Strain relaxation of thin Ge films on Si(001) grown by carbon-mediated epitaxy

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • D. Tetzlaff
  • T. F. Wietler
  • E. Bugiel
  • H. J. Osten
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Details

OriginalspracheEnglisch
Seiten (von - bis)254-258
Seitenumfang5
FachzeitschriftJournal of crystal growth
Jahrgang378
Frühes Online-Datum3 Jan. 2013
PublikationsstatusVeröffentlicht - 1 Sept. 2013

Abstract

Strain relaxation of thin Ge layers grown by carbon-mediated epitaxy at 50 °C on Si(001) was investigated for a multi-step growth procedure. Additionally, the impact of the post-growth annealing temperature on the strain relaxation obtained for a single carbon-mediated growth step was analyzed. The degree of relaxation was monitored in situ by reflection high energy electron diffraction and ex situ by high-resolution x-ray diffraction and transmission electron microscopy. For multi-step growth, relaxation occurs mainly during the first cycle (growth and annealing). Full relaxation is already achieved after 3-4 cycles. The relaxation process during a single growth cycle can be divided into three sections: annealing up to 200 °C is sufficient to trigger most of the strain relaxation. After annealing up to 450 °C, the film lattice parameter already equals the Ge bulk value, though the layer shows a rough surface. Only an annealing step up to 650 °C results in a smooth surface and interface. Smooth and fully relaxed Ge films of only 26 nm thicknesses were obtained by carbon-mediated growth.

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Strain relaxation of thin Ge films on Si(001) grown by carbon-mediated epitaxy. / Tetzlaff, D.; Wietler, T. F.; Bugiel, E. et al.
in: Journal of crystal growth, Jahrgang 378, 01.09.2013, S. 254-258.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Tetzlaff D, Wietler TF, Bugiel E, Osten HJ. Strain relaxation of thin Ge films on Si(001) grown by carbon-mediated epitaxy. Journal of crystal growth. 2013 Sep 1;378:254-258. Epub 2013 Jan 3. doi: 10.1016/j.jcrysgro.2012.12.087
Tetzlaff, D. ; Wietler, T. F. ; Bugiel, E. et al. / Strain relaxation of thin Ge films on Si(001) grown by carbon-mediated epitaxy. in: Journal of crystal growth. 2013 ; Jahrgang 378. S. 254-258.
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abstract = "Strain relaxation of thin Ge layers grown by carbon-mediated epitaxy at 50 °C on Si(001) was investigated for a multi-step growth procedure. Additionally, the impact of the post-growth annealing temperature on the strain relaxation obtained for a single carbon-mediated growth step was analyzed. The degree of relaxation was monitored in situ by reflection high energy electron diffraction and ex situ by high-resolution x-ray diffraction and transmission electron microscopy. For multi-step growth, relaxation occurs mainly during the first cycle (growth and annealing). Full relaxation is already achieved after 3-4 cycles. The relaxation process during a single growth cycle can be divided into three sections: annealing up to 200 °C is sufficient to trigger most of the strain relaxation. After annealing up to 450 °C, the film lattice parameter already equals the Ge bulk value, though the layer shows a rough surface. Only an annealing step up to 650 °C results in a smooth surface and interface. Smooth and fully relaxed Ge films of only 26 nm thicknesses were obtained by carbon-mediated growth.",
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AU - Tetzlaff, D.

AU - Wietler, T. F.

AU - Bugiel, E.

AU - Osten, H. J.

PY - 2013/9/1

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N2 - Strain relaxation of thin Ge layers grown by carbon-mediated epitaxy at 50 °C on Si(001) was investigated for a multi-step growth procedure. Additionally, the impact of the post-growth annealing temperature on the strain relaxation obtained for a single carbon-mediated growth step was analyzed. The degree of relaxation was monitored in situ by reflection high energy electron diffraction and ex situ by high-resolution x-ray diffraction and transmission electron microscopy. For multi-step growth, relaxation occurs mainly during the first cycle (growth and annealing). Full relaxation is already achieved after 3-4 cycles. The relaxation process during a single growth cycle can be divided into three sections: annealing up to 200 °C is sufficient to trigger most of the strain relaxation. After annealing up to 450 °C, the film lattice parameter already equals the Ge bulk value, though the layer shows a rough surface. Only an annealing step up to 650 °C results in a smooth surface and interface. Smooth and fully relaxed Ge films of only 26 nm thicknesses were obtained by carbon-mediated growth.

AB - Strain relaxation of thin Ge layers grown by carbon-mediated epitaxy at 50 °C on Si(001) was investigated for a multi-step growth procedure. Additionally, the impact of the post-growth annealing temperature on the strain relaxation obtained for a single carbon-mediated growth step was analyzed. The degree of relaxation was monitored in situ by reflection high energy electron diffraction and ex situ by high-resolution x-ray diffraction and transmission electron microscopy. For multi-step growth, relaxation occurs mainly during the first cycle (growth and annealing). Full relaxation is already achieved after 3-4 cycles. The relaxation process during a single growth cycle can be divided into three sections: annealing up to 200 °C is sufficient to trigger most of the strain relaxation. After annealing up to 450 °C, the film lattice parameter already equals the Ge bulk value, though the layer shows a rough surface. Only an annealing step up to 650 °C results in a smooth surface and interface. Smooth and fully relaxed Ge films of only 26 nm thicknesses were obtained by carbon-mediated growth.

KW - Characterization

KW - Diffraction

KW - Molecular beam epitaxy

KW - Reflection high energy electron

KW - Semiconducting germanium

KW - Stresses

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