Details
| Original language | English |
|---|---|
| Pages (from-to) | 241-258 |
| Number of pages | 18 |
| Journal | Journal of Materials Processing Technology |
| Volume | 245 |
| Publication status | Published - 22 Feb 2017 |
Keywords
- Bonding mechanisms, Interface, Ultrasonic wire bonding, Wedge-wedge bonding
ASJC Scopus subject areas
- Materials Science(all)
- Ceramics and Composites
- Computer Science(all)
- Computer Science Applications
- Materials Science(all)
- Metals and Alloys
- Engineering(all)
- Industrial and Manufacturing Engineering
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A review on the mechanisms of ultrasonic wedge-wedge bonding. / Long, Yangyang; Twiefel, Jens; Wallaschek, Jörg.
In: Journal of Materials Processing Technology, Vol. 245, 22.02.2017, p. 241-258.
In: Journal of Materials Processing Technology, Vol. 245, 22.02.2017, p. 241-258.
Research output: Contribution to journal › Article › Research › peer review
Long, Y, Twiefel, J & Wallaschek, J 2017, 'A review on the mechanisms of ultrasonic wedge-wedge bonding', Journal of Materials Processing Technology, vol. 245, pp. 241-258. https://doi.org/10.1016/j.jmatprotec.2017.02.012
Long, Y., Twiefel, J., & Wallaschek, J. (2017). A review on the mechanisms of ultrasonic wedge-wedge bonding. Journal of Materials Processing Technology, 245, 241-258. https://doi.org/10.1016/j.jmatprotec.2017.02.012
Long Y, Twiefel J, Wallaschek J. A review on the mechanisms of ultrasonic wedge-wedge bonding. Journal of Materials Processing Technology. 2017 Feb 22;245:241-258. doi: 10.1016/j.jmatprotec.2017.02.012
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AU - Twiefel, Jens
AU - Wallaschek, Jörg
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Y1 - 2017/2/22
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KW - Interface
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