Details
| Original language | English |
|---|---|
| Title of host publication | 2017 IEEE CPMT Symposium Japan (ICSJ) |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 203-206 |
| Number of pages | 4 |
| ISBN (electronic) | 9781538627129 |
| ISBN (print) | 978-1-5386-2713-6 |
| Publication status | Published - 28 Dec 2017 |
| Event | 2017 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan Duration: 20 Nov 2017 → 22 Nov 2017 |
Keywords
- real-time observation, ultrasonic wire bonding, wire/substrate interface
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
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2017 IEEE CPMT Symposium Japan (ICSJ). Institute of Electrical and Electronics Engineers Inc., 2017. p. 203-206.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process
AU - Long, Yangyang
AU - Dencker, Folke
AU - Isaak, Andreas
AU - Li, Chun
AU - Wurz, Marc
AU - Twiefel, Jens
AU - Wallaschek, Jorg
AU - Schneider, Friedrich
AU - Hermsdorf, Jorg
N1 - Funding information: This work is supported by DFG (Deutsche Forschungs-gemeinschaft) programm (TW75/8-1|WA564/40-1|WU 558/11 -1). Many thanks to Hesse Mechatronics GmbH for providing the bonding head HBK05.
PY - 2017/12/28
Y1 - 2017/12/28
KW - real-time observation
KW - ultrasonic wire bonding
KW - wire/substrate interface
UR - http://www.scopus.com/inward/record.url?scp=85044444005&partnerID=8YFLogxK
U2 - 10.1109/ICSJ.2017.8240117
DO - 10.1109/ICSJ.2017.8240117
M3 - Conference contribution
AN - SCOPUS:85044444005
SN - 978-1-5386-2713-6
SP - 203
EP - 206
BT - 2017 IEEE CPMT Symposium Japan (ICSJ)
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE CPMT Symposium Japan (ICSJ)
Y2 - 20 November 2017 through 22 November 2017
ER -