Self-optimizing compensation of surface deviations in 5-axis ball-end milling based on an enhanced description of cutting conditions

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • Marc-André Dittrich
  • Florian Uhlich
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Details

OriginalspracheEnglisch
Seiten (von - bis)224-232
Seitenumfang9
FachzeitschriftCIRP Journal of Manufacturing Science and Technology
Jahrgang31
Frühes Online-Datum19 Juni 2020
PublikationsstatusVeröffentlicht - Nov. 2020

Abstract

This article presents an approach for a self-optimizing compensation of tool load induced surface deviations in 5-axis ball-end milling. In order to predict the surface deviation independently from the workpiece geometry, the tool deflection is modelled as a function of the tool engagement using a machine learning approach. For that purpose, a novel description of the cutting conditions in ball-end milling is introduced. The selected features are derived from a process-parallel simulation. Subsequently, the learning behavior, the transferability of process knowledge to other shapes and the feasible compensation are investigated experimentally. It is shown that the developed approach can reduce the shape error by over 70%.

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Self-optimizing compensation of surface deviations in 5-axis ball-end milling based on an enhanced description of cutting conditions. / Dittrich, Marc-André; Uhlich, Florian.
in: CIRP Journal of Manufacturing Science and Technology, Jahrgang 31, 11.2020, S. 224-232.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Dittrich MA, Uhlich F. Self-optimizing compensation of surface deviations in 5-axis ball-end milling based on an enhanced description of cutting conditions. CIRP Journal of Manufacturing Science and Technology. 2020 Nov;31:224-232. Epub 2020 Jun 19. doi: 10.1016/j.cirpj.2020.05.013
Dittrich, Marc-André ; Uhlich, Florian. / Self-optimizing compensation of surface deviations in 5-axis ball-end milling based on an enhanced description of cutting conditions. in: CIRP Journal of Manufacturing Science and Technology. 2020 ; Jahrgang 31. S. 224-232.
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