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An application report: Protective thin film layers for high temperature sensor technology

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

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  • St. Petersburg State Electrotechnical University
  • St. Petersburg State Polytechnical University
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Details

Original languageEnglish
Title of host publicationProceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016
EditorsS. Shaposhnikov
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages32-36
Number of pages5
ISBN (electronic)9781509004454
Publication statusPublished - 5 Apr 2016
EventIEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016 - Saint Petersburg, Russian Federation
Duration: 2 Feb 20163 Feb 2016

Abstract

Many groups of engineers and researchers worldwide are involved in the application-oriented development of sensors. These efforts are often triggered by industrial applications and their extraordinary requirements in durability and reliability. Typical products are highly specialized sensors e.g. for temperature which are exposed to high physical and chemical stresses like in cutting or forming processes. One promising approach of space resolved or surface sensitive measurements is the use of thin film sensors. A key factor for the successful use is an insulating wear resistance layer on top of the sensor. In this report a well-known hard layer made from aluminum oxide was optimized under mechanical and electrical aspects.

Keywords

    aluminum oxide, deposition, electrical properties, mechanical properties, PVD, sputtering, thin films

ASJC Scopus subject areas

Cite this

An application report: Protective thin film layers for high temperature sensor technology. / Dencker, Folke; Wurz, Marc; Dubrovskiy, Sergey et al.
Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016. ed. / S. Shaposhnikov. Institute of Electrical and Electronics Engineers Inc., 2016. p. 32-36 7448110.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Dencker, F, Wurz, M, Dubrovskiy, S & Koroleva, E 2016, An application report: Protective thin film layers for high temperature sensor technology. in S Shaposhnikov (ed.), Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016., 7448110, Institute of Electrical and Electronics Engineers Inc., pp. 32-36, IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016, Saint Petersburg, Russian Federation, 2 Feb 2016. https://doi.org/10.1109/EIConRusNW.2016.7448110
Dencker, F., Wurz, M., Dubrovskiy, S., & Koroleva, E. (2016). An application report: Protective thin film layers for high temperature sensor technology. In S. Shaposhnikov (Ed.), Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016 (pp. 32-36). Article 7448110 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EIConRusNW.2016.7448110
Dencker F, Wurz M, Dubrovskiy S, Koroleva E. An application report: Protective thin film layers for high temperature sensor technology. In Shaposhnikov S, editor, Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 32-36. 7448110 doi: 10.1109/EIConRusNW.2016.7448110
Dencker, Folke ; Wurz, Marc ; Dubrovskiy, Sergey et al. / An application report : Protective thin film layers for high temperature sensor technology. Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016. editor / S. Shaposhnikov. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 32-36
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