Stability of crystalline Gd2O3 thin films on silicon during post-growth processing

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • D. Schwendt
  • D. Tetzlaff
  • E. Bugiel
  • H. J. Osten
  • H. D.B. Gottlob

Externe Organisationen

  • AMO GmbH
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks3rd International Conference on Signals, Circuits and Systems, SCS 2009
PublikationsstatusVeröffentlicht - 2009
Veranstaltung3rd International Conference on Signals, Circuits and Systems, SCS 2009 - Medenine, Tunesien
Dauer: 6 Nov. 20098 Nov. 2009

Publikationsreihe

Name3rd International Conference on Signals, Circuits and Systems, SCS 2009

Abstract

Experimental results for crystalline Gd2O3-based MOS capacitors show that these layers are excellent candidates for application as very thin high-K materials replacing SiO2 in future MOS devices. First electrical characteristics of n- and ptype SOI-MOSFETs with epitaxial Gd2O3 demonstrate the general feasibility of this novel gate insulator, but thermal stability during typical CMOS annealing processes has been identified as a key issue. Here, we investigate the effect of postgrowth annealing on layer properties. Standard forming gas anneal can eliminate flatband instabilities and hysteresis as well as reduce leakage currents by saturating dangling bond caused by the bonding mismatch. In addition, we investigated the impact of rapid thermal anneals on structural and electrical properties of crystalline Gd2O3 layers grown on Si. Finally, we will show a new way to improve the thermal stability of those crystalline layers significantly.

ASJC Scopus Sachgebiete

Zitieren

Stability of crystalline Gd2O3 thin films on silicon during post-growth processing. / Schwendt, D.; Tetzlaff, D.; Bugiel, E. et al.
3rd International Conference on Signals, Circuits and Systems, SCS 2009. 2009. 5414206 (3rd International Conference on Signals, Circuits and Systems, SCS 2009).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Schwendt, D, Tetzlaff, D, Bugiel, E, Osten, HJ & Gottlob, HDB 2009, Stability of crystalline Gd2O3 thin films on silicon during post-growth processing. in 3rd International Conference on Signals, Circuits and Systems, SCS 2009., 5414206, 3rd International Conference on Signals, Circuits and Systems, SCS 2009, 3rd International Conference on Signals, Circuits and Systems, SCS 2009, Medenine, Tunesien, 6 Nov. 2009. https://doi.org/10.1109/ICSCS.2009.5414206
Schwendt, D., Tetzlaff, D., Bugiel, E., Osten, H. J., & Gottlob, H. D. B. (2009). Stability of crystalline Gd2O3 thin films on silicon during post-growth processing. In 3rd International Conference on Signals, Circuits and Systems, SCS 2009 Artikel 5414206 (3rd International Conference on Signals, Circuits and Systems, SCS 2009). https://doi.org/10.1109/ICSCS.2009.5414206
Schwendt D, Tetzlaff D, Bugiel E, Osten HJ, Gottlob HDB. Stability of crystalline Gd2O3 thin films on silicon during post-growth processing. in 3rd International Conference on Signals, Circuits and Systems, SCS 2009. 2009. 5414206. (3rd International Conference on Signals, Circuits and Systems, SCS 2009). doi: 10.1109/ICSCS.2009.5414206
Schwendt, D. ; Tetzlaff, D. ; Bugiel, E. et al. / Stability of crystalline Gd2O3 thin films on silicon during post-growth processing. 3rd International Conference on Signals, Circuits and Systems, SCS 2009. 2009. (3rd International Conference on Signals, Circuits and Systems, SCS 2009).
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@inproceedings{30d49261306c41458771634484b4470b,
title = "Stability of crystalline Gd2O3 thin films on silicon during post-growth processing",
abstract = "Experimental results for crystalline Gd2O3-based MOS capacitors show that these layers are excellent candidates for application as very thin high-K materials replacing SiO2 in future MOS devices. First electrical characteristics of n- and ptype SOI-MOSFETs with epitaxial Gd2O3 demonstrate the general feasibility of this novel gate insulator, but thermal stability during typical CMOS annealing processes has been identified as a key issue. Here, we investigate the effect of postgrowth annealing on layer properties. Standard forming gas anneal can eliminate flatband instabilities and hysteresis as well as reduce leakage currents by saturating dangling bond caused by the bonding mismatch. In addition, we investigated the impact of rapid thermal anneals on structural and electrical properties of crystalline Gd2O3 layers grown on Si. Finally, we will show a new way to improve the thermal stability of those crystalline layers significantly.",
keywords = "Forming gas anneal, Gadolinium oxide, Gadolinium silicate, High-k dielectrics, Temperature stability",
author = "D. Schwendt and D. Tetzlaff and E. Bugiel and Osten, {H. J.} and Gottlob, {H. D.B.}",
year = "2009",
doi = "10.1109/ICSCS.2009.5414206",
language = "English",
isbn = "9781424443987",
series = "3rd International Conference on Signals, Circuits and Systems, SCS 2009",
booktitle = "3rd International Conference on Signals, Circuits and Systems, SCS 2009",
note = "3rd International Conference on Signals, Circuits and Systems, SCS 2009 ; Conference date: 06-11-2009 Through 08-11-2009",

