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Laboratorium für Informationstechnologie (LFI)

Organisational unit: former organisational unit

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Publications

  1. 2006
  2. Published

    Impact of oxygen supply during growth on the electrical properties of crystalline Gd2O3 thin films on Si(001)

    Czernohorsky, M., Bugiel, E., Osten, H. J., Fissel, A. & Kirfel, O., 10 Apr 2006, In: Applied physics letters. 88, 15, 152905.

    Research output: Contribution to journalArticleResearchpeer review

  3. Published

    Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon

    Fissel, A., Elassar, Z., Kirfel, O., Bugiel, E., Czernohorsky, M. & Osten, H. J., 5 Apr 2006, In: Journal of applied physics. 99, 7, 074105.

    Research output: Contribution to journalArticleResearchpeer review

  4. Published

    Impact of PCB layout design on final product's EMI compliance

    See, K. Y., Oswal, M., Khan-Ngern, W., Canavero, F., Christopoulos, C. & Grabinski, H., 2006, 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. p. 553-556 4 p. 1629684. (17th International Zurich Symposium on Electromagnetic Compatibility, 2006; vol. 2006).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  5. Published

    Measurements and FE-simulations of moisture distribution in FR4 based printed circuit boards

    Frémont, H., Horaud, W. & Weide-Zaage, K., 2006, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. 1643964. (7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006; vol. 2006).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  6. 2005
  7. Published

    Moisture diffusion in printed circuit boards: Measurements and finite- element- simulations

    Weide-Zaage, K., Horaud, W. & Frémont, H., Sept 2005, In: Microelectronics reliability. 45, 9-11, p. 1662-1667 6 p.

    Research output: Contribution to journalArticleResearchpeer review

  8. Published

    Implementation of pipelined multipliers on Xilinx FPGAs

    Do, T. T., Kropp, H., Schwiegershausen, M. & Pirsch, P., 29 Jul 2005, Field-Programmable Logic and Applications : 7th International Workshop, FPL 1997, Proceedings. Luk, W., Cheung, P. Y. K. & Glesner, M. (eds.). Springer Verlag, p. 51-60 10 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 1304).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  9. Published

    MBE growth and properties of epitaxial metal oxides for high-κ dielectrics

    Osten, H. J., Bugiel, E., Kirfel, O., Czernohorsky, M. & Fissel, A., 1 May 2005, In: Journal of crystal growth. 278, 1-4, p. 18-24 7 p.

    Research output: Contribution to journalConference articleResearchpeer review

  10. Published

    Foreword: Contributions from the eighth workshop on signal propagation on interconnects

    Grabinski, H. & Schutt-Ainé, J. E., May 2005, In: IEEE Transactions on Advanced Packaging. 28, 2, p. 150-151 2 p.

    Research output: Contribution to journalEditorial in journalResearchpeer review

  11. Published

    Influence of the ground line position on the signal integrity of product-related interconnects in the frequency and time domain

    Ktata, M. F., Arz, U., Grabinski, H. & Fischer, H., May 2005, In: IEEE Transactions on Advanced Packaging. 28, 2, p. 152-159 8 p.

    Research output: Contribution to journalArticleResearchpeer review

  12. Published

    Epitaxial growth of non-cubic silicon

    Fissel, A., Wang, C., Bugiel, E. & Osten, H. J., Mar 2005, In: Microelectronics journal. 36, 3-6, p. 506-509 4 p.

    Research output: Contribution to journalConference articleResearchpeer review

  13. Published

    Architecture of a flexible on-board real-time SAR-processor

    Langemeyer, S., Simon-Klar, C., Nolte, N. & Pirsch, P., 2005, 25th Anniversary IGARSS 2005: IEEE International Geoscience and Remote Sensing Symposium. p. 1746-1749 4 p. 1526340. (International Geoscience and Remote Sensing Symposium (IGARSS); vol. 3).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  14. Published

    ASEAN-EU university network programme on EMC and SI education

    Canavero, F. G., Christopoulos, C., Grabinski, H., Yak, S. K. & Khan-Ngern, W., 2005, Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005. p. 217-218 2 p. 1500949. (Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005; vol. 2005).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  15. Published

    Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

    Winkel, T. M., Deutsch, A., Katopis, G. A., Kopcsay, G. V., Klink, E., Dyckman, W. D., Chamberlin, B. J., Grabinski, H., Surovic, C. W., Liu, H. & Baks, C., 2005, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. p. 21-24 4 p. 1563690. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; vol. 2005).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  16. Published

    Development of demonstrator kit for designing practical EMC compliant system

    Kye, Y. S., Oswal, M., Khan-Ngern, W., Canavero, F., Christopoulos, C. & Grabinski, H., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. p. 179-187 9 p. 1614391. (Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005; vol. 1).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  17. Published

    Simulation of mass flux divergence distributions for an evaluation of commercial test structures with tungsten-plugs

    Weide-Zaage, K. & Hein, V., 2005, Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. p. 353-358 6 p. 1502827. (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; vol. 2005).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  18. 2004
  19. Published

    An on-board real-time SAR processor for small platforms

    Simon-Klar, C., Kirscht, M., Langemeyer, S., Nolte, N. & Pirsch, P., 22 Oct 2004, In: Proceedings of SPIE - The International Society for Optical Engineering. 5574, p. 420-427 8 p., 71.

    Research output: Contribution to journalConference articleResearchpeer review

  20. Published

    How to study delamination in plastic encapsulated devices

    Frémont, H., Delétage, J. Y., Weide-Zaage, K. & Danto, Y., Sept 2004, In: Microelectronics reliability. 44, 9-11 SPEC. ISS., p. 1311-1316 6 p.

    Research output: Contribution to journalArticleResearchpeer review

  21. Published

    An SoC with two multimedia DSPs and a RISC core for video compression applications

    Stolberg, H. J., Moch, S., Friebe, L., Dehnhardt, A., Kulaczewski, M. B., Berekovic, M. & Pirsch, P., 2004, In: Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 47, p. 330-331+325+531

    Research output: Contribution to journalConference articleResearchpeer review

  22. Published

    Crosstalk in product related bus systems using 110 nm CMOS technology

    Ktata, M. F., Grabinski, H., Arz, U. & Fischer, H., 2004, Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects. p. 85-88 4 p. (Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

  23. Published

    Effect of thermal gradients on the electromigration life-time in power electronics

    Nguyen, H. V., Salm, C., Krabbenborg, B., Weide-Zaage, K., Bisschop, J., Mouthaan, A. J. & Kuper, F. G., 2004, 2004 IEEE International Reliability Physics Symposium: Proceedings. January ed. Vol. 2004-January. p. 619-620 2 p. (IEEE International Reliability Physics Symposium Proceedings).

    Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

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