Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review

Autoren

  • Yangyang Long
  • Friedrich Schneider
  • Chun Li
  • Jörg Hermsdorf
  • Jens Twiefel
  • Jörg Wallaschek

Organisationseinheiten

Externe Organisationen

  • Laser Zentrum Hannover e.V. (LZH)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Seiten (von - bis)449-463
Seitenumfang15
FachzeitschriftInternational Journal of Precision Engineering and Manufacturing - Green Technology
Jahrgang6
Ausgabenummer3
Frühes Online-Datum4 März 2019
PublikationsstatusVeröffentlicht - 1 Juli 2019

ASJC Scopus Sachgebiete

Ziele für nachhaltige Entwicklung

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Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters. / Long, Yangyang; Schneider, Friedrich; Li, Chun et al.
in: International Journal of Precision Engineering and Manufacturing - Green Technology, Jahrgang 6, Nr. 3, 01.07.2019, S. 449-463.

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review

Long Y, Schneider F, Li C, Hermsdorf J, Twiefel J, Wallaschek J. Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters. International Journal of Precision Engineering and Manufacturing - Green Technology. 2019 Jul 1;6(3):449-463. Epub 2019 Mär 4. doi: 10.1007/s40684-019-00061-0
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@article{bab583fd4c7c4e8cae6a80b598076ae2,
title = "Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters",
keywords = "Energy flows, Interface, Process parameters, Relative motion, Ultrasonic wire bonding",
author = "Yangyang Long and Friedrich Schneider and Chun Li and J{\"o}rg Hermsdorf and Jens Twiefel and J{\"o}rg Wallaschek",
note = "Funding information: We gratefully acknowledge the support from the Ministry of Science and Culture of Lower Saxony, Germany within the Multifunktionale Aktive und Reaktive Interfaces und Oberfl{\"a}chen (MARIO) program and Deutsche Forschungsgemeinschaft (DFG) program (TW75/8-1|WA564/40-1). Great thanks to Hesse Mechantronics GmbH for providing the bonding head HBK05 and Mr. Heiner Ramsbott from Vision Research Europe for providing the lens.",
year = "2019",
month = jul,
day = "1",
doi = "10.1007/s40684-019-00061-0",
language = "English",
volume = "6",
pages = "449--463",
journal = "International Journal of Precision Engineering and Manufacturing - Green Technology",
issn = "2288-6206",
publisher = "Springer Science + Business Media",
number = "3",

}

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TY - JOUR

T1 - Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters

AU - Long, Yangyang

AU - Schneider, Friedrich

AU - Li, Chun

AU - Hermsdorf, Jörg

AU - Twiefel, Jens

AU - Wallaschek, Jörg

N1 - Funding information: We gratefully acknowledge the support from the Ministry of Science and Culture of Lower Saxony, Germany within the Multifunktionale Aktive und Reaktive Interfaces und Oberflächen (MARIO) program and Deutsche Forschungsgemeinschaft (DFG) program (TW75/8-1|WA564/40-1). Great thanks to Hesse Mechantronics GmbH for providing the bonding head HBK05 and Mr. Heiner Ramsbott from Vision Research Europe for providing the lens.

PY - 2019/7/1

Y1 - 2019/7/1

KW - Energy flows

KW - Interface

KW - Process parameters

KW - Relative motion

KW - Ultrasonic wire bonding

UR - http://www.scopus.com/inward/record.url?scp=85068565085&partnerID=8YFLogxK

U2 - 10.1007/s40684-019-00061-0

DO - 10.1007/s40684-019-00061-0

M3 - Article

AN - SCOPUS:85068565085

VL - 6

SP - 449

EP - 463

JO - International Journal of Precision Engineering and Manufacturing - Green Technology

JF - International Journal of Precision Engineering and Manufacturing - Green Technology

SN - 2288-6206

IS - 3

ER -