Spectrally aligned integration of miniaturized substrate-free thin-film filters for fiber optical networks

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Philipp Gehrke
  • Anna K. Rüsseler
  • Gerd A. Hoffmann
  • Andreas Wienke
  • Dietmar Kracht
  • Detlev Ristau

Externe Organisationen

  • Laser Zentrum Hannover e.V. (LZH)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des SammelwerksCurrent Developments in Lens Design and Optical Engineering XXIV
Herausgeber/-innenR. Barry Johnson, Virendra N. Mahajan, Simon Thibault
Herausgeber (Verlag)SPIE
Seitenumfang10
ISBN (elektronisch)9781510665460
PublikationsstatusVeröffentlicht - 2 Okt. 2023
VeranstaltungCurrent Developments in Lens Design and Optical Engineering XXIV 2023 - San Diego, USA / Vereinigte Staaten
Dauer: 22 Aug. 202322 Aug. 2023
Konferenznummer: 12666

Publikationsreihe

NameProceedings of SPIE - The International Society for Optical Engineering
Band12666
ISSN (Print)0277-786X
ISSN (elektronisch)1996-756X

Abstract

This paper presents the active alignment of miniaturized, substrate-free optical thin-film filters (TFFs) according to the filters’ spectral transfer properties for integration into fiber optical networks. Optical TFFs are often designed for a specific narrow angle of incidence (AOI) range. Hence, a sufficient manufacturing precision of the angled photonic components connected to the optical filter is needed. These components then can no longer be used for different scenarios where i.e. the incident angle is changed. Conversely, the individual miniaturized optical filter chips can also vary in specification due to slight inhomogeneities during the production on a large-scale wafer. Therefore, not all filter chips on the wafer meet the demanded specifications at the designed AOI, resulting in a reduced yield. Moreover, it requires a time-consuming separation into different quality classes by measuring single filter chips on the wafer. To maximize the amount of usable chips, a procedure was developed to actively align the chips inside a precision optics assembly system by measuring the transmitted power at different wavelengths while tilting them towards the optical axis. When the optimal angle is found, the chip is glued into the optical network platform. Next to maximizing the yield, the production steps can be reduced because the prior separation into quality classes becomes redundant. Manufacturing tolerances during the thin-film deposition are equalized due to the active spectral alignment on a universal optical platform. With this technique, a more versatile process for TFF integration compared to passively aligned assemblies on fixed angle components is demonstrated.

ASJC Scopus Sachgebiete

Zitieren

Spectrally aligned integration of miniaturized substrate-free thin-film filters for fiber optical networks. / Gehrke, Philipp; Rüsseler, Anna K.; Hoffmann, Gerd A. et al.
Current Developments in Lens Design and Optical Engineering XXIV. Hrsg. / R. Barry Johnson; Virendra N. Mahajan; Simon Thibault. SPIE, 2023. 126660M (Proceedings of SPIE - The International Society for Optical Engineering; Band 12666).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Gehrke, P, Rüsseler, AK, Hoffmann, GA, Wienke, A, Kracht, D & Ristau, D 2023, Spectrally aligned integration of miniaturized substrate-free thin-film filters for fiber optical networks. in RB Johnson, VN Mahajan & S Thibault (Hrsg.), Current Developments in Lens Design and Optical Engineering XXIV., 126660M, Proceedings of SPIE - The International Society for Optical Engineering, Bd. 12666, SPIE, Current Developments in Lens Design and Optical Engineering XXIV 2023, San Diego, USA / Vereinigte Staaten, 22 Aug. 2023. https://doi.org/10.1117/12.2676681
Gehrke, P., Rüsseler, A. K., Hoffmann, G. A., Wienke, A., Kracht, D., & Ristau, D. (2023). Spectrally aligned integration of miniaturized substrate-free thin-film filters for fiber optical networks. In R. B. Johnson, V. N. Mahajan, & S. Thibault (Hrsg.), Current Developments in Lens Design and Optical Engineering XXIV Artikel 126660M (Proceedings of SPIE - The International Society for Optical Engineering; Band 12666). SPIE. https://doi.org/10.1117/12.2676681
Gehrke P, Rüsseler AK, Hoffmann GA, Wienke A, Kracht D, Ristau D. Spectrally aligned integration of miniaturized substrate-free thin-film filters for fiber optical networks. in Johnson RB, Mahajan VN, Thibault S, Hrsg., Current Developments in Lens Design and Optical Engineering XXIV. SPIE. 2023. 126660M. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.2676681
Gehrke, Philipp ; Rüsseler, Anna K. ; Hoffmann, Gerd A. et al. / Spectrally aligned integration of miniaturized substrate-free thin-film filters for fiber optical networks. Current Developments in Lens Design and Optical Engineering XXIV. Hrsg. / R. Barry Johnson ; Virendra N. Mahajan ; Simon Thibault. SPIE, 2023. (Proceedings of SPIE - The International Society for Optical Engineering).
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title = "Spectrally aligned integration of miniaturized substrate-free thin-film filters for fiber optical networks",
abstract = "This paper presents the active alignment of miniaturized, substrate-free optical thin-film filters (TFFs) according to the filters{\textquoteright} spectral transfer properties for integration into fiber optical networks. Optical TFFs are often designed for a specific narrow angle of incidence (AOI) range. Hence, a sufficient manufacturing precision of the angled photonic components connected to the optical filter is needed. These components then can no longer be used for different scenarios where i.e. the incident angle is changed. Conversely, the individual miniaturized optical filter chips can also vary in specification due to slight inhomogeneities during the production on a large-scale wafer. Therefore, not all filter chips on the wafer meet the demanded specifications at the designed AOI, resulting in a reduced yield. Moreover, it requires a time-consuming separation into different quality classes by measuring single filter chips on the wafer. To maximize the amount of usable chips, a procedure was developed to actively align the chips inside a precision optics assembly system by measuring the transmitted power at different wavelengths while tilting them towards the optical axis. When the optimal angle is found, the chip is glued into the optical network platform. Next to maximizing the yield, the production steps can be reduced because the prior separation into quality classes becomes redundant. Manufacturing tolerances during the thin-film deposition are equalized due to the active spectral alignment on a universal optical platform. With this technique, a more versatile process for TFF integration compared to passively aligned assemblies on fixed angle components is demonstrated.",
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author = "Philipp Gehrke and R{\"u}sseler, {Anna K.} and Hoffmann, {Gerd A.} and Andreas Wienke and Dietmar Kracht and Detlev Ristau",
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AU - Gehrke, Philipp

