A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Authors

  • Gia Bao Thieu
  • Johannes Schmechel
  • Kirsten Weide-Zaage
  • Katharina Schmidt
  • Dorian Hagenah
  • Guillermo Paya-Vaya

Research Organisations

External Research Organisations

  • Technische Universität Braunschweig
  • Wehrwissenschaftliches Institut für Schutztechnologien ABC -Schutz (WIS)
View graph of relations

Details

Original languageEnglish
Title of host publication2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Subtitle of host publication EuroSimE
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (electronic)9798350345971
ISBN (print)979-8-3503-4598-8
Publication statusPublished - 2023
Event24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Austria
Duration: 16 Apr 202319 Apr 2023

Publication series

Name International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems
ISSN (Print)2833-8553
ISSN (electronic)2833-8596

Abstract

Bit errors due to radiation effects are becoming increasingly important as the fabrication technologies are shrinking with every generation of integrated circuits. The resulting smaller transistors are more prone to high-energy irradiation. This is relevant in avionics or even automotive, where the safety of millions of cars must be ensured. This paper proposes an experiment, where multiple FPGAs (Field Programmable Gate Arrays) are exposed to 2.45MeV neutron irradiation in parallel. Bitflips in different memory components (Block RAM, Flip-Flops, lookup-tables and configuration memory) are detected. The results show that bitflips could be detected in every memory component in every part of the FPGA. Finally, a soft-error probability model depending on the irradiation fluence can be determined. With the probability model, future implementations of fault-tolerant hardware architectures can be tested with hardware simulations using artificially generated bitflips.

ASJC Scopus subject areas

Cite this

A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. / Thieu, Gia Bao; Schmechel, Johannes; Weide-Zaage, Kirsten et al.
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 2023. ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Thieu, GB, Schmechel, J, Weide-Zaage, K, Schmidt, K, Hagenah, D & Paya-Vaya, G 2023, A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems, Institute of Electrical and Electronics Engineers Inc., 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Austria, 16 Apr 2023. https://doi.org/10.1109/EuroSimE56861.2023.10100757
Thieu, G. B., Schmechel, J., Weide-Zaage, K., Schmidt, K., Hagenah, D., & Paya-Vaya, G. (2023). A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuroSimE56861.2023.10100757
Thieu GB, Schmechel J, Weide-Zaage K, Schmidt K, Hagenah D, Paya-Vaya G. A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc. 2023. ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems). doi: 10.1109/EuroSimE56861.2023.10100757
Thieu, Gia Bao ; Schmechel, Johannes ; Weide-Zaage, Kirsten et al. / A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 2023. ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).
Download
@inproceedings{8105290d778c4179ab9777df8ddc1ccc,
title = "A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure",
abstract = "Bit errors due to radiation effects are becoming increasingly important as the fabrication technologies are shrinking with every generation of integrated circuits. The resulting smaller transistors are more prone to high-energy irradiation. This is relevant in avionics or even automotive, where the safety of millions of cars must be ensured. This paper proposes an experiment, where multiple FPGAs (Field Programmable Gate Arrays) are exposed to 2.45MeV neutron irradiation in parallel. Bitflips in different memory components (Block RAM, Flip-Flops, lookup-tables and configuration memory) are detected. The results show that bitflips could be detected in every memory component in every part of the FPGA. Finally, a soft-error probability model depending on the irradiation fluence can be determined. With the probability model, future implementations of fault-tolerant hardware architectures can be tested with hardware simulations using artificially generated bitflips.",
author = "Thieu, {Gia Bao} and Johannes Schmechel and Kirsten Weide-Zaage and Katharina Schmidt and Dorian Hagenah and Guillermo Paya-Vaya",
year = "2023",
doi = "10.1109/EuroSimE56861.2023.10100757",
language = "English",
isbn = "979-8-3503-4598-8",
series = " International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",
address = "United States",
note = "24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 ; Conference date: 16-04-2023 Through 19-04-2023",

}

Download

TY - GEN

T1 - A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

AU - Thieu, Gia Bao

AU - Schmechel, Johannes

AU - Weide-Zaage, Kirsten

AU - Schmidt, Katharina

AU - Hagenah, Dorian

AU - Paya-Vaya, Guillermo

PY - 2023

Y1 - 2023

N2 - Bit errors due to radiation effects are becoming increasingly important as the fabrication technologies are shrinking with every generation of integrated circuits. The resulting smaller transistors are more prone to high-energy irradiation. This is relevant in avionics or even automotive, where the safety of millions of cars must be ensured. This paper proposes an experiment, where multiple FPGAs (Field Programmable Gate Arrays) are exposed to 2.45MeV neutron irradiation in parallel. Bitflips in different memory components (Block RAM, Flip-Flops, lookup-tables and configuration memory) are detected. The results show that bitflips could be detected in every memory component in every part of the FPGA. Finally, a soft-error probability model depending on the irradiation fluence can be determined. With the probability model, future implementations of fault-tolerant hardware architectures can be tested with hardware simulations using artificially generated bitflips.

AB - Bit errors due to radiation effects are becoming increasingly important as the fabrication technologies are shrinking with every generation of integrated circuits. The resulting smaller transistors are more prone to high-energy irradiation. This is relevant in avionics or even automotive, where the safety of millions of cars must be ensured. This paper proposes an experiment, where multiple FPGAs (Field Programmable Gate Arrays) are exposed to 2.45MeV neutron irradiation in parallel. Bitflips in different memory components (Block RAM, Flip-Flops, lookup-tables and configuration memory) are detected. The results show that bitflips could be detected in every memory component in every part of the FPGA. Finally, a soft-error probability model depending on the irradiation fluence can be determined. With the probability model, future implementations of fault-tolerant hardware architectures can be tested with hardware simulations using artificially generated bitflips.

UR - http://www.scopus.com/inward/record.url?scp=85158171431&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE56861.2023.10100757

DO - 10.1109/EuroSimE56861.2023.10100757

M3 - Conference contribution

AN - SCOPUS:85158171431

SN - 979-8-3503-4598-8

T3 - International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems

BT - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Y2 - 16 April 2023 through 19 April 2023

ER -

By the same author(s)