Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 14-21 |
| Seitenumfang | 8 |
| ISBN (elektronisch) | 9780738145235 |
| Publikationsstatus | Veröffentlicht - 2021 |
| Veranstaltung | 71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, USA / Vereinigte Staaten Dauer: 1 Juni 2021 → 4 Juli 2021 |
Publikationsreihe
| Name | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Band | 2021-June |
| ISSN (Print) | 0569-5503 |
Abstract
In this paper we investigate the long-term stability and reliability of a 3D-Opto-MID package for multimode waveguide bus coupling. Preliminary works proved an interruption-free coupling approach with asymmetric coupling rates depending on the coupling direction for optical bus systems. This is possible thanks to a coupling at the side-faces of the waveguide cores where one coupling partner has a defined bending to achieve the asymmetric coupling. Crucial for this defined bending are three-dimensional assemblies. For this, we developed a mixed-material package based on ceramic thick-film substrates combined with stereo-lithographic printed polymers. Because of the different material parameters, we analyzed the package behavior in a high temperature storage, a temperature humidity and a temperature cycle test. The results of the reliability tests enable specific further development of the package and thus make an important contribution to the intended series production of the 3D-Opto-MID technology.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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- BibTex
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Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. S. 14-21 (Proceedings - Electronic Components and Technology Conference; Band 2021-June).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Reliability of 3D-Opto-MID Packages for Asymmetric Optical Bus Couplers
AU - Lorenz, Lukas
AU - Hanesch, Florian
AU - Nieweglowski, Krzysztof
AU - Hamjah, Mohd Khairulamzari
AU - Franke, Jörg
AU - Hoffmann, Gerd Albert
AU - Overmeyer, Ludger
AU - Bock, Karlheinz
N1 - Funding Information: The authors would like to thank Ilias Sotiriou for the preparation of the waveguides. The DFB lasers for the 3D-Opto-MID were purchased in an experimental state from the Fraunhofer Heinrich-Hertz-Institut Berlin. Funding Information: The German Research Foundation (DFG) in the Research Group OPTAVER supported this work (BO 3438/4-1; AOBJ: 648318).
PY - 2021
Y1 - 2021
N2 - In this paper we investigate the long-term stability and reliability of a 3D-Opto-MID package for multimode waveguide bus coupling. Preliminary works proved an interruption-free coupling approach with asymmetric coupling rates depending on the coupling direction for optical bus systems. This is possible thanks to a coupling at the side-faces of the waveguide cores where one coupling partner has a defined bending to achieve the asymmetric coupling. Crucial for this defined bending are three-dimensional assemblies. For this, we developed a mixed-material package based on ceramic thick-film substrates combined with stereo-lithographic printed polymers. Because of the different material parameters, we analyzed the package behavior in a high temperature storage, a temperature humidity and a temperature cycle test. The results of the reliability tests enable specific further development of the package and thus make an important contribution to the intended series production of the 3D-Opto-MID technology.
AB - In this paper we investigate the long-term stability and reliability of a 3D-Opto-MID package for multimode waveguide bus coupling. Preliminary works proved an interruption-free coupling approach with asymmetric coupling rates depending on the coupling direction for optical bus systems. This is possible thanks to a coupling at the side-faces of the waveguide cores where one coupling partner has a defined bending to achieve the asymmetric coupling. Crucial for this defined bending are three-dimensional assemblies. For this, we developed a mixed-material package based on ceramic thick-film substrates combined with stereo-lithographic printed polymers. Because of the different material parameters, we analyzed the package behavior in a high temperature storage, a temperature humidity and a temperature cycle test. The results of the reliability tests enable specific further development of the package and thus make an important contribution to the intended series production of the 3D-Opto-MID technology.
KW - 3D mechatronic integrated device
KW - Interruption-free waveguide coupling
KW - Long-term stability
KW - Mixed-material package
KW - Reliability
KW - Stereo-lithographic printing
UR - http://www.scopus.com/inward/record.url?scp=85124668330&partnerID=8YFLogxK
U2 - 10.1109/ECTC32696.2021.00014
DO - 10.1109/ECTC32696.2021.00014
M3 - Conference contribution
AN - SCOPUS:85124668330
T3 - Proceedings - Electronic Components and Technology Conference
SP - 14
EP - 21
BT - Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 71st IEEE Electronic Components and Technology Conference, ECTC 2021
Y2 - 1 June 2021 through 4 July 2021
ER -