Stability and transport properties of microcrystalline Si1-xGex films

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • F. Edelman
  • T. Raz
  • Y. Komem
  • M. Stölzer
  • P. Werner
  • P. Zaumseil
  • H. J. Osten
  • J. Griesche
  • M. Capitan

Externe Organisationen

  • Technion-Israel Institute of Technology
  • Martin-Luther-Universität Halle-Wittenberg
  • Max-Planck-Institut für Mikrostrukturphysik
  • Leibniz-Institut für innovative Mikroelektronik (IHP)
  • European Synchrotron Radiation Facility
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Seiten (von - bis)152-157
Seitenumfang6
FachzeitschriftTHIN SOLID FILMS
Jahrgang337
Ausgabenummer1-2
PublikationsstatusVeröffentlicht - 11 Jan. 1999
Extern publiziertJa

Abstract

The crystallization evolution of boron and phosphorus doped amorphous Si1-xGex films (5 × 1017 -5 × 1020 cm-3), deposited on SiO2/ Si(001) substrates by molecular beam in high vacuum at room temperature, were studied by XRD, TEM and SEM. The amorphous Si1-xGex films were fully crystallized at ∼600°C. Up to 800°C no morphology changes were observed. Between 800 and 950°C, voids and hillocks were gradually developed in the films, which consequently collapsed. The Hall concentration and mobility were characterized in the Si1-xGex films, annealed between 600 and 800°C. The mobility and conductivity of p-Si0.5Ge0.5 films at room temperature were found to be relative high: 60 cm2/V s and 2000 (Ω cm)-1, respectively.

ASJC Scopus Sachgebiete

Zitieren

Stability and transport properties of microcrystalline Si1-xGex films. / Edelman, F.; Raz, T.; Komem, Y. et al.
in: THIN SOLID FILMS, Jahrgang 337, Nr. 1-2, 11.01.1999, S. 152-157.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Edelman, F, Raz, T, Komem, Y, Stölzer, M, Werner, P, Zaumseil, P, Osten, HJ, Griesche, J & Capitan, M 1999, 'Stability and transport properties of microcrystalline Si1-xGex films', THIN SOLID FILMS, Jg. 337, Nr. 1-2, S. 152-157. https://doi.org/10.1016/S0040-6090(98)01378-9
Edelman, F., Raz, T., Komem, Y., Stölzer, M., Werner, P., Zaumseil, P., Osten, H. J., Griesche, J., & Capitan, M. (1999). Stability and transport properties of microcrystalline Si1-xGex films. THIN SOLID FILMS, 337(1-2), 152-157. https://doi.org/10.1016/S0040-6090(98)01378-9
Edelman F, Raz T, Komem Y, Stölzer M, Werner P, Zaumseil P et al. Stability and transport properties of microcrystalline Si1-xGex films. THIN SOLID FILMS. 1999 Jan 11;337(1-2):152-157. doi: 10.1016/S0040-6090(98)01378-9
Edelman, F. ; Raz, T. ; Komem, Y. et al. / Stability and transport properties of microcrystalline Si1-xGex films. in: THIN SOLID FILMS. 1999 ; Jahrgang 337, Nr. 1-2. S. 152-157.
Download
@article{b6c0b438e65a4190a4da6dd3c6afc733,
title = "Stability and transport properties of microcrystalline Si1-xGex films",
abstract = "The crystallization evolution of boron and phosphorus doped amorphous Si1-xGex films (5 × 1017 -5 × 1020 cm-3), deposited on SiO2/ Si(001) substrates by molecular beam in high vacuum at room temperature, were studied by XRD, TEM and SEM. The amorphous Si1-xGex films were fully crystallized at ∼600°C. Up to 800°C no morphology changes were observed. Between 800 and 950°C, voids and hillocks were gradually developed in the films, which consequently collapsed. The Hall concentration and mobility were characterized in the Si1-xGex films, annealed between 600 and 800°C. The mobility and conductivity of p-Si0.5Ge0.5 films at room temperature were found to be relative high: 60 cm2/V s and 2000 (Ω cm)-1, respectively.",
keywords = "Crystallization, Electron transport, Hillocks, Silicon-germanium films, X-ray diffraction",
author = "F. Edelman and T. Raz and Y. Komem and M. St{\"o}lzer and P. Werner and P. Zaumseil and Osten, {H. J.} and J. Griesche and M. Capitan",
year = "1999",
month = jan,
day = "11",
doi = "10.1016/S0040-6090(98)01378-9",
language = "English",
volume = "337",
pages = "152--157",
journal = "THIN SOLID FILMS",
issn = "0040-6090",
publisher = "Elsevier",
number = "1-2",

}

Download

TY - JOUR

T1 - Stability and transport properties of microcrystalline Si1-xGex films

AU - Edelman, F.

AU - Raz, T.

AU - Komem, Y.

AU - Stölzer, M.

AU - Werner, P.

AU - Zaumseil, P.

AU - Osten, H. J.

AU - Griesche, J.

AU - Capitan, M.

PY - 1999/1/11

Y1 - 1999/1/11

N2 - The crystallization evolution of boron and phosphorus doped amorphous Si1-xGex films (5 × 1017 -5 × 1020 cm-3), deposited on SiO2/ Si(001) substrates by molecular beam in high vacuum at room temperature, were studied by XRD, TEM and SEM. The amorphous Si1-xGex films were fully crystallized at ∼600°C. Up to 800°C no morphology changes were observed. Between 800 and 950°C, voids and hillocks were gradually developed in the films, which consequently collapsed. The Hall concentration and mobility were characterized in the Si1-xGex films, annealed between 600 and 800°C. The mobility and conductivity of p-Si0.5Ge0.5 films at room temperature were found to be relative high: 60 cm2/V s and 2000 (Ω cm)-1, respectively.

AB - The crystallization evolution of boron and phosphorus doped amorphous Si1-xGex films (5 × 1017 -5 × 1020 cm-3), deposited on SiO2/ Si(001) substrates by molecular beam in high vacuum at room temperature, were studied by XRD, TEM and SEM. The amorphous Si1-xGex films were fully crystallized at ∼600°C. Up to 800°C no morphology changes were observed. Between 800 and 950°C, voids and hillocks were gradually developed in the films, which consequently collapsed. The Hall concentration and mobility were characterized in the Si1-xGex films, annealed between 600 and 800°C. The mobility and conductivity of p-Si0.5Ge0.5 films at room temperature were found to be relative high: 60 cm2/V s and 2000 (Ω cm)-1, respectively.

KW - Crystallization

KW - Electron transport

KW - Hillocks

KW - Silicon-germanium films

KW - X-ray diffraction

UR - http://www.scopus.com/inward/record.url?scp=0000334181&partnerID=8YFLogxK

U2 - 10.1016/S0040-6090(98)01378-9

DO - 10.1016/S0040-6090(98)01378-9

M3 - Article

AN - SCOPUS:0000334181

VL - 337

SP - 152

EP - 157

JO - THIN SOLID FILMS

JF - THIN SOLID FILMS

SN - 0040-6090

IS - 1-2

ER -