Characterization of Soft Errors on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

Trumann, E., Thieu, G. B., Schmechel, J., Weide-Zaage, K., Wolff, D. V., Bausen, A., Paya-Vaya, G. & Müller, A., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 5 S.

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Dna Digital-storage: Advantages, Approach and Technical Implementation

Weide-Zaage, K., 2024, 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 6 S.

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Simulation of Different SRAM Cells under Neutron Radiation with GEANT4

Weide-Zaage, K., Mandala, S. J., Trumann, E., Paya-Vaya, G., Wolff, D. V., Bausen, A. & Muller, A., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 4 S.

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Technical Implementation of DNA Data-Storage

Weide-Zaage, K., 2024, 2024 International Conference on Electronics Packaging (ICEP). Institute of Electrical and Electronics Engineers Inc., S. 111-112 2 S.

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The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications

Hein, V., Weide-Zaage, K. & Clausner, A., 2024, 2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 6 S.

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Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology

Trumann, E., Thieu, G. B., Schmechel, J., Weide-Zaage, K., Schmidt, K., Hagenah, D. & Payá Vayá, G., 16 Sept. 2023, Applied Reconfigurable Computing. Architectures, Tools, and Applications: 19th International Symposium, ARC 2023, Proceedings. Palumbo, F., Keramidas, G., Voros, N. & Diniz, P. C. (Hrsg.). Springer Science and Business Media Deutschland GmbH, S. 357-360 4 S. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Band 14251 LNCS).

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A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure

Thieu, G. B., Schmechel, J., Weide-Zaage, K., Schmidt, K., Hagenah, D. & Paya-Vaya, G., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).

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Investigation of FPGA and SRAM Cells under Radiation Exposure

Weide-Zaage, K., Paya-Vaya, G., Schmidt, K. & Hagenah, D., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

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The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts

Hein, V. & Weide-Zaage, K., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 9410880. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

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Advances in Packaging for Emerging Technologies

Hollstein, K. & Weide-Zaage, K., 2020, 2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc., 9059539

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Identification of influencing PCB design parameters on thermal performance of a QFN package

Hollstein, K., Yang, L., Gao, Y. & Weide-Zaage, K., 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc., 9152651

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Silicon Die Bonding using a Photostructurable Adhesive Material

Hollstein, K. & Weide-Zaage, K., 2020, 2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc., 9375868

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New-Automotive -Autonomous Driving Challenges For The Microelectronic Components

Weide-Zaage, K., 22 Apr. 2019, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 6 S. 8696273

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Electromigration effects in corroded BGA

Weide-Zaage, K., Guedon-Gracia, A. & Fremont, H., März 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724522

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Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution

Hein, V., Weide-Zaage, K. & Yang, X., März 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724562

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Simulations in terms of radiation effects on different BEOL material systems

Weide-Zaage, K., Paya-Vaya, G. & Eichin, P., März 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 8724581

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Thick AlCu-metal reliability characterization

Weide-Zaage, K., Tan, Y. & Hein, V., 30 Mai 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc., S. 1-4 4 S.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review