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AU - Hoffmann, Gerd A.

AU - Wienke, Andreas

AU - Kracht, Dietmar

AU - Ristau, Detlev

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N2 - This paper presents the active alignment of miniaturized, substrate-free optical thin-film filters (TFFs) according to the filters’ spectral transfer properties for integration into fiber optical networks. Optical TFFs are often designed for a specific narrow angle of incidence (AOI) range. Hence, a sufficient manufacturing precision of the angled photonic components connected to the optical filter is needed. These components then can no longer be used for different scenarios where i.e. the incident angle is changed. Conversely, the individual miniaturized optical filter chips can also vary in specification due to slight inhomogeneities during the production on a large-scale wafer. Therefore, not all filter chips on the wafer meet the demanded specifications at the designed AOI, resulting in a reduced yield. Moreover, it requires a time-consuming separation into different quality classes by measuring single filter chips on the wafer. To maximize the amount of usable chips, a procedure was developed to actively align the chips inside a precision optics assembly system by measuring the transmitted power at different wavelengths while tilting them towards the optical axis. When the optimal angle is found, the chip is glued into the optical network platform. Next to maximizing the yield, the production steps can be reduced because the prior separation into quality classes becomes redundant. Manufacturing tolerances during the thin-film deposition are equalized due to the active spectral alignment on a universal optical platform. With this technique, a more versatile process for TFF integration compared to passively aligned assemblies on fixed angle components is demonstrated.

AB - This paper presents the active alignment of miniaturized, substrate-free optical thin-film filters (TFFs) according to the filters’ spectral transfer properties for integration into fiber optical networks. Optical TFFs are often designed for a specific narrow angle of incidence (AOI) range. Hence, a sufficient manufacturing precision of the angled photonic components connected to the optical filter is needed. These components then can no longer be used for different scenarios where i.e. the incident angle is changed. Conversely, the individual miniaturized optical filter chips can also vary in specification due to slight inhomogeneities during the production on a large-scale wafer. Therefore, not all filter chips on the wafer meet the demanded specifications at the designed AOI, resulting in a reduced yield. Moreover, it requires a time-consuming separation into different quality classes by measuring single filter chips on the wafer. To maximize the amount of usable chips, a procedure was developed to actively align the chips inside a precision optics assembly system by measuring the transmitted power at different wavelengths while tilting them towards the optical axis. When the optimal angle is found, the chip is glued into the optical network platform. Next to maximizing the yield, the production steps can be reduced because the prior separation into quality classes becomes redundant. Manufacturing tolerances during the thin-film deposition are equalized due to the active spectral alignment on a universal optical platform. With this technique, a more versatile process for TFF integration compared to passively aligned assemblies on fixed angle components is demonstrated.

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