Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 189-196 |
| Seitenumfang | 8 |
| Fachzeitschrift | Materials Science and Engineering B: Solid-State Materials for Advanced Technology |
| Jahrgang | 236-237 |
| Publikationsstatus | Veröffentlicht - Okt. 2018 |
Abstract
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Allgemeine Materialwissenschaften
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Werkstoffmechanik
- Ingenieurwesen (insg.)
- Maschinenbau
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in: Materials Science and Engineering B: Solid-State Materials for Advanced Technology, Jahrgang 236-237, 10.2018, S. 189-196.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding
AU - Long, Yangyang
AU - Dencker, Folke
AU - Isaak, Andreas
AU - Li, Chun
AU - Schneider, Friedrich
AU - Hermsdorf, Jörg
AU - Wurz, Marc
AU - Twiefel, Jens
AU - Wallaschek, Jörg
N1 - © 2018 Elsevier B.V. All rights reserved.
PY - 2018/10
Y1 - 2018/10
N2 - Very complex phenomena and interface changes occur during the ultrasonic wire bonding process, which lead to an incomplete understanding of the process, especially for the friction and softening phases. In this work, the bonding process was real-time observed via metal-glass bonding to achieve a deeper understanding of these phenomena. Through the 2D high-speed observation, the emergence and changes of five areas including the contact area, friction area, stick area, microwelds area and oxides area were observed and quantified. The stick and microwelds area were observed to start from the central region and extend outwards. Normal force and ultrasonic power interactively influence these areas. The moving of oxides was captured and confirmed to be caused by both the material flow and vibration. The ultimate shear stress of microwelds was calculated to be 95.72 MPa with which the quantification of the observed microwelds area can be used to predict the bonding strength.
AB - Very complex phenomena and interface changes occur during the ultrasonic wire bonding process, which lead to an incomplete understanding of the process, especially for the friction and softening phases. In this work, the bonding process was real-time observed via metal-glass bonding to achieve a deeper understanding of these phenomena. Through the 2D high-speed observation, the emergence and changes of five areas including the contact area, friction area, stick area, microwelds area and oxides area were observed and quantified. The stick and microwelds area were observed to start from the central region and extend outwards. Normal force and ultrasonic power interactively influence these areas. The moving of oxides was captured and confirmed to be caused by both the material flow and vibration. The ultimate shear stress of microwelds was calculated to be 95.72 MPa with which the quantification of the observed microwelds area can be used to predict the bonding strength.
KW - Microwelds area
KW - Oxide particle movement
KW - Real-time observation
KW - Ultrasonic bonding mechanisms
UR - http://www.scopus.com/inward/record.url?scp=85044441998&partnerID=8YFLogxK
U2 - 10.1016/j.mseb.2018.11.010
DO - 10.1016/j.mseb.2018.11.010
M3 - Article
AN - SCOPUS:85044441998
VL - 236-237
SP - 189
EP - 196
JO - Materials Science and Engineering B: Solid-State Materials for Advanced Technology
JF - Materials Science and Engineering B: Solid-State Materials for Advanced Technology
SN - 0921-5107
ER -