Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autorschaft

  • M. Brinkmann
  • R. Delsol
  • T. Daschinger
  • R. Brendel
  • H. Schulte-Huxel

Organisationseinheiten

Externe Organisationen

  • Institut für Solarenergieforschung GmbH (ISFH)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten253-255
Seitenumfang3
ISBN (elektronisch)9781665464260
ISBN (Print)978-1-6654-7582-2
PublikationsstatusVeröffentlicht - 9 Juni 2024
Veranstaltung52nd IEEE Photovoltaic Specialist Conference, PVSC 2024 - Seattle, USA / Vereinigte Staaten
Dauer: 9 Juni 202414 Juni 2024

Publikationsreihe

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371
ISSN (elektronisch)2995-1755

Abstract

Reducing the silver consumption of photovoltaics (PV) is a major aspect in recent solar cell research. For PERC+ solar cells silver is used for the front contact and as solder pads on the rear side. An ultrasonic (US) soldering process is used to wet Al structures on the rear side of PERC+ with lead-free solder and manufacture silver-free solder pads for the standard tabbing process. Peel tests are carried out showing an adhesion of above 2 N/mm of the cell interconnects. Contact resistance measurements are performed showing a comparable contribution to the series resistance as silver solder pads. Minimodules are fabricated reaching the same efficiency as a reference module with standard silver pad rear side connection and a degradation of less than 3.6% after 200 humidity-freeze cycles.

ASJC Scopus Sachgebiete

Zitieren

Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. / Brinkmann, M.; Delsol, R.; Daschinger, T. et al.
2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024. Institute of Electrical and Electronics Engineers Inc., 2024. S. 253-255 (Conference Record of the IEEE Photovoltaic Specialists Conference).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Brinkmann, M, Delsol, R, Daschinger, T, Brendel, R & Schulte-Huxel, H 2024, Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. in 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024. Conference Record of the IEEE Photovoltaic Specialists Conference, Institute of Electrical and Electronics Engineers Inc., S. 253-255, 52nd IEEE Photovoltaic Specialist Conference, PVSC 2024, Seattle, USA / Vereinigte Staaten, 9 Juni 2024. https://doi.org/10.1109/PVSC57443.2024.10748728
Brinkmann, M., Delsol, R., Daschinger, T., Brendel, R., & Schulte-Huxel, H. (2024). Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. In 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024 (S. 253-255). (Conference Record of the IEEE Photovoltaic Specialists Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC57443.2024.10748728
Brinkmann M, Delsol R, Daschinger T, Brendel R, Schulte-Huxel H. Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. in 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024. Institute of Electrical and Electronics Engineers Inc. 2024. S. 253-255. (Conference Record of the IEEE Photovoltaic Specialists Conference). doi: 10.1109/PVSC57443.2024.10748728
Brinkmann, M. ; Delsol, R. ; Daschinger, T. et al. / Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering. 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024. Institute of Electrical and Electronics Engineers Inc., 2024. S. 253-255 (Conference Record of the IEEE Photovoltaic Specialists Conference).
Download
@inproceedings{18063fd42bc24f8db089390ca277cca7,
title = "Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering",
abstract = "Reducing the silver consumption of photovoltaics (PV) is a major aspect in recent solar cell research. For PERC+ solar cells silver is used for the front contact and as solder pads on the rear side. An ultrasonic (US) soldering process is used to wet Al structures on the rear side of PERC+ with lead-free solder and manufacture silver-free solder pads for the standard tabbing process. Peel tests are carried out showing an adhesion of above 2 N/mm of the cell interconnects. Contact resistance measurements are performed showing a comparable contribution to the series resistance as silver solder pads. Minimodules are fabricated reaching the same efficiency as a reference module with standard silver pad rear side connection and a degradation of less than 3.6% after 200 humidity-freeze cycles.",
author = "M. Brinkmann and R. Delsol and T. Daschinger and R. Brendel and H. Schulte-Huxel",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 52nd IEEE Photovoltaic Specialist Conference, PVSC 2024 ; Conference date: 09-06-2024 Through 14-06-2024",
year = "2024",
month = jun,
day = "9",
doi = "10.1109/PVSC57443.2024.10748728",
language = "English",
isbn = "978-1-6654-7582-2",
series = "Conference Record of the IEEE Photovoltaic Specialists Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "253--255",
booktitle = "2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024",
address = "United States",

}

Download

TY - GEN

T1 - Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering

AU - Brinkmann, M.

AU - Delsol, R.

AU - Daschinger, T.

AU - Brendel, R.

AU - Schulte-Huxel, H.

N1 - Publisher Copyright: © 2024 IEEE.

PY - 2024/6/9

Y1 - 2024/6/9

N2 - Reducing the silver consumption of photovoltaics (PV) is a major aspect in recent solar cell research. For PERC+ solar cells silver is used for the front contact and as solder pads on the rear side. An ultrasonic (US) soldering process is used to wet Al structures on the rear side of PERC+ with lead-free solder and manufacture silver-free solder pads for the standard tabbing process. Peel tests are carried out showing an adhesion of above 2 N/mm of the cell interconnects. Contact resistance measurements are performed showing a comparable contribution to the series resistance as silver solder pads. Minimodules are fabricated reaching the same efficiency as a reference module with standard silver pad rear side connection and a degradation of less than 3.6% after 200 humidity-freeze cycles.

AB - Reducing the silver consumption of photovoltaics (PV) is a major aspect in recent solar cell research. For PERC+ solar cells silver is used for the front contact and as solder pads on the rear side. An ultrasonic (US) soldering process is used to wet Al structures on the rear side of PERC+ with lead-free solder and manufacture silver-free solder pads for the standard tabbing process. Peel tests are carried out showing an adhesion of above 2 N/mm of the cell interconnects. Contact resistance measurements are performed showing a comparable contribution to the series resistance as silver solder pads. Minimodules are fabricated reaching the same efficiency as a reference module with standard silver pad rear side connection and a degradation of less than 3.6% after 200 humidity-freeze cycles.

UR - http://www.scopus.com/inward/record.url?scp=85211587214&partnerID=8YFLogxK

U2 - 10.1109/PVSC57443.2024.10748728

DO - 10.1109/PVSC57443.2024.10748728

M3 - Conference contribution

AN - SCOPUS:85211587214

SN - 978-1-6654-7582-2

T3 - Conference Record of the IEEE Photovoltaic Specialists Conference

SP - 253

EP - 255

BT - 2024 IEEE 52nd Photovoltaic Specialist Conference, PVSC 2024

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 52nd IEEE Photovoltaic Specialist Conference, PVSC 2024

Y2 - 9 June 2024 through 14 June 2024

ER -