TY - JOUR

T1 - Single grain grinding

T2 - a novel approach to model the interactions at the grain/bond interface during grinding

AU - Denkena, Berend

AU - Bouabid, Abdelhamid

AU - Kroedel, Alexander

N1 - Funding information: Open Access funding provided by Projekt DEAL. The authors thank the “Lower Saxony Ministry of Science and Culture” for their financial support within the project “Fundamentals of model-based design and production of grinding wheels.”

PY - 2020/5/7

Y1 - 2020/5/7

N2 - The influence of the bond on grinding processes remains one uncertainty in the investigation of grinding tool behavior. Among others, this is due to the lack of knowledge about the interactions between the grain/bond interface and the grinding process loads. Understanding these interactions allows for further process development by adjusting the bond to the grinding application. The interactions at the grain/bond interface during grinding depend on the single grain thermomechanical loads as well as the tool properties. This paper presents an approach to provide the boundary conditions which are needed to model the interactions at the grain/bond interface. The machining of tungsten carbide with a bronze-bonded diamond tool is considered as use case. For this purpose, a novel kind of tool extracted from the grinding layer that serves to quantify the loads affecting the active grains and consequently their grain/bond interfaces during grinding is developed. The results of different grain orientations are plotted in a so-called Acu diagram, which gives an overview of the mechanical loads for different grain orientations and chip thickness values, as they occur during grinding due to the stochastic orientation and distribution of the abrasive grains in the grinding tool. It is shown that depending on the engagement conditions, the single grain-cutting force can reach up to 300 N by chip thickness values of 20 μm, which implies different wear behavior of the active grains.

AB - The influence of the bond on grinding processes remains one uncertainty in the investigation of grinding tool behavior. Among others, this is due to the lack of knowledge about the interactions between the grain/bond interface and the grinding process loads. Understanding these interactions allows for further process development by adjusting the bond to the grinding application. The interactions at the grain/bond interface during grinding depend on the single grain thermomechanical loads as well as the tool properties. This paper presents an approach to provide the boundary conditions which are needed to model the interactions at the grain/bond interface. The machining of tungsten carbide with a bronze-bonded diamond tool is considered as use case. For this purpose, a novel kind of tool extracted from the grinding layer that serves to quantify the loads affecting the active grains and consequently their grain/bond interfaces during grinding is developed. The results of different grain orientations are plotted in a so-called Acu diagram, which gives an overview of the mechanical loads for different grain orientations and chip thickness values, as they occur during grinding due to the stochastic orientation and distribution of the abrasive grains in the grinding tool. It is shown that depending on the engagement conditions, the single grain-cutting force can reach up to 300 N by chip thickness values of 20 μm, which implies different wear behavior of the active grains.

KW - Bronze bond

KW - Grain/bond interface

KW - Grinding

KW - Modeling

KW - Tool wear

UR - http://www.scopus.com/inward/record.url?scp=85084926938&partnerID=8YFLogxK

U2 - 10.1007/s00170-020-05219-8

DO - 10.1007/s00170-020-05219-8

M3 - Article

AN - SCOPUS:85084926938

VL - 107

SP - 4811

EP - 4822

JO - International Journal of Advanced Manufacturing Technology

JF - International Journal of Advanced Manufacturing Technology

SN - 0268-3768

IS - 11-12

ER -