XUV metrology: Surface analysis with extreme ultraviolet radiation

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • M. Banyay
  • L. Juschkin
  • T. Bücker
  • P. Loosen
  • A. Bayer
  • F. Barkusky
  • Stefan Döring
  • C. Peth
  • K. Mann
  • H. Blaschke
  • Istvan Balasa
  • Detlev Ristau

Externe Organisationen

  • Rheinisch-Westfälische Technische Hochschule Aachen (RWTH)
  • Laser-Laboratorium Göttingen e.V. (LLG)
  • Laser Zentrum Hannover e.V. (LZH)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des SammelwerksDamage to VUV, EUV, and X-Ray Optics II
PublikationsstatusVeröffentlicht - 18 Mai 2009
Extern publiziertJa
VeranstaltungDamage to VUV, EUV, and X-Ray Optics II - Prague, Tschechische Republik
Dauer: 21 Apr. 200923 Apr. 2009

Publikationsreihe

NameProceedings of SPIE - The International Society for Optical Engineering
Band7361
ISSN (Print)0277-786X

Abstract

The utilization of nanostructured materials for modern applications gained more and more importance during the last few years. As examples super-fluorescent quantum dots, the use of carbon nano tubes (CNTs) in microelectronics, electrospun fibers in filter membranes, thin film coatings for solar cells, mirrors or LEDs, semiconductor electronics, and functionalized surfaces may be named to address only a few topics. To optimize the systems and enable the full range of capabilities of nanostructures a thorough characterization of the surface-near topography (e.g. roughness, thickness, lateral dimension) as well as of the chemical composition is essential. As a versatile tool for spatial and chemical characterization XUV reflectometry, scatterometry and diffractometry is proposed. Three different experimental setups have been realized evaluating spectral resolved reflectance under constant incidence angle, angular resolved reflectance at a constant wavelength, or a combined approach using laboratory scaled XUV sources to gain insight into chemical composition, film thickness and surface/interface roughness. Experiments on near-edge X-ray absorption fine structure spectroscopy (NEXAFS) at the carbon K-edge have been performed. The investigated systems range from synthetic polymers (PMMA, PI) over organic substances (humic acids) to biological matter (lipids), delivering unique spectra for each compound. Thus NEXAFS spectroscopy using a table-top XUV source could be established as a highly surface sensitive fingerprint method for chemical analysis. Future extended experiments will investigate the silicon L-edge where e.g. silicon oxide interlayers below high-k or other nano-layered material on Sisubstrates depict a technological important group of composite systems.

ASJC Scopus Sachgebiete

Zitieren

XUV metrology: Surface analysis with extreme ultraviolet radiation. / Banyay, M.; Juschkin, L.; Bücker, T. et al.
Damage to VUV, EUV, and X-Ray Optics II. 2009. 736113 (Proceedings of SPIE - The International Society for Optical Engineering; Band 7361).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Banyay, M, Juschkin, L, Bücker, T, Loosen, P, Bayer, A, Barkusky, F, Döring, S, Peth, C, Mann, K, Blaschke, H, Balasa, I & Ristau, D 2009, XUV metrology: Surface analysis with extreme ultraviolet radiation. in Damage to VUV, EUV, and X-Ray Optics II., 736113, Proceedings of SPIE - The International Society for Optical Engineering, Bd. 7361, Damage to VUV, EUV, and X-Ray Optics II, Prague, Tschechische Republik, 21 Apr. 2009. https://doi.org/10.1117/12.833648
Banyay, M., Juschkin, L., Bücker, T., Loosen, P., Bayer, A., Barkusky, F., Döring, S., Peth, C., Mann, K., Blaschke, H., Balasa, I., & Ristau, D. (2009). XUV metrology: Surface analysis with extreme ultraviolet radiation. In Damage to VUV, EUV, and X-Ray Optics II Artikel 736113 (Proceedings of SPIE - The International Society for Optical Engineering; Band 7361). https://doi.org/10.1117/12.833648
Banyay M, Juschkin L, Bücker T, Loosen P, Bayer A, Barkusky F et al. XUV metrology: Surface analysis with extreme ultraviolet radiation. in Damage to VUV, EUV, and X-Ray Optics II. 2009. 736113. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.833648
Banyay, M. ; Juschkin, L. ; Bücker, T. et al. / XUV metrology : Surface analysis with extreme ultraviolet radiation. Damage to VUV, EUV, and X-Ray Optics II. 2009. (Proceedings of SPIE - The International Society for Optical Engineering).
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title = "XUV metrology: Surface analysis with extreme ultraviolet radiation",
abstract = "The utilization of nanostructured materials for modern applications gained more and more importance during the last few years. As examples super-fluorescent quantum dots, the use of carbon nano tubes (CNTs) in microelectronics, electrospun fibers in filter membranes, thin film coatings for solar cells, mirrors or LEDs, semiconductor electronics, and functionalized surfaces may be named to address only a few topics. To optimize the systems and enable the full range of capabilities of nanostructures a thorough characterization of the surface-near topography (e.g. roughness, thickness, lateral dimension) as well as of the chemical composition is essential. As a versatile tool for spatial and chemical characterization XUV reflectometry, scatterometry and diffractometry is proposed. Three different experimental setups have been realized evaluating spectral resolved reflectance under constant incidence angle, angular resolved reflectance at a constant wavelength, or a combined approach using laboratory scaled XUV sources to gain insight into chemical composition, film thickness and surface/interface roughness. Experiments on near-edge X-ray absorption fine structure spectroscopy (NEXAFS) at the carbon K-edge have been performed. The investigated systems range from synthetic polymers (PMMA, PI) over organic substances (humic acids) to biological matter (lipids), delivering unique spectra for each compound. Thus NEXAFS spectroscopy using a table-top XUV source could be established as a highly surface sensitive fingerprint method for chemical analysis. Future extended experiments will investigate the silicon L-edge where e.g. silicon oxide interlayers below high-k or other nano-layered material on Sisubstrates depict a technological important group of composite systems.",
keywords = "13.5nm, Carbon K-edge, EUV/XUV, Interface roughness, Lithography, Material analysis, NEXAFS, Silicon L-edge, Soft X-rays, Surface analysis, Thin films, Water window",
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TY - GEN

