Fabrication of a Low Profile Planar Transformer Using Molded Interconnect Device Technology

Bierwirth, T. N., Dencker, F., Fischer, E. C. & Wurz, M. C., Sept. 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., S. 129-133 5 S. (2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings).

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A Silicon-Proof Controller System for Flexible Ultra-Low-Power Energy Harvesting Platforms

Weisbrich, M., Blume, H. & Paya-Vaya, G., 2022, 2022 11th International Conference on Modern Circuits and Systems Technologies (MOCAST). Institute of Electrical and Electronics Engineers Inc.

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Backend compiler phases for trapped-ion quantum computers

Schmale, T., Temesi, B., Baishya, A., Pulido-Mateo, N., Krinner, L., Dubielzig, T., Ospelkaus, C., Weimer, H. & Borcherding, D., 2022, 2022 IEEE International Conference on Quantum Software (QSW). Ali, S., Ardagna, C. A., Barzen, J., Bian, H., Chang, C. K., Chang, R. N., Damiani, E., Faro, I., Feld, S., Leymann, F., Martin-Fernandez, F. J., Ward, R., Wimmer, M., Xhafa, F., Yu, J. & Zhang, J. (Hrsg.). S. 32-37 6 S.

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Co-Resonant cantilevers for materials research and sensor applications

Körner, J., 2022, 2022 Solid-State Sensors, Actuators and Microsystems Workshop Technical Digest. Ghodssi, R. & Chan, J. F. (Hrsg.). S. 448-449 2 S.

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Investigation of Lateral Compression Effects in Fiber Reinforced Soft Pneumatic Actuators

Berthold, R., Wiese, M. & Raatz, A., 2022, 2022 International Conference on Electrical, Computer, Communications and Mechatronics Engineering: ICECCME. Institute of Electrical and Electronics Engineers Inc.

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MANDO: Multi-Level Heterogeneous Graph Embeddings for Fine-Grained Detection of Smart Contract Vulnerabilities

Nguyen, H. H., Nguyen, N. M., Xie, C., Ahmadi, Z., Kudendo, D., Doan, T. N. & Jiang, L., 2022, 2022 IEEE 9th International Conference on Data Science and Advanced Analytics: (DSAA). Huang, J. Z., Pan, Y., Hammer, B., Khan, M. K., Xie, X., Cui, L. & He, Y. (Hrsg.). Institute of Electrical and Electronics Engineers Inc.

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Multivariate Time Series Analysis: An Interpretable CNN-based Model

Younis, R., Zerr, S. & Ahmadi, Z., 2022, 2022 IEEE 9th International Conference on Data Science and Advanced Analytics : (DSAA). Huang, J. Z., Pan, Y., Hammer, B., Khan, M. K., Xie, X., Cui, L. & He, Y. (Hrsg.). Institute of Electrical and Electronics Engineers Inc.

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SmartHeaP: A High-level Programmable, Low Power, and Mixed-Signal Hearing Aid SoC in 22nm FD-SOI

Karrenbauer, J. C., Klein, S. C., Schönewald, S. J., Gerlach, L. K., Blawat, M., Benndorf, J. & Blume, H. C., 2022, ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC). S. 265-268 4 S.

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Toward Cleansing Backdoored Neural Networks in Federated Learning

Wu, C., Yang, X., Zhu, S. & Mitra, P., 2022, Proceedings : 2022 IEEE 42nd International Conference on Distributed Computing Systems, ICDCS 2022. Institute of Electrical and Electronics Engineers Inc., S. 820-830 11 S. (Proceedings - International Conference on Distributed Computing Systems; Band 2022-July).

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