Details
| Original language | English |
|---|---|
| Title of host publication | 2022 IEEE Custom Integrated Circuits Conference, CICC 2022 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 9781665407564 |
| ISBN (print) | 978-1-7281-8280-3 |
| Publication status | Published - 2022 |
| Event | 43rd Annual IEEE Custom Integrated Circuits Conference, CICC 2022 - Newport Beach, United States Duration: 24 Apr 2022 → 27 Apr 2022 |
Publication series
| Name | Proceedings of the Custom Integrated Circuits Conference |
|---|---|
| Volume | 2022-April |
| ISSN (Print) | 0886-5930 |
Abstract
There is a growing need for compact and energy efficient high-voltage (HV) DCDC converters with input voltages >100V for low-power applications up to 500mW. This includes loT and smart-home, supplied from the ac mains, as well as auxiliary supplies for power converters in electrical vehicles and in the field of renewable energy that operate from HV DC-link. Discrete state-of-the-art power supplies are not efficient at light loads below 500mW and are relatively large in size, Fig. 1. They typically use a passive-clamp flyback (PCF) topology (Fig. 1 bottom right) with large external components, such as power switches (QM), HV capacitors $(Cc)$, the output diode $\mathrm{D}_{\text{out}}$, and a transformer $\top$ with up to several millihenries of inductance. The passive clamp topology also suffers from losses due to the leakage inductance $L_{\text{lk}}$ and the hard switching of $\mathrm{Q}_{\mathrm{M}}$. Non-isolated HV DCDC converters with dedicated power topologies [1] achieve good power densities but are not suitable for applications that require galvanic HV isolation. Active clamp flyback (ACF) converters (Fig. 1 bottom left) allow for galvanic isolation while keeping switching losses low. However, ACF designs [2], [3] are usually optimized for high output power and still require large external components. Further, their complex control limits the light-load efficiency. This paper presents a low-power-optimized ACF IC that benefits from integration in a 180nm HV SOI technology. It offers a fully integrated power stage and provides a robust and time-precise control at faster switching speed and more compact size. This way, high light-load efficiency and good power density are achieved.
ASJC Scopus subject areas
- Engineering(all)
- Electrical and Electronic Engineering
Sustainable Development Goals
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2022 IEEE Custom Integrated Circuits Conference, CICC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. (Proceedings of the Custom Integrated Circuits Conference; Vol. 2022-April).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - A Highly-Integrated 20-300V 0.5W Active-Clamp Flyback DCDC Converter with 76.7% Peak Efficiency
AU - Rindfleisch, Christoph
AU - Otten, Jens
AU - Wicht, Bernhard
PY - 2022
Y1 - 2022
N2 - There is a growing need for compact and energy efficient high-voltage (HV) DCDC converters with input voltages >100V for low-power applications up to 500mW. This includes loT and smart-home, supplied from the ac mains, as well as auxiliary supplies for power converters in electrical vehicles and in the field of renewable energy that operate from HV DC-link. Discrete state-of-the-art power supplies are not efficient at light loads below 500mW and are relatively large in size, Fig. 1. They typically use a passive-clamp flyback (PCF) topology (Fig. 1 bottom right) with large external components, such as power switches (QM), HV capacitors $(Cc)$, the output diode $\mathrm{D}_{\text{out}}$, and a transformer $\top$ with up to several millihenries of inductance. The passive clamp topology also suffers from losses due to the leakage inductance $L_{\text{lk}}$ and the hard switching of $\mathrm{Q}_{\mathrm{M}}$. Non-isolated HV DCDC converters with dedicated power topologies [1] achieve good power densities but are not suitable for applications that require galvanic HV isolation. Active clamp flyback (ACF) converters (Fig. 1 bottom left) allow for galvanic isolation while keeping switching losses low. However, ACF designs [2], [3] are usually optimized for high output power and still require large external components. Further, their complex control limits the light-load efficiency. This paper presents a low-power-optimized ACF IC that benefits from integration in a 180nm HV SOI technology. It offers a fully integrated power stage and provides a robust and time-precise control at faster switching speed and more compact size. This way, high light-load efficiency and good power density are achieved.
AB - There is a growing need for compact and energy efficient high-voltage (HV) DCDC converters with input voltages >100V for low-power applications up to 500mW. This includes loT and smart-home, supplied from the ac mains, as well as auxiliary supplies for power converters in electrical vehicles and in the field of renewable energy that operate from HV DC-link. Discrete state-of-the-art power supplies are not efficient at light loads below 500mW and are relatively large in size, Fig. 1. They typically use a passive-clamp flyback (PCF) topology (Fig. 1 bottom right) with large external components, such as power switches (QM), HV capacitors $(Cc)$, the output diode $\mathrm{D}_{\text{out}}$, and a transformer $\top$ with up to several millihenries of inductance. The passive clamp topology also suffers from losses due to the leakage inductance $L_{\text{lk}}$ and the hard switching of $\mathrm{Q}_{\mathrm{M}}$. Non-isolated HV DCDC converters with dedicated power topologies [1] achieve good power densities but are not suitable for applications that require galvanic HV isolation. Active clamp flyback (ACF) converters (Fig. 1 bottom left) allow for galvanic isolation while keeping switching losses low. However, ACF designs [2], [3] are usually optimized for high output power and still require large external components. Further, their complex control limits the light-load efficiency. This paper presents a low-power-optimized ACF IC that benefits from integration in a 180nm HV SOI technology. It offers a fully integrated power stage and provides a robust and time-precise control at faster switching speed and more compact size. This way, high light-load efficiency and good power density are achieved.
UR - http://www.scopus.com/inward/record.url?scp=85130723840&partnerID=8YFLogxK
U2 - 10.1109/cicc53496.2022.9772834
DO - 10.1109/cicc53496.2022.9772834
M3 - Conference contribution
AN - SCOPUS:85130723840
SN - 978-1-7281-8280-3
T3 - Proceedings of the Custom Integrated Circuits Conference
BT - 2022 IEEE Custom Integrated Circuits Conference, CICC 2022 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 43rd Annual IEEE Custom Integrated Circuits Conference, CICC 2022
Y2 - 24 April 2022 through 27 April 2022
ER -