Publications
- 2006
- Published
Impact of oxygen supply during growth on the electrical properties of crystalline Gd2O3 thin films on Si(001)
Czernohorsky, M., Bugiel, E., Osten, H. J., Fissel, A. & Kirfel, O., 10 Apr 2006, In: Applied physics letters. 88, 15, 152905.Research output: Contribution to journal › Article › Research › peer review
- Published
Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon
Fissel, A., Elassar, Z., Kirfel, O., Bugiel, E., Czernohorsky, M. & Osten, H. J., 5 Apr 2006, In: Journal of applied physics. 99, 7, 074105.Research output: Contribution to journal › Article › Research › peer review
- Published
Impact of PCB layout design on final product's EMI compliance
See, K. Y., Oswal, M., Khan-Ngern, W., Canavero, F., Christopoulos, C. & Grabinski, H., 2006, 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. p. 553-556 4 p. 1629684. (17th International Zurich Symposium on Electromagnetic Compatibility, 2006; vol. 2006).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Measurements and FE-simulations of moisture distribution in FR4 based printed circuit boards
Frémont, H., Horaud, W. & Weide-Zaage, K., 2006, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. 1643964. (7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006; vol. 2006).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2005
- Published
Moisture diffusion in printed circuit boards: Measurements and finite- element- simulations
Weide-Zaage, K., Horaud, W. & Frémont, H., Sept 2005, In: Microelectronics reliability. 45, 9-11, p. 1662-1667 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Implementation of pipelined multipliers on Xilinx FPGAs
Do, T. T., Kropp, H., Schwiegershausen, M. & Pirsch, P., 29 Jul 2005, Field-Programmable Logic and Applications : 7th International Workshop, FPL 1997, Proceedings. Luk, W., Cheung, P. Y. K. & Glesner, M. (eds.). Springer Verlag, p. 51-60 10 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 1304).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
MBE growth and properties of epitaxial metal oxides for high-κ dielectrics
Osten, H. J., Bugiel, E., Kirfel, O., Czernohorsky, M. & Fissel, A., 1 May 2005, In: Journal of crystal growth. 278, 1-4, p. 18-24 7 p.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Foreword: Contributions from the eighth workshop on signal propagation on interconnects
Grabinski, H. & Schutt-Ainé, J. E., May 2005, In: IEEE Transactions on Advanced Packaging. 28, 2, p. 150-151 2 p.Research output: Contribution to journal › Editorial in journal › Research › peer review
- Published
Influence of the ground line position on the signal integrity of product-related interconnects in the frequency and time domain
Ktata, M. F., Arz, U., Grabinski, H. & Fischer, H., May 2005, In: IEEE Transactions on Advanced Packaging. 28, 2, p. 152-159 8 p.Research output: Contribution to journal › Article › Research › peer review
- Published
Epitaxial growth of non-cubic silicon
Fissel, A., Wang, C., Bugiel, E. & Osten, H. J., Mar 2005, In: Microelectronics journal. 36, 3-6, p. 506-509 4 p.Research output: Contribution to journal › Conference article › Research › peer review
- Published
Architecture of a flexible on-board real-time SAR-processor
Langemeyer, S., Simon-Klar, C., Nolte, N. & Pirsch, P., 2005, 25th Anniversary IGARSS 2005: IEEE International Geoscience and Remote Sensing Symposium. p. 1746-1749 4 p. 1526340. (International Geoscience and Remote Sensing Symposium (IGARSS); vol. 3).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
ASEAN-EU university network programme on EMC and SI education
Canavero, F. G., Christopoulos, C., Grabinski, H., Yak, S. K. & Khan-Ngern, W., 2005, Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005. p. 217-218 2 p. 1500949. (Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005; vol. 2005).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
Winkel, T. M., Deutsch, A., Katopis, G. A., Kopcsay, G. V., Klink, E., Dyckman, W. D., Chamberlin, B. J., Grabinski, H., Surovic, C. W., Liu, H. & Baks, C., 2005, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. p. 21-24 4 p. 1563690. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; vol. 2005).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Development of demonstrator kit for designing practical EMC compliant system
Kye, Y. S., Oswal, M., Khan-Ngern, W., Canavero, F., Christopoulos, C. & Grabinski, H., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. p. 179-187 9 p. 1614391. (Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005; vol. 1).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Simulation of mass flux divergence distributions for an evaluation of commercial test structures with tungsten-plugs
Weide-Zaage, K. & Hein, V., 2005, Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. p. 353-358 6 p. 1502827. (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; vol. 2005).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- 2004
- Published
An on-board real-time SAR processor for small platforms
Simon-Klar, C., Kirscht, M., Langemeyer, S., Nolte, N. & Pirsch, P., 22 Oct 2004, In: Proceedings of SPIE - The International Society for Optical Engineering. 5574, p. 420-427 8 p., 71.Research output: Contribution to journal › Conference article › Research › peer review
- Published
How to study delamination in plastic encapsulated devices
Frémont, H., Delétage, J. Y., Weide-Zaage, K. & Danto, Y., Sept 2004, In: Microelectronics reliability. 44, 9-11 SPEC. ISS., p. 1311-1316 6 p.Research output: Contribution to journal › Article › Research › peer review
- Published
An SoC with two multimedia DSPs and a RISC core for video compression applications
Stolberg, H. J., Moch, S., Friebe, L., Dehnhardt, A., Kulaczewski, M. B., Berekovic, M. & Pirsch, P., 2004, In: Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 47, p. 330-331+325+531Research output: Contribution to journal › Conference article › Research › peer review
- Published
Crosstalk in product related bus systems using 110 nm CMOS technology
Ktata, M. F., Grabinski, H., Arz, U. & Fischer, H., 2004, Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects. p. 85-88 4 p. (Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
- Published
Effect of thermal gradients on the electromigration life-time in power electronics
Nguyen, H. V., Salm, C., Krabbenborg, B., Weide-Zaage, K., Bisschop, J., Mouthaan, A. J. & Kuper, F. G., 2004, 2004 IEEE International Reliability Physics Symposium: Proceedings. January ed. Vol. 2004-January. p. 619-620 2 p. (IEEE International Reliability Physics Symposium Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review