Details
| Original language | English |
|---|---|
| Article number | 671 |
| Journal | Metals |
| Volume | 13 |
| Issue number | 4 |
| Publication status | Published - 29 Mar 2023 |
Abstract
A metallurgical joint between aluminum and copper established by compound casting provides for high thermal conductivity, which is required for lightweight cooling solutions in applications such as high-power light-emitting diodes or computer processors. If casting is employed in a silane-doped inert gas atmosphere whose oxygen partial pressure is adequate to extreme high vacuum, reoxidation of the active surfaces of aluminum and copper is prevented, and thus a metallurgical bond can be created directly between aluminum and copper. With this approach, thermal conductivities as high as 88.3 W/m·K were realized. In addition, X-ray microscopy was used to shed light on the microstructure–thermal property relationship. It is demonstrated that both porosity and non-bonded areas have a substantial impact on the thermophysical properties of the compound zone. Based on the data obtained, casting parameters can be developed that provide for defect-free bonding zones and optimal heat transfer between the joining partners.
Keywords
- aluminum-copper compounds, compound casting, Kirkendall effect, microstructure, porosity, silane, thermal conductivity, volumetric characterization, X-ray microscopy
ASJC Scopus subject areas
- Materials Science(all)
- General Materials Science
- Materials Science(all)
- Metals and Alloys
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In: Metals, Vol. 13, No. 4, 671, 29.03.2023.
Research output: Contribution to journal › Article › Research › peer review
}
TY - JOUR
T1 - An X-ray Microscopy Study of the Microstructural Effects on Thermal Conductivity in Cast Aluminum-Copper Compounds
AU - Fromm, Andreas Christopher
AU - Kahra, Christoph
AU - Selmanovic, Armin
AU - Maier, Hans Jürgen
AU - Klose, Christian
N1 - Funding Information: This research was funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation)—Project-ID 394563137—SFB 1368.
PY - 2023/3/29
Y1 - 2023/3/29
N2 - A metallurgical joint between aluminum and copper established by compound casting provides for high thermal conductivity, which is required for lightweight cooling solutions in applications such as high-power light-emitting diodes or computer processors. If casting is employed in a silane-doped inert gas atmosphere whose oxygen partial pressure is adequate to extreme high vacuum, reoxidation of the active surfaces of aluminum and copper is prevented, and thus a metallurgical bond can be created directly between aluminum and copper. With this approach, thermal conductivities as high as 88.3 W/m·K were realized. In addition, X-ray microscopy was used to shed light on the microstructure–thermal property relationship. It is demonstrated that both porosity and non-bonded areas have a substantial impact on the thermophysical properties of the compound zone. Based on the data obtained, casting parameters can be developed that provide for defect-free bonding zones and optimal heat transfer between the joining partners.
AB - A metallurgical joint between aluminum and copper established by compound casting provides for high thermal conductivity, which is required for lightweight cooling solutions in applications such as high-power light-emitting diodes or computer processors. If casting is employed in a silane-doped inert gas atmosphere whose oxygen partial pressure is adequate to extreme high vacuum, reoxidation of the active surfaces of aluminum and copper is prevented, and thus a metallurgical bond can be created directly between aluminum and copper. With this approach, thermal conductivities as high as 88.3 W/m·K were realized. In addition, X-ray microscopy was used to shed light on the microstructure–thermal property relationship. It is demonstrated that both porosity and non-bonded areas have a substantial impact on the thermophysical properties of the compound zone. Based on the data obtained, casting parameters can be developed that provide for defect-free bonding zones and optimal heat transfer between the joining partners.
KW - aluminum-copper compounds
KW - compound casting
KW - Kirkendall effect
KW - microstructure
KW - porosity
KW - silane
KW - thermal conductivity
KW - volumetric characterization
KW - X-ray microscopy
UR - http://www.scopus.com/inward/record.url?scp=85156130568&partnerID=8YFLogxK
U2 - 10.3390/met13040671
DO - 10.3390/met13040671
M3 - Article
AN - SCOPUS:85156130568
VL - 13
JO - Metals
JF - Metals
SN - 2075-4701
IS - 4
M1 - 671
ER -