Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Precision Assembly Technologies for Mini and Micro Products |
| Untertitel | Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS '2006) |
| Seiten | 101-108 |
| Seitenumfang | 8 |
| Publikationsstatus | Veröffentlicht - 5 Okt. 2006 |
| Extern publiziert | Ja |
Publikationsreihe
| Name | IFIP International Federation for Information Processing |
|---|---|
| Band | 198 |
| ISSN (Print) | 1571-5736 |
Abstract
To recognize geometric objects of components in assembly processes, in particular of microelectronic or micro system components, nowadays the use of vision systems is preferred. These systems are working very fast but the results depend on ambient conditions, especially of light settings. They deliver 2D object information referring to the image plane of a camera. In most sensor guided assembly systems, additional to vision systems laser displacement sensors are implemented to get information about the third dimension, the components height. In this paper a scanning method is presented which enables object recognition by using a laser positioning sensor and to use the achieved measuring values for a sensor guided assembly process.
ASJC Scopus Sachgebiete
- Entscheidungswissenschaften (insg.)
- Informationssysteme und -management
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Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS '2006). 2006. S. 101-108 (IFIP International Federation for Information Processing; Band 198).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Beitrag in Buch/Sammelwerk › Forschung › Peer-Review
}
TY - CHAP
T1 - Sensor guided micro assembly by using laser-scanning technology
AU - Rathmann, Sven
AU - Wrege, Jan
AU - Schöttler, Kerstin
AU - Raatz, Annika
AU - Hesselbach, Jürgen
PY - 2006/10/5
Y1 - 2006/10/5
N2 - To recognize geometric objects of components in assembly processes, in particular of microelectronic or micro system components, nowadays the use of vision systems is preferred. These systems are working very fast but the results depend on ambient conditions, especially of light settings. They deliver 2D object information referring to the image plane of a camera. In most sensor guided assembly systems, additional to vision systems laser displacement sensors are implemented to get information about the third dimension, the components height. In this paper a scanning method is presented which enables object recognition by using a laser positioning sensor and to use the achieved measuring values for a sensor guided assembly process.
AB - To recognize geometric objects of components in assembly processes, in particular of microelectronic or micro system components, nowadays the use of vision systems is preferred. These systems are working very fast but the results depend on ambient conditions, especially of light settings. They deliver 2D object information referring to the image plane of a camera. In most sensor guided assembly systems, additional to vision systems laser displacement sensors are implemented to get information about the third dimension, the components height. In this paper a scanning method is presented which enables object recognition by using a laser positioning sensor and to use the achieved measuring values for a sensor guided assembly process.
KW - In process
KW - Laser scanning
KW - Precision assembly
UR - http://www.scopus.com/inward/record.url?scp=33749185447&partnerID=8YFLogxK
U2 - 10.1007/0-387-31277-3_11
DO - 10.1007/0-387-31277-3_11
M3 - Contribution to book/anthology
AN - SCOPUS:33749185447
SN - 0387312765
SN - 9780387312767
T3 - IFIP International Federation for Information Processing
SP - 101
EP - 108
BT - Precision Assembly Technologies for Mini and Micro Products
ER -