Laboratorium für Informationstechnologie (LFI) - Publications

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Publications

2013
Published
Overlap design for higher tungsten via robustness in AlCu metallizations
Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., 2013, 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc., p. 137-141 5 p. 6804178. (IEEE International Integrated Reliability Workshop Final Report).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Simulation and measurement of the solder bumps with a plastic core
Schlobohm, J., Weide-Zaage, K., Rongen, R., Voogt, F. & Roucou, R., 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 6529979. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Slice sampling particle belief propagation
Muller, O., Yang, M. Y. & Rosenhahn, B., 2013, Proceedings: 2013 IEEE International Conference on Computer Vision, ICCV 2013. Institute of Electrical and Electronics Engineers Inc., p. 1129-1136 8 p. 6751250. (Proceedings of the IEEE International Conference on Computer Vision).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2012
Published
Electro- and thermo-migration induced failure mechanisms in Package on Package
Meinshausen, L., Weide-Zaage, K. & Frémont, H., Dec 2012, In: Microelectronics reliability. 52, 12, p. 2889-2906 18 p.
Research output: Contribution to journal › Review article › Research › peer review
Published
A design for robust wide metal tracks
Ackermann, M., Hein, V., Kovács, C. & Weide-Zaage, K., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 2447-2451 5 p.
Research output: Contribution to journal › Article › Research › peer review
Published
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers
Meinshausen, L., Frémont, H. & Weide-Zaage, K., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 1827-1832 6 p.
Research output: Contribution to journal › Article › Research › peer review
Published
Simulation of the influence of TiAl ₃ layers on the thermal-electrical and mechanical behaviour of Al metallizations
Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., Sept 2012, In: Microelectronics reliability. 52, 9-10, p. 1987-1992 6 p.
Research output: Contribution to journal › Article › Research › peer review
Published
Intuitive and Interactive Movement Sonification on a Heterogeneous RISC / DSP Platform
Brückner, H. P., Wielage, M. & Blume, H. C., Jun 2012, International Conference on Auditory Display.
Research output: Chapter in book/report/conference proceeding › Conference abstract › Research
Published
Influence of the barrier properties on the mechanical stress and migration distribution in a copper metallization
Kludt, J., Ciptokusumo, J. & Weide-Zaage, K., 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 6191701. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications
Ackermann, M., Hein, V. & Weide-Zaage, K., 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 6191800. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Thermal management for stackable packages with stacked ICs
Meinshausen, L., Weide-Zaage, K. & Frémont, H., 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 6191700. (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2011
Published
Impact of carbon incorporation into epitaxial Gd₂O₃ thin films on silicon: An experimental study on electrical properties
Laha, A., Ai, B., Babu, P. R. P., Fissel, A. & Osten, H. J., 10 Oct 2011, In: Applied physics letters. 99, 15, 152902.
Research output: Contribution to journal › Article › Research › peer review
Published
Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization
Bauer, I., Weide-Zaage, K. & Meinshausen, L., Sept 2011, In: Microelectronics reliability. 51, 9-11, p. 1587-1591 5 p.
Research output: Contribution to journal › Article › Research › peer review
Published
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps
Meinshausen, L., Weide-Zaage, K. & Frémont, H., Sept 2011, In: Microelectronics reliability. 51, 9-11, p. 1860-1864 5 p.
Research output: Contribution to journal › Article › Research › peer review
Published
A Scalable Hardware Algorithm for Demanding Timer Management in Network Systems
Septinus, K., Dragone, S., Langner, M., Blume, H. C. & Pirsch, P., 2011, 24. PARS-Workshop. Bonn, p. 58-67 (Parallel-Algorithmen, -Rechnerstrukturen und -Systemsoftware, PARS; vol. 28, no. 1).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
Published
Electro- and thermomigration in micro bump interconnects for 3D integration
Meinshausen, L., Weide-Zaage, K. & Petzold, M., 2011, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. p. 1444-1451 8 p. 5898701. (Proceedings - Electronic Components and Technology Conference).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Published
Enhanced electrical properties of carbon doped epitaxial Gd ₂O₃ thin films on Si substrates
Laha, A., Bin, A., Babu, P. R. P., Fissel, A. & Osten, H. J., 2011, Physics and Technology of High-k Materials 9. 3 ed. Electrochemical Society, Inc., p. 101-107 7 p. (ECS Transactions; vol. 41, no. 3).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2010
Published
Energy transfer on three-phase high-voltage lines: The strange behavior of the Poynting vector
Grabinski, H. & Wiznerowicz, F., Nov 2010, In: Electrical engineering. 92, 6, p. 203-214 12 p.
Research output: Contribution to journal › Article › Research › peer review
Published
Epitaxial multi-component rare-earth oxide: A high-k material with ultralow mismatch to Si
Wang, J., Liu, T., Wang, Z., Bugiel, E., Laha, A., Watahiki, T., Shayduk, R., Braun, W., Fissel, A. & Osten, H. J., 15 Apr 2010, In: Materials letters. 64, 7, p. 866-868 3 p.
Research output: Contribution to journal › Article › Research › peer review
Published
Effect of Ge passivation on interfacial properties of crystalline Gd₂ O₃ thin films grown on Si substrates
Laha, A., Fissel, A. & Osten, H. J., 2010, In: Applied physics letters. 96, 7, 072903.
Research output: Contribution to journal › Article › Research › peer review

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