TY - JOUR

T1 - The fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model for homogeneous and heterogeneous materials

AU - Bie, Yehui

AU - Ren, Huilong

AU - Rabczuk, Timon

AU - Quoc Bui, Tinh

AU - Wei, Yueguang

N1 - Funding Information: This work is supported by the National Natural Science Foundation of China (Grant nos. 11890681, 12032001 and 11521202 ).

PY - 2024/2/15

Y1 - 2024/2/15

N2 - To accurately address the thermally induced dynamic and steady-state crack propagation problems for homogeneous and heterogeneous materials involving crack branching, interfacial de-bonding and crack kinking, we propose the fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model (TM-DHPD). To this end, the integral coupled equations for TM-DHPD are firstly derived within the framework of thermodynamics. And then, the alternative dual-horizon peridynamic correspondence principle is used to derive the constitutive bond force state, heat flow state and their general linearizations. Moreover, the unified criterion for bond damage is proposed to characterize the internal bond damage in a single material and the interface bond damage in dissimilar materials. To ensure convergence and accuracy, the coupled equations are solved using the standard implicit method without the use of artificial damping. In both homogeneous and heterogeneous materials, some representative and challenging numerical cases are examined, such as dynamic crack branching in a centrally heated disk and multiple interface failure of thermal barrier coating. The numerical results are in good agreement with the available experimental results or the previous predictions, which shows the great potential of the proposed TM-DHPD in addressing the physics of numerous thermally induced fractures in the real-world engineering problems.

AB - To accurately address the thermally induced dynamic and steady-state crack propagation problems for homogeneous and heterogeneous materials involving crack branching, interfacial de-bonding and crack kinking, we propose the fully coupled thermo-mechanical dual-horizon peridynamic correspondence damage model (TM-DHPD). To this end, the integral coupled equations for TM-DHPD are firstly derived within the framework of thermodynamics. And then, the alternative dual-horizon peridynamic correspondence principle is used to derive the constitutive bond force state, heat flow state and their general linearizations. Moreover, the unified criterion for bond damage is proposed to characterize the internal bond damage in a single material and the interface bond damage in dissimilar materials. To ensure convergence and accuracy, the coupled equations are solved using the standard implicit method without the use of artificial damping. In both homogeneous and heterogeneous materials, some representative and challenging numerical cases are examined, such as dynamic crack branching in a centrally heated disk and multiple interface failure of thermal barrier coating. The numerical results are in good agreement with the available experimental results or the previous predictions, which shows the great potential of the proposed TM-DHPD in addressing the physics of numerous thermally induced fractures in the real-world engineering problems.

KW - Crack branching

KW - Heterogeneous materials

KW - Interfacial de-bonding

KW - Peridynamics

KW - Thermally induced fractures

UR - http://www.scopus.com/inward/record.url?scp=85181168096&partnerID=8YFLogxK

U2 - 10.1016/j.cma.2023.116730

DO - 10.1016/j.cma.2023.116730

M3 - Article

AN - SCOPUS:85181168096

VL - 420

JO - Computer Methods in Applied Mechanics and Engineering

JF - Computer Methods in Applied Mechanics and Engineering

SN - 0045-7825

M1 - 116730

ER -