Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 |
| Publikationsstatus | Veröffentlicht - 2010 |
| Veranstaltung | 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 - Bordeaux, Frankreich Dauer: 26 Apr. 2010 → 28 Apr. 2010 |
Publikationsreihe
| Name | 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 |
|---|
Abstract
The technology is standing evolving. As a consequence, the stress the electronic components are submitted to are aggravated; at package and assembly levels, one has to face the densification of internal interconnections (SiP), the juxtaposition of RF, analogue, digital and power blocks and the processes are more aggressive do to the 3rd dimension like in PoP for instance. Reliability issues increase, as for instance thermal gradients or current densities are higher. So the reliability has to be taken into account at the design phase, and virtual prototyping is a good way. In this work reliability tests on bump chains and finite element simulations with 3-dimensional PoP models were carried out. Very good agreement was found between simulations and calculations of the mass flux divergence values due to electromigration and measurements und thermal loads concerning the failure sites. The maximum current crowding and electromigration mass flux was found in the via-in-pad of the bottom bumps.
ASJC Scopus Sachgebiete
- Informatik (insg.)
- Theoretische Informatik und Mathematik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Mathematik (insg.)
- Theoretische Informatik
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- BibTex
- RIS
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. 5464618 (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Virtual prototyping of PoP interconnections regarding electrically activated mechanisms
AU - Meinshausen, L.
AU - Weide-Zaage, K.
AU - Frémont, H.
AU - Feng, W.
N1 - Copyright: Copyright 2010 Elsevier B.V., All rights reserved.
PY - 2010
Y1 - 2010
N2 - The technology is standing evolving. As a consequence, the stress the electronic components are submitted to are aggravated; at package and assembly levels, one has to face the densification of internal interconnections (SiP), the juxtaposition of RF, analogue, digital and power blocks and the processes are more aggressive do to the 3rd dimension like in PoP for instance. Reliability issues increase, as for instance thermal gradients or current densities are higher. So the reliability has to be taken into account at the design phase, and virtual prototyping is a good way. In this work reliability tests on bump chains and finite element simulations with 3-dimensional PoP models were carried out. Very good agreement was found between simulations and calculations of the mass flux divergence values due to electromigration and measurements und thermal loads concerning the failure sites. The maximum current crowding and electromigration mass flux was found in the via-in-pad of the bottom bumps.
AB - The technology is standing evolving. As a consequence, the stress the electronic components are submitted to are aggravated; at package and assembly levels, one has to face the densification of internal interconnections (SiP), the juxtaposition of RF, analogue, digital and power blocks and the processes are more aggressive do to the 3rd dimension like in PoP for instance. Reliability issues increase, as for instance thermal gradients or current densities are higher. So the reliability has to be taken into account at the design phase, and virtual prototyping is a good way. In this work reliability tests on bump chains and finite element simulations with 3-dimensional PoP models were carried out. Very good agreement was found between simulations and calculations of the mass flux divergence values due to electromigration and measurements und thermal loads concerning the failure sites. The maximum current crowding and electromigration mass flux was found in the via-in-pad of the bottom bumps.
UR - http://www.scopus.com/inward/record.url?scp=77953690708&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2010.5464618
DO - 10.1109/ESIME.2010.5464618
M3 - Conference contribution
AN - SCOPUS:77953690708
SN - 9781424470266
T3 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
BT - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
T2 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Y2 - 26 April 2010 through 28 April 2010
ER -