20.1%-efficient crystalline silicon solar cell with amorphous silicon rear-surface passivation

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Original languageEnglish
Pages (from-to)381-386
Number of pages6
JournalProgress in Photovoltaics: Research and Applications
Volume13
Issue number5
Publication statusPublished - 27 Jun 2005
Externally publishedYes

Abstract

We have developed a crystalline silicon solar cell with amorphous silicon (a-Si:H) rear-surface passivation based on a simple process. The a-Si:H layer is deposited at 225°C by plasma-enhanced chemical vapor deposition. An aluminum grid is evaporated onto the a-Si:H-passivated rear. The base contacts are formed by COSIMA (contact formation to a-Si:H passivated wafers by means of annealing) when subsequently depositing the front silicon nitride layer at 325°C. The a-Si:H underneath the aluminum fingers dissolves completely within the aluminum and an ohmic contact to the base is formed. This contacting scheme results in a very low contact resistance of 3.5±0-2mΩcm 2 on low-resistivity (0-5 Ωcm) p-type silicon, which is below that obtained for conventional Al/Si contacts. We achieve an independently confirmed energy conversion efficiency of 20-1% under one-sun standard testing conditions for a 4cm2 large cell. Measurements of the internal quantum efficiency show an improved rear surface passivation compared with reference cells with a silicon nitride rear passivation.

Keywords

    Amorphous silicon, High efficiency, Local metallization, Rear surface passivation, Silicon solar cell

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20.1%-efficient crystalline silicon solar cell with amorphous silicon rear-surface passivation. / Schaper, Martin; Schmidt, Jan; Plagwitz, Heiko et al.
In: Progress in Photovoltaics: Research and Applications, Vol. 13, No. 5, 27.06.2005, p. 381-386.

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AU - Schaper, Martin

AU - Schmidt, Jan

AU - Plagwitz, Heiko

AU - Brendel, Rolf

PY - 2005/6/27

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N2 - We have developed a crystalline silicon solar cell with amorphous silicon (a-Si:H) rear-surface passivation based on a simple process. The a-Si:H layer is deposited at 225°C by plasma-enhanced chemical vapor deposition. An aluminum grid is evaporated onto the a-Si:H-passivated rear. The base contacts are formed by COSIMA (contact formation to a-Si:H passivated wafers by means of annealing) when subsequently depositing the front silicon nitride layer at 325°C. The a-Si:H underneath the aluminum fingers dissolves completely within the aluminum and an ohmic contact to the base is formed. This contacting scheme results in a very low contact resistance of 3.5±0-2mΩcm 2 on low-resistivity (0-5 Ωcm) p-type silicon, which is below that obtained for conventional Al/Si contacts. We achieve an independently confirmed energy conversion efficiency of 20-1% under one-sun standard testing conditions for a 4cm2 large cell. Measurements of the internal quantum efficiency show an improved rear surface passivation compared with reference cells with a silicon nitride rear passivation.

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KW - Local metallization

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KW - Silicon solar cell

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