}

Download

TY - GEN

T1 - Stability of crystalline Gd2O3 thin films on silicon during post-growth processing

AU - Schwendt, D.

AU - Tetzlaff, D.

AU - Bugiel, E.

AU - Osten, H. J.

AU - Gottlob, H. D.B.

PY - 2009

Y1 - 2009

N2 - Experimental results for crystalline Gd2O3-based MOS capacitors show that these layers are excellent candidates for application as very thin high-K materials replacing SiO2 in future MOS devices. First electrical characteristics of n- and ptype SOI-MOSFETs with epitaxial Gd2O3 demonstrate the general feasibility of this novel gate insulator, but thermal stability during typical CMOS annealing processes has been identified as a key issue. Here, we investigate the effect of postgrowth annealing on layer properties. Standard forming gas anneal can eliminate flatband instabilities and hysteresis as well as reduce leakage currents by saturating dangling bond caused by the bonding mismatch. In addition, we investigated the impact of rapid thermal anneals on structural and electrical properties of crystalline Gd2O3 layers grown on Si. Finally, we will show a new way to improve the thermal stability of those crystalline layers significantly.

AB - Experimental results for crystalline Gd2O3-based MOS capacitors show that these layers are excellent candidates for application as very thin high-K materials replacing SiO2 in future MOS devices. First electrical characteristics of n- and ptype SOI-MOSFETs with epitaxial Gd2O3 demonstrate the general feasibility of this novel gate insulator, but thermal stability during typical CMOS annealing processes has been identified as a key issue. Here, we investigate the effect of postgrowth annealing on layer properties. Standard forming gas anneal can eliminate flatband instabilities and hysteresis as well as reduce leakage currents by saturating dangling bond caused by the bonding mismatch. In addition, we investigated the impact of rapid thermal anneals on structural and electrical properties of crystalline Gd2O3 layers grown on Si. Finally, we will show a new way to improve the thermal stability of those crystalline layers significantly.

KW - Forming gas anneal

KW - Gadolinium oxide

KW - Gadolinium silicate

KW - High-k dielectrics

KW - Temperature stability

UR - http://www.scopus.com/inward/record.url?scp=77951496267&partnerID=8YFLogxK

U2 - 10.1109/ICSCS.2009.5414206

DO - 10.1109/ICSCS.2009.5414206

M3 - Conference contribution

AN - SCOPUS:77951496267

SN - 9781424443987

T3 - 3rd International Conference on Signals, Circuits and Systems, SCS 2009

BT - 3rd International Conference on Signals, Circuits and Systems, SCS 2009

T2 - 3rd International Conference on Signals, Circuits and Systems, SCS 2009

Y2 - 6 November 2009 through 8 November 2009

ER -