Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | High-Power Laser Materials Processing |
| Untertitel | Lasers, Beam Delivery, Diagnostics, and Applications V |
| Herausgeber/-innen | Stefan Kaierle, Friedhelm Dorsch |
| Herausgeber (Verlag) | SPIE |
| ISBN (elektronisch) | 9781628419764 |
| Publikationsstatus | Veröffentlicht - 24 März 2016 |
| Veranstaltung | High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications V - San Francisco, USA / Vereinigte Staaten Dauer: 16 Feb. 2016 → 18 Feb. 2016 |
Publikationsreihe
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Band | 9741 |
| ISSN (Print) | 0277-786X |
| ISSN (elektronisch) | 1996-756X |
Abstract
Transparent polymers with low glass transition temperatures are flexible materials and can serve as an optical waveguide or as substrates for the layer structure in applications such as humidity or temperature sensors. The background of this publication is the development of a laser-based process to bond silicon chips, which serve as emitter or detector in an optical system, on a substrate, without exposing the substrate to thermo-mechanical stress. Using transmission laser bonding of low-melting eutectic alloys, the necessary energy can be coupled into the fusion zone precisely to reduce the process time. In this paper, Si-chips with 52In48Sn and 66In34Bi layers are investigated to bond on rigid substrates. Experimental results are presented, which illustrate the mechanical stability of these compounds.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Informatik (insg.)
- Angewandte Informatik
- Mathematik (insg.)
- Angewandte Mathematik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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- BibTex
- RIS
High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications V. Hrsg. / Stefan Kaierle; Friedhelm Dorsch. SPIE, 2016. 97410K (Proceedings of SPIE - The International Society for Optical Engineering; Band 9741).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Transmission laser bonding of low melting eutectic alloys
AU - Hoff, C.
AU - Cromwell, K.
AU - Hermsdorf, J.
AU - Akin, M.
AU - Wurz, M. C.
AU - Kaierle, S.
AU - Maier, H. J.
AU - Overmeyer, L.
PY - 2016/3/24
Y1 - 2016/3/24
N2 - Transparent polymers with low glass transition temperatures are flexible materials and can serve as an optical waveguide or as substrates for the layer structure in applications such as humidity or temperature sensors. The background of this publication is the development of a laser-based process to bond silicon chips, which serve as emitter or detector in an optical system, on a substrate, without exposing the substrate to thermo-mechanical stress. Using transmission laser bonding of low-melting eutectic alloys, the necessary energy can be coupled into the fusion zone precisely to reduce the process time. In this paper, Si-chips with 52In48Sn and 66In34Bi layers are investigated to bond on rigid substrates. Experimental results are presented, which illustrate the mechanical stability of these compounds.
AB - Transparent polymers with low glass transition temperatures are flexible materials and can serve as an optical waveguide or as substrates for the layer structure in applications such as humidity or temperature sensors. The background of this publication is the development of a laser-based process to bond silicon chips, which serve as emitter or detector in an optical system, on a substrate, without exposing the substrate to thermo-mechanical stress. Using transmission laser bonding of low-melting eutectic alloys, the necessary energy can be coupled into the fusion zone precisely to reduce the process time. In this paper, Si-chips with 52In48Sn and 66In34Bi layers are investigated to bond on rigid substrates. Experimental results are presented, which illustrate the mechanical stability of these compounds.
KW - Eutectic alloys
KW - Transmission laser bonding
UR - http://www.scopus.com/inward/record.url?scp=84974687886&partnerID=8YFLogxK
U2 - 10.1117/12.2230399
DO - 10.1117/12.2230399
M3 - Conference contribution
AN - SCOPUS:84974687886
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - High-Power Laser Materials Processing
A2 - Kaierle, Stefan
A2 - Dorsch, Friedhelm
PB - SPIE
T2 - High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications V
Y2 - 16 February 2016 through 18 February 2016
ER -