Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Current Developments in Lens Design and Optical Engineering XXIV |
| Herausgeber/-innen | R. Barry Johnson, Virendra N. Mahajan, Simon Thibault |
| Herausgeber (Verlag) | SPIE |
| Seitenumfang | 10 |
| ISBN (elektronisch) | 9781510665460 |
| Publikationsstatus | Veröffentlicht - 2 Okt. 2023 |
| Veranstaltung | Current Developments in Lens Design and Optical Engineering XXIV 2023 - San Diego, USA / Vereinigte Staaten Dauer: 22 Aug. 2023 → 22 Aug. 2023 Konferenznummer: 12666 |
Publikationsreihe
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Band | 12666 |
| ISSN (Print) | 0277-786X |
| ISSN (elektronisch) | 1996-756X |
Abstract
This paper presents the active alignment of miniaturized, substrate-free optical thin-film filters (TFFs) according to the filters’ spectral transfer properties for integration into fiber optical networks. Optical TFFs are often designed for a specific narrow angle of incidence (AOI) range. Hence, a sufficient manufacturing precision of the angled photonic components connected to the optical filter is needed. These components then can no longer be used for different scenarios where i.e. the incident angle is changed. Conversely, the individual miniaturized optical filter chips can also vary in specification due to slight inhomogeneities during the production on a large-scale wafer. Therefore, not all filter chips on the wafer meet the demanded specifications at the designed AOI, resulting in a reduced yield. Moreover, it requires a time-consuming separation into different quality classes by measuring single filter chips on the wafer. To maximize the amount of usable chips, a procedure was developed to actively align the chips inside a precision optics assembly system by measuring the transmitted power at different wavelengths while tilting them towards the optical axis. When the optimal angle is found, the chip is glued into the optical network platform. Next to maximizing the yield, the production steps can be reduced because the prior separation into quality classes becomes redundant. Manufacturing tolerances during the thin-film deposition are equalized due to the active spectral alignment on a universal optical platform. With this technique, a more versatile process for TFF integration compared to passively aligned assemblies on fixed angle components is demonstrated.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Informatik (insg.)
- Angewandte Informatik
- Mathematik (insg.)
- Angewandte Mathematik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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Current Developments in Lens Design and Optical Engineering XXIV. Hrsg. / R. Barry Johnson; Virendra N. Mahajan; Simon Thibault. SPIE, 2023. 126660M (Proceedings of SPIE - The International Society for Optical Engineering; Band 12666).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Spectrally aligned integration of miniaturized substrate-free thin-film filters for fiber optical networks
AU - Gehrke, Philipp
AU - Rüsseler, Anna K.
AU - Hoffmann, Gerd A.
AU - Wienke, Andreas
AU - Kracht, Dietmar
AU - Ristau, Detlev
N1 - Conference code: 12666
PY - 2023/10/2
Y1 - 2023/10/2
N2 - This paper presents the active alignment of miniaturized, substrate-free optical thin-film filters (TFFs) according to the filters’ spectral transfer properties for integration into fiber optical networks. Optical TFFs are often designed for a specific narrow angle of incidence (AOI) range. Hence, a sufficient manufacturing precision of the angled photonic components connected to the optical filter is needed. These components then can no longer be used for different scenarios where i.e. the incident angle is changed. Conversely, the individual miniaturized optical filter chips can also vary in specification due to slight inhomogeneities during the production on a large-scale wafer. Therefore, not all filter chips on the wafer meet the demanded specifications at the designed AOI, resulting in a reduced yield. Moreover, it requires a time-consuming separation into different quality classes by measuring single filter chips on the wafer. To maximize the amount of usable chips, a procedure was developed to actively align the chips inside a precision optics assembly system by measuring the transmitted power at different wavelengths while tilting them towards the optical axis. When the optimal angle is found, the chip is glued into the optical network platform. Next to maximizing the yield, the production steps can be reduced because the prior separation into quality classes becomes redundant. Manufacturing tolerances during the thin-film deposition are equalized due to the active spectral alignment on a universal optical platform. With this technique, a more versatile process for TFF integration compared to passively aligned assemblies on fixed angle components is demonstrated.
AB - This paper presents the active alignment of miniaturized, substrate-free optical thin-film filters (TFFs) according to the filters’ spectral transfer properties for integration into fiber optical networks. Optical TFFs are often designed for a specific narrow angle of incidence (AOI) range. Hence, a sufficient manufacturing precision of the angled photonic components connected to the optical filter is needed. These components then can no longer be used for different scenarios where i.e. the incident angle is changed. Conversely, the individual miniaturized optical filter chips can also vary in specification due to slight inhomogeneities during the production on a large-scale wafer. Therefore, not all filter chips on the wafer meet the demanded specifications at the designed AOI, resulting in a reduced yield. Moreover, it requires a time-consuming separation into different quality classes by measuring single filter chips on the wafer. To maximize the amount of usable chips, a procedure was developed to actively align the chips inside a precision optics assembly system by measuring the transmitted power at different wavelengths while tilting them towards the optical axis. When the optimal angle is found, the chip is glued into the optical network platform. Next to maximizing the yield, the production steps can be reduced because the prior separation into quality classes becomes redundant. Manufacturing tolerances during the thin-film deposition are equalized due to the active spectral alignment on a universal optical platform. With this technique, a more versatile process for TFF integration compared to passively aligned assemblies on fixed angle components is demonstrated.
KW - fiber optical networks
KW - hybrid photonic integration
KW - integrated optical filters
KW - optics integration
KW - photonic integrated circuits
KW - precision optics assembly system
KW - spectral alignment
KW - substrate-free thin-film filters
UR - http://www.scopus.com/inward/record.url?scp=85178274284&partnerID=8YFLogxK
U2 - 10.1117/12.2676681
DO - 10.1117/12.2676681
M3 - Conference contribution
AN - SCOPUS:85178274284
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Current Developments in Lens Design and Optical Engineering XXIV
A2 - Johnson, R. Barry
A2 - Mahajan, Virendra N.
A2 - Thibault, Simon
PB - SPIE
T2 - Current Developments in Lens Design and Optical Engineering XXIV 2023
Y2 - 22 August 2023 through 22 August 2023
ER -