Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 257-262 |
| Seitenumfang | 6 |
| ISBN (elektronisch) | 3952119938, 9783952119938 |
| Publikationsstatus | Veröffentlicht - 16 Feb. 1999 |
| Veranstaltung | 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999 - Zurich, Schweiz Dauer: 16 Feb. 1999 → 18 Feb. 1999 |
Publikationsreihe
| Name | 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999 |
|---|
Abstract
This paper deals with a coupling of the calculation method using the Multiconductor Transmission Line (MTL) equation and the Method of Moments (MoM). An algorithm base on a single-wire TL and MoM presented in [1] was extended by use of MTL to account for more realistic structures such as multiple coupled lines, e.g. bus structures, cable bundles etc. For a reasonable application it is nessesary to divide the disposition into parts calculated either by MTL or MoM depending on the geometry. The coupling of the methods is then considered by an iterative algorithm which utilizes an integral for the electrical field strength. The hybrid method is used to calculate the currents and electromagnetic fields of a PCB. It is shown that the results are in close agreement to the measured values of the PCB.
ASJC Scopus Sachgebiete
- Energie (insg.)
- Energieanlagenbau und Kraftwerkstechnik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Mathematik (insg.)
- Computational Mathematics
- Physik und Astronomie (insg.)
- Instrumentierung
- Physik und Astronomie (insg.)
- Strahlung
- Sozialwissenschaften (insg.)
- Sicherheitsforschung
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- BibTex
- RIS
13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999. Institute of Electrical and Electronics Engineers Inc., 1999. S. 257-262 (13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Validation of a Hybrid MoM-MTL Method Calculating Complex Structures on PCBs
AU - Kralicek, P.
AU - Sabath, F.
AU - Garbe, H.
PY - 1999/2/16
Y1 - 1999/2/16
N2 - This paper deals with a coupling of the calculation method using the Multiconductor Transmission Line (MTL) equation and the Method of Moments (MoM). An algorithm base on a single-wire TL and MoM presented in [1] was extended by use of MTL to account for more realistic structures such as multiple coupled lines, e.g. bus structures, cable bundles etc. For a reasonable application it is nessesary to divide the disposition into parts calculated either by MTL or MoM depending on the geometry. The coupling of the methods is then considered by an iterative algorithm which utilizes an integral for the electrical field strength. The hybrid method is used to calculate the currents and electromagnetic fields of a PCB. It is shown that the results are in close agreement to the measured values of the PCB.
AB - This paper deals with a coupling of the calculation method using the Multiconductor Transmission Line (MTL) equation and the Method of Moments (MoM). An algorithm base on a single-wire TL and MoM presented in [1] was extended by use of MTL to account for more realistic structures such as multiple coupled lines, e.g. bus structures, cable bundles etc. For a reasonable application it is nessesary to divide the disposition into parts calculated either by MTL or MoM depending on the geometry. The coupling of the methods is then considered by an iterative algorithm which utilizes an integral for the electrical field strength. The hybrid method is used to calculate the currents and electromagnetic fields of a PCB. It is shown that the results are in close agreement to the measured values of the PCB.
UR - http://www.scopus.com/inward/record.url?scp=85215503962&partnerID=8YFLogxK
U2 - 10.23919/EMC.1999.10791613
DO - 10.23919/EMC.1999.10791613
M3 - Conference contribution
AN - SCOPUS:85215503962
T3 - 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999
SP - 257
EP - 262
BT - 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999
Y2 - 16 February 1999 through 18 February 1999
ER -