Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2009 IEEE International Symposium on Electromagnetic Compatibility |
| Untertitel | EMC |
| Seiten | 231-236 |
| Seitenumfang | 6 |
| Publikationsstatus | Veröffentlicht - 2009 |
| Veranstaltung | 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009 - Austin, USA / Vereinigte Staaten Dauer: 17 Aug. 2009 → 21 Aug. 2009 |
Publikationsreihe
| Name | IEEE International Symposium on Electromagnetic Compatibility |
|---|---|
| ISSN (Print) | 1077-4076 |
Abstract
Ultra wideband (UWB) pulses cover a large frequency range up to several GHz, thus they are able to cause malfunctions or even destructions of complex electronic systems. Previous investigations of the coupling effects of fast transient pulses to complex electronic systems have shown, that increasing system dimensions lead to an increased coupling efficiency. This statement seems to be universally applicable for all electronic systems, but susceptibility measurements of a generic microcontroller board with UWB pulses show surprisingly different results. In this contribution, this effect is investigated by measurements and numerical methods. Measurement results of the generic microcontroller board are presented as well as numerical results of the coupling behavior of different fast transient pulses to short PCB traces. Furthermore, the results of both measurement and numerical methods are compared to each other.
ASJC Scopus Sachgebiete
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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2009 IEEE International Symposium on Electromagnetic Compatibility: EMC. 2009. S. 231-236 5284563 (IEEE International Symposium on Electromagnetic Compatibility).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Special Coupling Effects of UWB Pulses to Short Signal Traces
AU - Fisahn, Sven
AU - Garbe, Heyno
PY - 2009
Y1 - 2009
N2 - Ultra wideband (UWB) pulses cover a large frequency range up to several GHz, thus they are able to cause malfunctions or even destructions of complex electronic systems. Previous investigations of the coupling effects of fast transient pulses to complex electronic systems have shown, that increasing system dimensions lead to an increased coupling efficiency. This statement seems to be universally applicable for all electronic systems, but susceptibility measurements of a generic microcontroller board with UWB pulses show surprisingly different results. In this contribution, this effect is investigated by measurements and numerical methods. Measurement results of the generic microcontroller board are presented as well as numerical results of the coupling behavior of different fast transient pulses to short PCB traces. Furthermore, the results of both measurement and numerical methods are compared to each other.
AB - Ultra wideband (UWB) pulses cover a large frequency range up to several GHz, thus they are able to cause malfunctions or even destructions of complex electronic systems. Previous investigations of the coupling effects of fast transient pulses to complex electronic systems have shown, that increasing system dimensions lead to an increased coupling efficiency. This statement seems to be universally applicable for all electronic systems, but susceptibility measurements of a generic microcontroller board with UWB pulses show surprisingly different results. In this contribution, this effect is investigated by measurements and numerical methods. Measurement results of the generic microcontroller board are presented as well as numerical results of the coupling behavior of different fast transient pulses to short PCB traces. Furthermore, the results of both measurement and numerical methods are compared to each other.
UR - http://www.scopus.com/inward/record.url?scp=74349109236&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2009.5284563
DO - 10.1109/ISEMC.2009.5284563
M3 - Conference contribution
AN - SCOPUS:74349109236
SN - 9781424442676
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 231
EP - 236
BT - 2009 IEEE International Symposium on Electromagnetic Compatibility
T2 - 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009
Y2 - 17 August 2009 through 21 August 2009
ER -