Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 |
| Publikationsstatus | Veröffentlicht - 2012 |
| Veranstaltung | 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 - Cascais, Portugal Dauer: 16 Apr. 2012 → 18 Apr. 2012 |
Publikationsreihe
| Name | 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 |
|---|
Abstract
In mobile electronic devices an increasing number of functions have to be placed on a limited space. The stacking of ICs and packages becomes more and more common. A rising number of contacts on the same foot print leads to higher current densities and may conduct to electromigration induced reliability problems. Migration processes are strongly temperature depended. Therefore the thermal management within IC packages becomes more important to ensure an appropriate lifetime. The existence of heat sources in a package changes the temperature distribution and the values of the correlated mass flux and mass flux divergences due to electromigration. For this work the electromigration induced mass flux divergences in SAC305 solder joints for stackable packages were investigated by using the finite element software ANSYS® and a user routine. For the finite element simulation a structure of two stacked packages including a top package with two, four, six or eight stacked ICs were modelled. Two different scenarios were considered: firstly the total power loss of 2W was independent of the number of ICs. Secondly every single IC had a power loss of 222mW.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Mathematik (insg.)
- Modellierung und Simulation
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2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012. 2012. 6191700 (2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Thermal management for stackable packages with stacked ICs
AU - Meinshausen, L.
AU - Weide-Zaage, K.
AU - Frémont, H.
N1 - Copyright: Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2012
Y1 - 2012
N2 - In mobile electronic devices an increasing number of functions have to be placed on a limited space. The stacking of ICs and packages becomes more and more common. A rising number of contacts on the same foot print leads to higher current densities and may conduct to electromigration induced reliability problems. Migration processes are strongly temperature depended. Therefore the thermal management within IC packages becomes more important to ensure an appropriate lifetime. The existence of heat sources in a package changes the temperature distribution and the values of the correlated mass flux and mass flux divergences due to electromigration. For this work the electromigration induced mass flux divergences in SAC305 solder joints for stackable packages were investigated by using the finite element software ANSYS® and a user routine. For the finite element simulation a structure of two stacked packages including a top package with two, four, six or eight stacked ICs were modelled. Two different scenarios were considered: firstly the total power loss of 2W was independent of the number of ICs. Secondly every single IC had a power loss of 222mW.
AB - In mobile electronic devices an increasing number of functions have to be placed on a limited space. The stacking of ICs and packages becomes more and more common. A rising number of contacts on the same foot print leads to higher current densities and may conduct to electromigration induced reliability problems. Migration processes are strongly temperature depended. Therefore the thermal management within IC packages becomes more important to ensure an appropriate lifetime. The existence of heat sources in a package changes the temperature distribution and the values of the correlated mass flux and mass flux divergences due to electromigration. For this work the electromigration induced mass flux divergences in SAC305 solder joints for stackable packages were investigated by using the finite element software ANSYS® and a user routine. For the finite element simulation a structure of two stacked packages including a top package with two, four, six or eight stacked ICs were modelled. Two different scenarios were considered: firstly the total power loss of 2W was independent of the number of ICs. Secondly every single IC had a power loss of 222mW.
UR - http://www.scopus.com/inward/record.url?scp=84861413639&partnerID=8YFLogxK
U2 - 10.1109/ESimE.2012.6191700
DO - 10.1109/ESimE.2012.6191700
M3 - Conference contribution
AN - SCOPUS:84861413639
SN - 9781467315128
T3 - 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
BT - 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
T2 - 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
Y2 - 16 April 2012 through 18 April 2012
ER -