Details
| Original language | English |
|---|---|
| Title of host publication | 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (electronic) | 978-1-7281-6293-5 |
| ISBN (print) | 978-1-7281-6294-2 |
| Publication status | Published - 2020 |
| Event | 8th IEEE Electronics System-Integration Technology Conference, ESTC 2020 - Tonsberg, Vestfold, Norway Duration: 15 Sept 2020 → 18 Sept 2020 |
Abstract
The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.
Keywords
- 3D-MID, 3D-packaging, Additive manufacturing, Ceramic polymer hybrid package, Optical bus coupling, Stereo lithography
ASJC Scopus subject areas
- Computer Science(all)
- Hardware and Architecture
- Engineering(all)
- Electrical and Electronic Engineering
- Materials Science(all)
- Electronic, Optical and Magnetic Materials
- Physics and Astronomy(all)
- Instrumentation
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers Inc., 2020. 9229840.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
}
TY - GEN
T1 - 3D-Opto-MID for Asymmetric Optical Bus Couplers
AU - Lorenz, Lukas
AU - Hanesch, Florian
AU - Nieweglowski, Krzysztof
AU - Eiche, Yannic
AU - Franke, Jorg
AU - Hoffmann, Gerd Albert
AU - Overmeyer, Ludger
AU - Bock, Karlheinz
N1 - Funding Information: ACKNOWLEDGEMENT The authors would like to thank the “Deutsche Forschungsgemeinschaft (DFG)” for funding the research group and therefore providing the opportunity of doing fundamental progress in this seminal field of technology. The authors are wholly responsible for this publication. This work was supported in the Research Group OPTAVER (BO 3438/4-1; AOBJ: 648318).
PY - 2020
Y1 - 2020
N2 - The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.
AB - The development of easy-to-use optical bus-systems without the need for waveguide interruption is one important step to establish optical interconnects in short- to midrange networks. The challenge from the packaging side of view is the three-dimensional integration of optical parts and waveguides to a novel kind of package, called 3D-Opto-MID. In this article, we present an approach for stereolithographic printed, three-dimensional polymer structures on ceramic thick-film substrates. Thus, we are able to combine the design freedom of 3D printing with the excellent RF- and heat-management properties of the thick-film technology, especially important for electro-optical (e/o) converters. On the three-dimensional structures, the waveguides for the bus-coupler are applied, while the ceramic holds the electro optical converters. Furthermore, the 3D printing allows for easily manufactured alignment- and fixing structures for the coupler with a high accuracy. The results section shows the analysis of the adhesion behavior of the printed polymer on the ceramic, as well as the obtainable tolerances with the printed alignment structures. The average accuracy of the alignment was measured with 31.1µm, which is sufficient for the used 200 µm multimode waveguides. Furthermore, we demonstrate the functionality of the optical path of the module assembly, as well as the coupling to a bus waveguide, which proves the success of the 3D-Opto-MID integration.
KW - 3D-MID
KW - 3D-packaging
KW - Additive manufacturing
KW - Ceramic polymer hybrid package
KW - Optical bus coupling
KW - Stereo lithography
UR - http://www.scopus.com/inward/record.url?scp=85096567648&partnerID=8YFLogxK
U2 - 10.1109/ESTC48849.2020.9229840
DO - 10.1109/ESTC48849.2020.9229840
M3 - Conference contribution
AN - SCOPUS:85096567648
SN - 978-1-7281-6294-2
BT - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 8th IEEE Electronics System-Integration Technology Conference, ESTC 2020
Y2 - 15 September 2020 through 18 September 2020
ER -