Details
Originalsprache | Englisch |
---|---|
Aufsatznummer | 31135 |
Fachzeitschrift | Scientific reports |
Jahrgang | 6 |
Publikationsstatus | Veröffentlicht - 10 Aug. 2016 |
Extern publiziert | Ja |
Abstract
Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, without intermediate steps and using the same optical instrument, we perform aligned three-dimensional laser lithography. As a proof of concept, we design, fabricate, and characterize three-dimensional functional waveguide elements on an optical chip. Each element consists of one single-photon emitter centered in a crossed-arc waveguide configuration, allowing for integrated optical excitation and efficient background suppression at the same time.
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in: Scientific reports, Jahrgang 6, 31135, 10.08.2016.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Wiring up pre-characterized single-photon emitters by laser lithography
AU - Shi, Q.
AU - Sontheimer, B.
AU - Nikolay, N.
AU - Schell, A. W.
AU - Fischer, J.
AU - Naber, A.
AU - Benson, O.
AU - Wegener, M.
PY - 2016/8/10
Y1 - 2016/8/10
N2 - Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, without intermediate steps and using the same optical instrument, we perform aligned three-dimensional laser lithography. As a proof of concept, we design, fabricate, and characterize three-dimensional functional waveguide elements on an optical chip. Each element consists of one single-photon emitter centered in a crossed-arc waveguide configuration, allowing for integrated optical excitation and efficient background suppression at the same time.
AB - Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, without intermediate steps and using the same optical instrument, we perform aligned three-dimensional laser lithography. As a proof of concept, we design, fabricate, and characterize three-dimensional functional waveguide elements on an optical chip. Each element consists of one single-photon emitter centered in a crossed-arc waveguide configuration, allowing for integrated optical excitation and efficient background suppression at the same time.
UR - http://www.scopus.com/inward/record.url?scp=84982104106&partnerID=8YFLogxK
U2 - 10.1038/srep31135
DO - 10.1038/srep31135
M3 - Article
AN - SCOPUS:84982104106
VL - 6
JO - Scientific reports
JF - Scientific reports
SN - 2045-2322
M1 - 31135
ER -