T1 - XUV metrology

T2 - Damage to VUV, EUV, and X-Ray Optics II

AU - Banyay, M.

AU - Juschkin, L.

AU - Bücker, T.

AU - Loosen, P.

AU - Bayer, A.

AU - Barkusky, F.

AU - Döring, Stefan

AU - Peth, C.

AU - Mann, K.

AU - Blaschke, H.

AU - Balasa, Istvan

AU - Ristau, Detlev

PY - 2009/5/18

Y1 - 2009/5/18

N2 - The utilization of nanostructured materials for modern applications gained more and more importance during the last few years. As examples super-fluorescent quantum dots, the use of carbon nano tubes (CNTs) in microelectronics, electrospun fibers in filter membranes, thin film coatings for solar cells, mirrors or LEDs, semiconductor electronics, and functionalized surfaces may be named to address only a few topics. To optimize the systems and enable the full range of capabilities of nanostructures a thorough characterization of the surface-near topography (e.g. roughness, thickness, lateral dimension) as well as of the chemical composition is essential. As a versatile tool for spatial and chemical characterization XUV reflectometry, scatterometry and diffractometry is proposed. Three different experimental setups have been realized evaluating spectral resolved reflectance under constant incidence angle, angular resolved reflectance at a constant wavelength, or a combined approach using laboratory scaled XUV sources to gain insight into chemical composition, film thickness and surface/interface roughness. Experiments on near-edge X-ray absorption fine structure spectroscopy (NEXAFS) at the carbon K-edge have been performed. The investigated systems range from synthetic polymers (PMMA, PI) over organic substances (humic acids) to biological matter (lipids), delivering unique spectra for each compound. Thus NEXAFS spectroscopy using a table-top XUV source could be established as a highly surface sensitive fingerprint method for chemical analysis. Future extended experiments will investigate the silicon L-edge where e.g. silicon oxide interlayers below high-k or other nano-layered material on Sisubstrates depict a technological important group of composite systems.

AB - The utilization of nanostructured materials for modern applications gained more and more importance during the last few years. As examples super-fluorescent quantum dots, the use of carbon nano tubes (CNTs) in microelectronics, electrospun fibers in filter membranes, thin film coatings for solar cells, mirrors or LEDs, semiconductor electronics, and functionalized surfaces may be named to address only a few topics. To optimize the systems and enable the full range of capabilities of nanostructures a thorough characterization of the surface-near topography (e.g. roughness, thickness, lateral dimension) as well as of the chemical composition is essential. As a versatile tool for spatial and chemical characterization XUV reflectometry, scatterometry and diffractometry is proposed. Three different experimental setups have been realized evaluating spectral resolved reflectance under constant incidence angle, angular resolved reflectance at a constant wavelength, or a combined approach using laboratory scaled XUV sources to gain insight into chemical composition, film thickness and surface/interface roughness. Experiments on near-edge X-ray absorption fine structure spectroscopy (NEXAFS) at the carbon K-edge have been performed. The investigated systems range from synthetic polymers (PMMA, PI) over organic substances (humic acids) to biological matter (lipids), delivering unique spectra for each compound. Thus NEXAFS spectroscopy using a table-top XUV source could be established as a highly surface sensitive fingerprint method for chemical analysis. Future extended experiments will investigate the silicon L-edge where e.g. silicon oxide interlayers below high-k or other nano-layered material on Sisubstrates depict a technological important group of composite systems.

KW - 13.5nm

KW - Carbon K-edge

KW - EUV/XUV

KW - Interface roughness

KW - Lithography

KW - Material analysis

KW - NEXAFS

KW - Silicon L-edge

KW - Soft X-rays

KW - Surface analysis

KW - Thin films

KW - Water window

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DO - 10.1117/12.833648

M3 - Conference contribution

AN - SCOPUS:69949170452

SN - 9780819476357

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Damage to VUV, EUV, and X-Ray Optics II

Y2 - 21 April 2009 through 23 April 2009

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