The interrelationship between wood temperature, wood moisture content, and fungal decay in the field

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Christian Brischke
  • Andreas O. Rapp
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Details

OriginalspracheEnglisch
Titel des Sammelwerks19th International Scientific Conference
UntertitelWood is Good - Properties, Technology, Valorisation, Application, Proceedings
Herausgeber/-innenIvica Grbac, Vlatka Jirous-Rajkovic
Seiten113-120
Seitenumfang8
ISBN (elektronisch)9532920048, 9789532920048
PublikationsstatusVeröffentlicht - 17 Okt. 2008
Veranstaltung19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application - Zagreb, Kroatien
Dauer: 17 Okt. 200817 Okt. 2008

Publikationsreihe

Name19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings

Abstract

Scots pine sapwood (Pinus sylvestris L.) and Douglas fir heartwood (Pseudotsuga menziesii Franco) specimens were exposed in double layer field trials at 23 different European test sites under different exposure conditions (in total 27 test sets). The material climate in terms of wood moisture content (MC) and wood temperature was automatically monitored over a period of up to seven years and compared with the progress of decay. The overall aim of this study was to establish dose-response relationships between climate factors and decay as a basis for service life prediction of wood. The use of the combined material climatic parameters MC and wood temperature led to a feasible dose-response function and turned out to be a useful basis for service life prediction of wood.

ASJC Scopus Sachgebiete

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The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. / Brischke, Christian; Rapp, Andreas O.
19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings. Hrsg. / Ivica Grbac; Vlatka Jirous-Rajkovic. 2008. S. 113-120 (19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Brischke, C & Rapp, AO 2008, The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. in I Grbac & V Jirous-Rajkovic (Hrsg.), 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings. 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings, S. 113-120, 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Zagreb, Kroatien, 17 Okt. 2008.
Brischke, C., & Rapp, A. O. (2008). The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. In I. Grbac, & V. Jirous-Rajkovic (Hrsg.), 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings (S. 113-120). (19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings).
Brischke C, Rapp AO. The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. in Grbac I, Jirous-Rajkovic V, Hrsg., 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings. 2008. S. 113-120. (19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings).
Brischke, Christian ; Rapp, Andreas O. / The interrelationship between wood temperature, wood moisture content, and fungal decay in the field. 19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings. Hrsg. / Ivica Grbac ; Vlatka Jirous-Rajkovic. 2008. S. 113-120 (19th International Scientific Conference: Wood is Good - Properties, Technology, Valorisation, Application, Proceedings).
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title = "The interrelationship between wood temperature, wood moisture content, and fungal decay in the field",
abstract = "Scots pine sapwood (Pinus sylvestris L.) and Douglas fir heartwood (Pseudotsuga menziesii Franco) specimens were exposed in double layer field trials at 23 different European test sites under different exposure conditions (in total 27 test sets). The material climate in terms of wood moisture content (MC) and wood temperature was automatically monitored over a period of up to seven years and compared with the progress of decay. The overall aim of this study was to establish dose-response relationships between climate factors and decay as a basis for service life prediction of wood. The use of the combined material climatic parameters MC and wood temperature led to a feasible dose-response function and turned out to be a useful basis for service life prediction of wood.",
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