When are substrate effects important for on-chip interconnects?

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Autoren

  • M. Faïez Ktata
  • Hartmut Grabinski
  • Gabriel Gad
  • Helmut Fischer

Organisationseinheiten

Externe Organisationen

  • Infineon Technologies AG
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des SammelwerksElectrical Performance of Electronic Packaging
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten265-268
Seitenumfang4
ISBN (elektronisch)0780381289, 9780780381285
PublikationsstatusVeröffentlicht - 2003
VeranstaltungElectrical Performance of Electronic Packaging, 2003 - Princeton, USA / Vereinigte Staaten
Dauer: 27 Okt. 2003 → 29 Okt. 2003

Publikationsreihe

NameElectrical Performance of Electronic Packaging

Abstract

In this paper, we investigate the effects of floating and grounded substrates with different conductivities of 100 S/m (medium) and 10.000 S/m (high) on on-chip interconnections in the frequency range from 1 Hz up to 40 GHz. We show that the frequency dependency of line parameters, especially the inductance and resistance per unit length, depends strongly on whether the substrate is grounded or floating, on the relative position of the ground line with respect to the signal lines, and on the substrate conductivity.

ASJC Scopus Sachgebiete

Zitieren

When are substrate effects important for on-chip interconnects? / Ktata, M. Faïez; Grabinski, Hartmut; Gad, Gabriel et al.
Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. S. 265-268 1250046 (Electrical Performance of Electronic Packaging).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Ktata, MF, Grabinski, H, Gad, G & Fischer, H 2003, When are substrate effects important for on-chip interconnects? in Electrical Performance of Electronic Packaging., 1250046, Electrical Performance of Electronic Packaging, Institute of Electrical and Electronics Engineers Inc., S. 265-268, Electrical Performance of Electronic Packaging, 2003, Princeton, USA / Vereinigte Staaten, 27 Okt. 2003. https://doi.org/10.1109/EPEP.2003.1250046
Ktata, M. F., Grabinski, H., Gad, G., & Fischer, H. (2003). When are substrate effects important for on-chip interconnects? In Electrical Performance of Electronic Packaging (S. 265-268). Artikel 1250046 (Electrical Performance of Electronic Packaging). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.2003.1250046
Ktata MF, Grabinski H, Gad G, Fischer H. When are substrate effects important for on-chip interconnects? in Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc. 2003. S. 265-268. 1250046. (Electrical Performance of Electronic Packaging). doi: 10.1109/EPEP.2003.1250046
Ktata, M. Faïez ; Grabinski, Hartmut ; Gad, Gabriel et al. / When are substrate effects important for on-chip interconnects?. Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers Inc., 2003. S. 265-268 (Electrical Performance of Electronic Packaging).
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