Simple formulas to calculate the line parameters of interconnects on conducting substrates

Publikation: Konferenzbeitrag › Paper › Forschung › Peer-Review

Autoren

  • H. Grabinski
  • B. Konrad
  • P. Nordholz

Organisationseinheiten

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Details

OriginalspracheEnglisch
Seiten223-226
Seitenumfang4
PublikationsstatusVeröffentlicht - 1998
Veranstaltung1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, USA / Vereinigte Staaten
Dauer: 26 Okt. 1998 → 28 Okt. 1998

Konferenz

Konferenz1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
Land/GebietUSA / Vereinigte Staaten
OrtWest Point
Zeitraum26 Okt. 1998 → 28 Okt. 1998

Abstract

Since conducting substrates can significantly affect the performance of integrated circuits models have been developed to describe the influence of the substrate on the signal propagation on interconnects in a simple way. From these models easy formulas for the accurate computation of the frequency dependent line parameters are derived and compared with numerical simulations and measurements.

ASJC Scopus Sachgebiete

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Simple formulas to calculate the line parameters of interconnects on conducting substrates. / Grabinski, H.; Konrad, B.; Nordholz, P.
1998. 223-226 Beitrag in 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, New York, USA / Vereinigte Staaten.

Publikation: Konferenzbeitrag › Paper › Forschung › Peer-Review

Grabinski, H, Konrad, B & Nordholz, P 1998, 'Simple formulas to calculate the line parameters of interconnects on conducting substrates', Beitrag in 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, USA / Vereinigte Staaten, 26 Okt. 1998 - 28 Okt. 1998 S. 223-226. https://doi.org/10.1109/EPEP.1998.733992
Grabinski, H., Konrad, B., & Nordholz, P. (1998). Simple formulas to calculate the line parameters of interconnects on conducting substrates. 223-226. Beitrag in 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, New York, USA / Vereinigte Staaten. https://doi.org/10.1109/EPEP.1998.733992
Grabinski H, Konrad B, Nordholz P. Simple formulas to calculate the line parameters of interconnects on conducting substrates. 1998. Beitrag in 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, New York, USA / Vereinigte Staaten. doi: 10.1109/EPEP.1998.733992
Grabinski, H. ; Konrad, B. ; Nordholz, P. / Simple formulas to calculate the line parameters of interconnects on conducting substrates. Beitrag in 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, New York, USA / Vereinigte Staaten.4 S.
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