Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019 |
| Untertitel | Proceedings |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (elektronisch) | 978-1-5386-8040-7 |
| ISBN (Print) | 978-1-5386-8041-4 |
| Publikationsstatus | Veröffentlicht - März 2019 |
| Veranstaltung | 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019 - Hannover, Deutschland Dauer: 24 März 2019 → 27 März 2019 |
Abstract
Particle radiation on ground and especially in space is unavoidable. This may lead to unwanted failures in electronic devices due to the continuously downscaling of microelectronic structures. Thinking of the expectation of more than 8000 new launched satellites in the next few years the need of radiation hardened components comes more and more in focus. Due to the high costs of radiation hardened (Rad-Hard) components, the aim is to find commercials of the shelf (COTS) which meets the need for this kind of harsh environment. Beside air and space applications, automotive components have to be Rad-Hard as well. Such components are specially designed and tested for the application in automotive. It is well known that test time in all cases is expensive and time consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices. The influences of materials (heavy metal), metallization layers and thickness of the die and radiation energy of neutrons and gamma radiation and their interactions will be discussed and simulation results concerning technological influences will be shown.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Chemische Verfahrenstechnik (insg.)
- Fließ- und Transferprozesse von Flüssigkeiten
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Maschinenbau
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Mathematik (insg.)
- Modellierung und Simulation
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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724581.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Simulations in terms of radiation effects on different BEOL material systems
AU - Weide-Zaage, Kirsten
AU - Paya-Vaya, Guillermo
AU - Eichin, Philemon
PY - 2019/3
Y1 - 2019/3
N2 - Particle radiation on ground and especially in space is unavoidable. This may lead to unwanted failures in electronic devices due to the continuously downscaling of microelectronic structures. Thinking of the expectation of more than 8000 new launched satellites in the next few years the need of radiation hardened components comes more and more in focus. Due to the high costs of radiation hardened (Rad-Hard) components, the aim is to find commercials of the shelf (COTS) which meets the need for this kind of harsh environment. Beside air and space applications, automotive components have to be Rad-Hard as well. Such components are specially designed and tested for the application in automotive. It is well known that test time in all cases is expensive and time consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices. The influences of materials (heavy metal), metallization layers and thickness of the die and radiation energy of neutrons and gamma radiation and their interactions will be discussed and simulation results concerning technological influences will be shown.
AB - Particle radiation on ground and especially in space is unavoidable. This may lead to unwanted failures in electronic devices due to the continuously downscaling of microelectronic structures. Thinking of the expectation of more than 8000 new launched satellites in the next few years the need of radiation hardened components comes more and more in focus. Due to the high costs of radiation hardened (Rad-Hard) components, the aim is to find commercials of the shelf (COTS) which meets the need for this kind of harsh environment. Beside air and space applications, automotive components have to be Rad-Hard as well. Such components are specially designed and tested for the application in automotive. It is well known that test time in all cases is expensive and time consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices. The influences of materials (heavy metal), metallization layers and thickness of the die and radiation energy of neutrons and gamma radiation and their interactions will be discussed and simulation results concerning technological influences will be shown.
UR - http://www.scopus.com/inward/record.url?scp=85067485448&partnerID=8YFLogxK
U2 - 10.1109/eurosime.2019.8724581
DO - 10.1109/eurosime.2019.8724581
M3 - Conference contribution
AN - SCOPUS:85067485448
SN - 978-1-5386-8041-4
BT - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Y2 - 24 March 2019 through 27 March 2019
ER -