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Laboratorium für Informationstechnologie (LFI)

Organisational unit: former organisational unit

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Publications

  1. 2014
  2. Published

    Qualification procedure for moisture in embedded capacitors

    Frémont, H., Kludt, J., Wade, M., Weide-Zaage, K., Bord-Majek, I. & Duchamp, G., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 2013-2016 4 p.

    Research output: Contribution to journal › Article › Research › peer review

  3. Published

    Reliability of wafer level chip scale packages

    Rongen, R., Roucou, R., Vd Wel, P. J., Voogt, F., Swartjes, F. & Weide-Zaage, K., 1 Sept 2014, In: Microelectronics reliability. 54, 9-10, p. 1988-1994 7 p.

    Research output: Contribution to journal › Article › Research › peer review

  4. Published

    Superior dielectric properties for template assisted grown (100) oriented Gd2O3 thin films on Si(100)

    Roy Chaudhuri, A., Fissel, A. & Osten, H. J., 8 Jan 2014, In: Applied physics letters. 104, 1, 012906.

    Research output: Contribution to journal › Article › Research › peer review

  5. Published

    Electromigration reliability of cylindrical Cu pillar SnAg 3.0Cu0.5 bumps

    Meinshausen, L., Weide-Zaage, K., Goldbeck, B., Moujbani, A., Kludt, J. & Fremont, H., 2014, 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. IEEE Computer Society, 6813775. (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  6. Published

    Reliability performance of different layouts of wide metal tracks

    Kludt, J., Weide-Zaage, K., Ackermann, M., Kovacs, C. & Hein, V., 2014, 2014 IEEE International Reliability Physics Symposium, IRPS 2014. Institute of Electrical and Electronics Engineers Inc., p. IT.4.1-IT.4.4 6861153. (IEEE International Reliability Physics Symposium Proceedings).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  7. Published

    Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core

    Weide-Zaage, K., Schlobohm, J., Rongen, R. T. H., Voogt, F. C. & Roucou, R., 2014, In: Microelectronics reliability. 54, 6-7, p. 1206-1211 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  8. Published

    Simulation in 3D integration and TSV

    Weide-Zaage, K., Moujbani, A. & Kludt, J., 2014, 2014 IEEE 5th Latin American Symposium on Circuits and Systems, LASCAS 2014 - Conference Proceedings. IEEE Computer Society, 6820324

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  9. Published

    Tuning dielectric properties of epitaxial lanthanide oxides on silicon

    Osten, H. J., Schwendt, D., Chaudhuri, A. R., Fissel, A., Shekhter, P. & Eizenberg, M., 2014, In: ECS Transactions. 61, 2, p. 3-9 7 p.

    Research output: Contribution to journal › Conference article › Research › peer review

  10. 2013
  11. Published

    Epitaxial Gd2O3 on strained Si1-xGe x layers for next generation complementary metal oxide semiconductor device application

    Ghosh, K., Das, S., Fissel, A., Osten, H. J. & Laha, A., 7 Oct 2013, In: Applied physics letters. 103, 15, 153501.

    Research output: Contribution to journal › Article › Research › peer review

  12. Published

    Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects

    Moujbani, A., Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V. & Meinshausen, L., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1365-1369 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  13. Published

    Dynamic simulation of octahedron slotted metal structures

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1606-1610 5 p.

    Research output: Contribution to journal › Article › Research › peer review

  14. Published

    Electro- and thermomigration-induced IMC formation in SnAg 3.0Cu0.5 solder joints on nickel gold pads

    Meinshausen, L., Frémont, H., Weide-Zaage, K. & Plano, B., Sept 2013, In: Microelectronics reliability. 53, 9-11, p. 1575-1580 6 p.

    Research output: Contribution to journal › Article › Research › peer review

  15. Published

    Effective control on flat band voltage of epitaxial lanthanide oxide based metal oxide semiconductor capacitors by interfacial carbon

    Laha, A., Fissel, A. & Osten, H. J., 20 May 2013, In: Applied physics letters. 102, 20, 202902.

    Research output: Contribution to journal › Article › Research › peer review

  16. Published

    Investigation of band offsets and direct current leakage properties of nitrogen doped epitaxial Gd2O3 thin films on Si

    Chaudhuri, A. R., Fissel, A. & Osten, H. J., 14 May 2013, In: Journal of applied physics. 113, 18, 184108.

    Research output: Contribution to journal › Article › Research › peer review

  17. Published

    Improving dielectric properties of epitaxial Gd2O3 thin films on silicon by nitrogen doping

    Roy Chaudhuri, A., Fissel, A., Archakam, V. R. & Osten, H. J., 14 Jan 2013, In: Applied physics letters. 102, 2, 022904.

    Research output: Contribution to journal › Article › Research › peer review

  18. Published

    Bayesian region selection for adaptive dictionary-based super-resolution

    Pérez-Pellitero, E., Salvador, J., Ruiz-Hidalgo, J. & Rosenhahn, B., 2013.

    Research output: Contribution to conference › Paper › Research › peer review

  19. Published

    Characterization of a new designed octahedron slotted metal track by simulations

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 6529907. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  20. Published

    Deformation of octahedron slotted metal tracks

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., 2013, 2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc., p. 161-165 5 p. 6804184. (IEEE International Integrated Reliability Workshop Final Report).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  21. Published

    Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing

    Meinshausen, L., Weide-Zaage, K. & Frémont, H., 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 6529895. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

  22. Published

    Investigation of temperature gradients with regard to thermomigration in aluminium metallizations

    Kludt, J., Weide-Zaage, K., Ackermann, M. & Hein, V., 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 6529896. (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).

    Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

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