Active gripper for hot melt joining of micro components

Research output: Chapter in book/report/conference proceedingContribution to book/anthologyResearchpeer review

Authors

External Research Organisations

  • Technische Universität Braunschweig
View graph of relations

Details

Original languageEnglish
Title of host publicationPrecision Assembly Technologies and Systems
Subtitle of host publication5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Pages191-198
Number of pages8
Publication statusPublished - 2010
Externally publishedYes

Publication series

NameIFIP Advances in Information and Communication Technology
Volume315
ISSN (Print)1868-4238

Abstract

Precision assembly of hybrid micro systems requires not only a high precision handling and adjusting of the parts but also a highly accurate and fast bonding technique. In this field adhesive technology is one of the major joining techniques. At the Collaboration Research Center 516, a batch process based on a joining technique using hot melt adhesives was developed. This technique allows the coating of micro components with hot melt in a batch. The coating process is followed by the joining process. Due to this, the time between coating and joining can be designed variably. Because of the short set times of hot melt adhesives short joining times are possible. For this assembly process adapted heat management and adapted gripper systems are very important. Primarily, the conception and construction of suitable grippers, which realize the complex requirements of the heat management, meet a high challenge. This paper presents an active gripper system for the joining of micro parts using hot melt adhesives. Furthermore, first examinations and results of an assembly process using this gripper for bonding with hot melt adhesives are presented.

Keywords

    Active gripper systems, Hot melt adhesives, Precision joining operations

ASJC Scopus subject areas

Cite this

Active gripper for hot melt joining of micro components. / Rathmann, Sven; Raatz, Annika; Hesselbach, Jürgen.
Precision Assembly Technologies and Systems: 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings. 2010. p. 191-198 (IFIP Advances in Information and Communication Technology; Vol. 315).

Research output: Chapter in book/report/conference proceedingContribution to book/anthologyResearchpeer review

Rathmann, S, Raatz, A & Hesselbach, J 2010, Active gripper for hot melt joining of micro components. in Precision Assembly Technologies and Systems: 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings. IFIP Advances in Information and Communication Technology, vol. 315, pp. 191-198. https://doi.org/10.1007/978-3-642-11598-1_22
Rathmann, S., Raatz, A., & Hesselbach, J. (2010). Active gripper for hot melt joining of micro components. In Precision Assembly Technologies and Systems: 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings (pp. 191-198). (IFIP Advances in Information and Communication Technology; Vol. 315). https://doi.org/10.1007/978-3-642-11598-1_22
Rathmann S, Raatz A, Hesselbach J. Active gripper for hot melt joining of micro components. In Precision Assembly Technologies and Systems: 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings. 2010. p. 191-198. (IFIP Advances in Information and Communication Technology). doi: 10.1007/978-3-642-11598-1_22
Rathmann, Sven ; Raatz, Annika ; Hesselbach, Jürgen. / Active gripper for hot melt joining of micro components. Precision Assembly Technologies and Systems: 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings. 2010. pp. 191-198 (IFIP Advances in Information and Communication Technology).
Download
@inbook{5e9a353b443240279d7de8dbcad03150,
title = "Active gripper for hot melt joining of micro components",
abstract = "Precision assembly of hybrid micro systems requires not only a high precision handling and adjusting of the parts but also a highly accurate and fast bonding technique. In this field adhesive technology is one of the major joining techniques. At the Collaboration Research Center 516, a batch process based on a joining technique using hot melt adhesives was developed. This technique allows the coating of micro components with hot melt in a batch. The coating process is followed by the joining process. Due to this, the time between coating and joining can be designed variably. Because of the short set times of hot melt adhesives short joining times are possible. For this assembly process adapted heat management and adapted gripper systems are very important. Primarily, the conception and construction of suitable grippers, which realize the complex requirements of the heat management, meet a high challenge. This paper presents an active gripper system for the joining of micro parts using hot melt adhesives. Furthermore, first examinations and results of an assembly process using this gripper for bonding with hot melt adhesives are presented.",
keywords = "Active gripper systems, Hot melt adhesives, Precision joining operations",
author = "Sven Rathmann and Annika Raatz and J{\"u}rgen Hesselbach",
year = "2010",
doi = "10.1007/978-3-642-11598-1_22",
language = "English",
isbn = "9783642115974",
series = "IFIP Advances in Information and Communication Technology",
pages = "191--198",
booktitle = "Precision Assembly Technologies and Systems",

}

Download

TY - CHAP

T1 - Active gripper for hot melt joining of micro components

AU - Rathmann, Sven

AU - Raatz, Annika

AU - Hesselbach, Jürgen

PY - 2010

Y1 - 2010

N2 - Precision assembly of hybrid micro systems requires not only a high precision handling and adjusting of the parts but also a highly accurate and fast bonding technique. In this field adhesive technology is one of the major joining techniques. At the Collaboration Research Center 516, a batch process based on a joining technique using hot melt adhesives was developed. This technique allows the coating of micro components with hot melt in a batch. The coating process is followed by the joining process. Due to this, the time between coating and joining can be designed variably. Because of the short set times of hot melt adhesives short joining times are possible. For this assembly process adapted heat management and adapted gripper systems are very important. Primarily, the conception and construction of suitable grippers, which realize the complex requirements of the heat management, meet a high challenge. This paper presents an active gripper system for the joining of micro parts using hot melt adhesives. Furthermore, first examinations and results of an assembly process using this gripper for bonding with hot melt adhesives are presented.

AB - Precision assembly of hybrid micro systems requires not only a high precision handling and adjusting of the parts but also a highly accurate and fast bonding technique. In this field adhesive technology is one of the major joining techniques. At the Collaboration Research Center 516, a batch process based on a joining technique using hot melt adhesives was developed. This technique allows the coating of micro components with hot melt in a batch. The coating process is followed by the joining process. Due to this, the time between coating and joining can be designed variably. Because of the short set times of hot melt adhesives short joining times are possible. For this assembly process adapted heat management and adapted gripper systems are very important. Primarily, the conception and construction of suitable grippers, which realize the complex requirements of the heat management, meet a high challenge. This paper presents an active gripper system for the joining of micro parts using hot melt adhesives. Furthermore, first examinations and results of an assembly process using this gripper for bonding with hot melt adhesives are presented.

KW - Active gripper systems

KW - Hot melt adhesives

KW - Precision joining operations

UR - http://www.scopus.com/inward/record.url?scp=76749116689&partnerID=8YFLogxK

U2 - 10.1007/978-3-642-11598-1_22

DO - 10.1007/978-3-642-11598-1_22

M3 - Contribution to book/anthology

AN - SCOPUS:76749116689

SN - 9783642115974

T3 - IFIP Advances in Information and Communication Technology

SP - 191

EP - 198

BT - Precision Assembly Technologies and Systems

ER -

By the same author(s)