures, facilitates entirely new antenna concepts, which do more than just make up for this drawback. In this paper a few of these solutions for different frequencies and radiation characteristics shall be presented, along with their principle of operation and measured performance.
Keywords
- Ceramic Antenna, LTCC, Microstrip Patch Antenna, Planar Antenna
ASJC Scopus subject areas
- Computer Science(all)
- Hardware and Architecture
- Materials Science(all)
- Ceramics and Composites
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5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009. 2009. p. 116-126 (5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Antenna concepts for ceramic multilayer modules
AU - Uhlig, P.
AU - Geissler, M.
AU - Holzwarth, S.
AU - Leiss, J.
AU - Manteuffel, D.
AU - Martínez-Vázquez, M.
PY - 2009
Y1 - 2009
N2 - LTCC (Low Temperature Cofired Ceramics) dielectrics have a higher permittivity than most of the common organic circuit boards. Combined with their good RF-performance and their nearly arbitrary layer count, these are excellent prerequisites for high packaging density. Thermal conductivity is ten times higher than that of organic substrates, which is very helpful when semiconductors need to be cooled either for power dissipation or for better noise performance at lower operating temperature. The well-established screen-printing process used in LTCC is a further benefit in the volume production of such modules. Over the last decade, low loss LTCC material systems have become available, which are very suitable for microwave and millimetre wave applications. Integrating the antenna into such microwave front-ends is a consequent step in order to avoid phase and amplitude uncertainties associated with connectors and cables. Yet, higher permittivity is not always an advantage. It allows reducing size in some antenna designs, but at the cost of limiting the bandwidth. However, LTCC, with its inherent possibilities of complex three-dimensional structures, facilitates entirely new antenna concepts, which do more than just make up for this drawback. In this paper a few of these solutions for different frequencies and radiation characteristics shall be presented, along with their principle of operation and measured performance.
AB - LTCC (Low Temperature Cofired Ceramics) dielectrics have a higher permittivity than most of the common organic circuit boards. Combined with their good RF-performance and their nearly arbitrary layer count, these are excellent prerequisites for high packaging density. Thermal conductivity is ten times higher than that of organic substrates, which is very helpful when semiconductors need to be cooled either for power dissipation or for better noise performance at lower operating temperature. The well-established screen-printing process used in LTCC is a further benefit in the volume production of such modules. Over the last decade, low loss LTCC material systems have become available, which are very suitable for microwave and millimetre wave applications. Integrating the antenna into such microwave front-ends is a consequent step in order to avoid phase and amplitude uncertainties associated with connectors and cables. Yet, higher permittivity is not always an advantage. It allows reducing size in some antenna designs, but at the cost of limiting the bandwidth. However, LTCC, with its inherent possibilities of complex three-dimensional structures, facilitates entirely new antenna concepts, which do more than just make up for this drawback. In this paper a few of these solutions for different frequencies and radiation characteristics shall be presented, along with their principle of operation and measured performance.
KW - Ceramic Antenna
KW - LTCC
KW - Microstrip Patch Antenna
KW - Planar Antenna
UR - http://www.scopus.com/inward/record.url?scp=84879877765&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84879877765
SN - 9781615673742
T3 - 5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009
SP - 116
EP - 126
BT - 5th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2009, CICMT 2009
T2 - 5th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2009
Y2 - 21 April 2009 through 23 April 2009
ER -