Self-cleaning mechanisms in ultrasonic bonding of Al wire

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

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  • Laser Zentrum Hannover e.V. (LZH)
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OriginalspracheEnglisch
Seiten (von - bis)58-66
Seitenumfang9
FachzeitschriftJournal of Materials Processing Technology
Jahrgang258
Frühes Online-Datum20 März 2018
PublikationsstatusVeröffentlicht - Aug. 2018

Abstract

Real-time observations of the artificially increased oxide layer during the ultrasonic (US) bonding process were carried out to reveal the self-cleaning mechanisms. After the normal force loading, cracks occurred in the Al2O3 layer at the peripheral region of the wire/substrate interface and were perpendicular to the wire direction. As the US vibration started, the oxides started to detach from the pure metal surface and moved towards the middle of the contact area. With further vibration cycles, these detached oxides were milled from flakes into small particles. Due to three mechanisms including penetration, oxide flow and pushing, the small oxide particles were transported to the peripheral contact region or the outside of the contact area. When a metal splash existed, the flowing out of large amounts of oxides was facilitated. Pre-deformation originates cracks; vibration plays a significant role in detachment, milling, penetration and oxide flow; while the plastic deformation induced material flow is more critical on removing the oxides from the substrate by pushing. The shear tests showed that a 50 nm oxide coating could significantly enhance the Al-glass bonding strength by 2∼3 times.

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Self-cleaning mechanisms in ultrasonic bonding of Al wire. / Long, Yangyang; Dencker, Folke; Isaak, Andreas et al.
in: Journal of Materials Processing Technology, Jahrgang 258, 08.2018, S. 58-66.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Long Y, Dencker F, Isaak A, Hermsdorf J, Wurz M, Twiefel J. Self-cleaning mechanisms in ultrasonic bonding of Al wire. Journal of Materials Processing Technology. 2018 Aug;258:58-66. Epub 2018 Mär 20. doi: 10.1016/j.jmatprotec.2018.03.016
Long, Yangyang ; Dencker, Folke ; Isaak, Andreas et al. / Self-cleaning mechanisms in ultrasonic bonding of Al wire. in: Journal of Materials Processing Technology. 2018 ; Jahrgang 258. S. 58-66.
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AU - Long, Yangyang

AU - Dencker, Folke

AU - Isaak, Andreas

AU - Hermsdorf, Jörg

AU - Wurz, Marc

AU - Twiefel, Jens

N1 - Publisher Copyright: © 2018 Elsevier B.V. Copyright: Copyright 2018 Elsevier B.V., All rights reserved.

PY - 2018/8

Y1 - 2018/8

N2 - Real-time observations of the artificially increased oxide layer during the ultrasonic (US) bonding process were carried out to reveal the self-cleaning mechanisms. After the normal force loading, cracks occurred in the Al2O3 layer at the peripheral region of the wire/substrate interface and were perpendicular to the wire direction. As the US vibration started, the oxides started to detach from the pure metal surface and moved towards the middle of the contact area. With further vibration cycles, these detached oxides were milled from flakes into small particles. Due to three mechanisms including penetration, oxide flow and pushing, the small oxide particles were transported to the peripheral contact region or the outside of the contact area. When a metal splash existed, the flowing out of large amounts of oxides was facilitated. Pre-deformation originates cracks; vibration plays a significant role in detachment, milling, penetration and oxide flow; while the plastic deformation induced material flow is more critical on removing the oxides from the substrate by pushing. The shear tests showed that a 50 nm oxide coating could significantly enhance the Al-glass bonding strength by 2∼3 times.

AB - Real-time observations of the artificially increased oxide layer during the ultrasonic (US) bonding process were carried out to reveal the self-cleaning mechanisms. After the normal force loading, cracks occurred in the Al2O3 layer at the peripheral region of the wire/substrate interface and were perpendicular to the wire direction. As the US vibration started, the oxides started to detach from the pure metal surface and moved towards the middle of the contact area. With further vibration cycles, these detached oxides were milled from flakes into small particles. Due to three mechanisms including penetration, oxide flow and pushing, the small oxide particles were transported to the peripheral contact region or the outside of the contact area. When a metal splash existed, the flowing out of large amounts of oxides was facilitated. Pre-deformation originates cracks; vibration plays a significant role in detachment, milling, penetration and oxide flow; while the plastic deformation induced material flow is more critical on removing the oxides from the substrate by pushing. The shear tests showed that a 50 nm oxide coating could significantly enhance the Al-glass bonding strength by 2∼3 times.

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KW - Self-cleaning mechanisms

KW - Transportation mechanisms

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