Details
| Original language | English |
|---|---|
| Title of host publication | 17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) |
| Subtitle of host publication | Maastricht MEMS 2004 Technical Digest |
| Pages | 462-465 |
| Number of pages | 4 |
| Publication status | Published - 27 Sept 2004 |
| Externally published | Yes |
| Event | 17th IEEE International Conference on Micro Electro Mechanical Systems: MEMS 2004 Technical Digest - Maastricht, Netherlands Duration: 25 Jan 2004 → 29 Jan 2004 Conference number: 17 https://library.villanova.edu/Find/Record/1476111/Details |
Abstract
The micropump presented in this paper demonstrates advancements made both in performance and fabrication over most existing mechanical micropumps. The pump is planar and fabricated using a wafer-level, four-mask process, making it attractive for integration into micro total-analysis systems. Its design utilizes thermopneumatic actuation and two in-plane flap valves with fluidic-resistance ratios greater than 1300 to reach maximum pressures of 16 kPa and maximum flow rates of 9 μL/min at an average power consumption of 180 mW (20% duty cycle, 10 Hz). Pressures as high as 20.2 kPa were achieved at an average power consumption of 200 mW (20% duty cycle, 5 Hz). This performance is better than most micropumps utilizing in-plane or out-of-plane valves.
ASJC Scopus subject areas
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Condensed Matter Physics
- Engineering(all)
- Mechanical Engineering
- Engineering(all)
- Electrical and Electronic Engineering
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17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS): Maastricht MEMS 2004 Technical Digest. 2004. p. 462-465.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - A planar micropump utilizing thermopneumatic actuation and in-plane flap valves
AU - Zimmermann, S.
AU - Frank, J. A.
AU - Liepmann, D.
AU - Pisano, A. P.
N1 - Conference code: 17
PY - 2004/9/27
Y1 - 2004/9/27
N2 - The micropump presented in this paper demonstrates advancements made both in performance and fabrication over most existing mechanical micropumps. The pump is planar and fabricated using a wafer-level, four-mask process, making it attractive for integration into micro total-analysis systems. Its design utilizes thermopneumatic actuation and two in-plane flap valves with fluidic-resistance ratios greater than 1300 to reach maximum pressures of 16 kPa and maximum flow rates of 9 μL/min at an average power consumption of 180 mW (20% duty cycle, 10 Hz). Pressures as high as 20.2 kPa were achieved at an average power consumption of 200 mW (20% duty cycle, 5 Hz). This performance is better than most micropumps utilizing in-plane or out-of-plane valves.
AB - The micropump presented in this paper demonstrates advancements made both in performance and fabrication over most existing mechanical micropumps. The pump is planar and fabricated using a wafer-level, four-mask process, making it attractive for integration into micro total-analysis systems. Its design utilizes thermopneumatic actuation and two in-plane flap valves with fluidic-resistance ratios greater than 1300 to reach maximum pressures of 16 kPa and maximum flow rates of 9 μL/min at an average power consumption of 180 mW (20% duty cycle, 10 Hz). Pressures as high as 20.2 kPa were achieved at an average power consumption of 200 mW (20% duty cycle, 5 Hz). This performance is better than most micropumps utilizing in-plane or out-of-plane valves.
UR - http://www.scopus.com/inward/record.url?scp=3042742397&partnerID=8YFLogxK
U2 - 10.1109/MEMS.2004.1290622
DO - 10.1109/MEMS.2004.1290622
M3 - Conference contribution
AN - SCOPUS:3042742397
SN - 078038265X
SP - 462
EP - 465
BT - 17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
T2 - 17th IEEE International Conference on Micro Electro Mechanical Systems
Y2 - 25 January 2004 through 29 January 2004
ER -