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Laboratorium für Informationstechnologie (LFI)

Organisational unit: former organisational unit

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Publications

  1. 2004
  2. Published

    Effect of thermal gradients on the electromigration lifetime in power electronics

    Nguyen, H. V., Salm, C., Krabbenborg, B., Weide-Zaage, K., Bisschop, J., Mouthaan, A. J. & Kuper, F. G., 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings. p. 619-620 2 p. (Annual Proceedings - Reliability Physics (Symposium)).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  3. Published

    Impact of ground line position on CMOS interconnect behavior

    Faïez Ktata, M., Arz, U., Grabinski, H. & Fischer, H., 2004, 64th ARFTG Microwave Measurements Conference: Digital Communications Systems Metrics, ARFTG 2004. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 1427600. (64th ARFTG Microwave Measurements Conference: Digital Communications Systems Metrics, ARFTG 2004).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  4. Published

    Next generation on-board SAR processor for compact airborne systems

    Nolte, N., Simon-Klar, C., Langemeyer, S., Kirscht, M. & Pirsch, P., 2004, p. 1514-1517. 4 p.

    Research output: Contribution to conference › Paper › Research › peer review

  5. Published

    Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry

    Weide-Zaage, K., Dalleau, D., Danto, Y. & Fremont, H., 2004, Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004. Ernst, L. J., Zhang, G. Q., Rodgers, P. & Saint Leger, O. (eds.). p. 367-372 6 p. (Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  6. 2003
  7. Published

    Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures

    Dalleau, D., Weide-Zaage, K. & Danto, Y., Sept 2003, In: Microelectronics reliability. 43, 9-11, p. 1821-1826 6 p.

    Research output: Contribution to journal › Conference article › Research › peer review

  8. Published

    Towards understanding epitaxial growth of alternative high-K dielectrics on Si(001): Application to praseodymium oxide

    Fissel, A., Osten, H. J. & Bugiel, E., 5 Aug 2003, In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 21, 4, p. 1765-1772 8 p.

    Research output: Contribution to journal › Article › Research › peer review

  9. Published

    Causal Characteristic Impedance of Planar Transmission Lines

    Williams, D. F., Alpert, B. K., Arz, U., Walker, D. K. & Grabinski, H., May 2003, In: IEEE Transactions on Advanced Packaging. 26, 2, p. 165-171 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  10. Published

    Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanisms

    Weide-Zaage, K., Dalleau, D. & Yu, X., Feb 2003, In: Materials Science in Semiconductor Processing. 6, 1-3, p. 85-92 8 p.

    Research output: Contribution to journal › Article › Research › peer review

  11. Published

    A Compact and Flexible Multi-DSP System for Real-Time SAR Applications

    Langemeyer, S., Kloos, H., Simon-Klar, C., Friebe, L., Hinrichs, W., Lieske, H. & Pirsch, P., 2003, p. 1657-1659. 3 p.

    Research output: Contribution to conference › Paper › Research › peer review

  12. Published

    Determination of frequency dependent transmission line parameters on product related on chip test line structures using s-parameter measurements

    Winkel, T. M., Faiez Ktata, M., Ludwig, T., Scheltler, H., Grabinski, H. & Klink, E., 2003, Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., p. 97-100 4 p. 1250008. (Electrical Performance of Electronic Packaging).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  13. Published

    When are substrate effects important for on-chip interconnects?

    Ktata, M. F., Grabinski, H., Gad, G. & Fischer, H., 2003, Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., p. 265-268 4 p. 1250046. (Electrical Performance of Electronic Packaging).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  14. 2002
  15. Published

    Methodology for characterization of high-speed multi-conductor metal interconnections and evaluation of measurement errors

    Palusinski, O. A., Znamirowski, L., Reiss, K. & Grabinski, H., Aug 2002, In: IEEE Transactions on Advanced Packaging. 25, 3, p. 347-355 9 p.

    Research output: Contribution to journal › Article › Research › peer review

  16. Published

    Architecture of an image rendering co-processor for MPEG-4 visual compositing

    Berekovic, M., Pirsch, P., Selinger, T., Wels, K. I., Miro, C., Lafage, A., Heer, C. & Ghigo, G., 1 Jul 2002, In: Journal of VLSI Signal Processing Systems for Signal, Image, and Video Technology. 31, 2, p. 157-171 15 p.

    Research output: Contribution to journal › Article › Research › peer review

  17. Published

    HiPAR-DSP 16, scalable highly parallel DSP core for system on a chip video- and image processing applications

    Kloos, H., Wittenburg, J. P., Hinrichs, W., Lieske, H., Friebe, L., Klar, C. & Pirsch, P., 2002, In: Proceedings of the IEEE International Conference on Acoustics, Speech, and Signal Processing (ICASSP). 3, p. III/3112-III/3115

    Research output: Contribution to journal › Conference article › Research › peer review

  18. Published

    LFSR test pattern crosstalk in nanometer technologies

    Treytnar, D., Redeker, M., Grabinski, H. & Ktata, F. M., 2002, Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI. p. 115-118 4 p. 4027673. (Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  19. 2001
  20. Published

    Three-dimensional voids simulation in chip metallization structures: A contribution to reliability evaluation

    Dalleau, D. & Weide-Zaage, K., Sept 2001, In: Microelectronics reliability. 41, 9-10, p. 1625-1630 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  21. Published

    Multi-DSP-board for compact real-time synthetic aperture radar systems

    Friebe, L., Kloos, H., Wittenburg, J. P., Hinrichs, W., Lieske, H. & Pirsch, P., 31 Aug 2001, In: Proceedings of SPIE - The International Society for Optical Engineering. 4366, p. 395-399 5 p.

    Research output: Contribution to journal › Conference article › Research › peer review

  22. Published

    HiPAR-DSP 16: A new DSP for onboard real-time SAR systems

    Kloos, H., Friebe, L., Wittenburg, J. P., Hinrichs, W., Lieske, H. & Pirsch, P., 26 Jul 2001, In: Proceedings of SPIE - The International Society for Optical Engineering. 4386, p. 1-6 6 p.

    Research output: Contribution to journal › Conference article › Research › peer review

  23. Published

    Characteristic-impedance measurement error on lossy substrates

    Williams, D. F., Arz, U. & Grabinski, H., Jul 2001, In: IEEE Microwave and Wireless Components Letters. 11, 7, p. 299-301 3 p.

    Research output: Contribution to journal › Article › Research › peer review

  24. Published

    A compact real-time SAR processing system using the highly parallel HiPAR-DSP 16

    Friebe, L., Kloos, H., Wittenburg, J. P., Hinrichs, W., Lieske, H., Klar, C. & Pirsch, P., 2001, p. 2307-2309. 3 p.

    Research output: Contribution to conference › Paper › Research › peer review

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