Qualifying Electrically Conductive Cold Embedding-Media for Scanning Electron Microscopy

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  • National Metallurgical Academy of Ukraine
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OriginalspracheEnglisch
Seiten (von - bis)332-341
Seitenumfang10
FachzeitschriftMetallography, Microstructure, and Analysis
Jahrgang5
Ausgabenummer4
Frühes Online-Datum10 Mai 2016
PublikationsstatusVeröffentlicht - Aug. 2016

Abstract

The choice of embedding-media for metallographic specimen preparation, where subsequent scanning electron microscopy will be performed, is highly important since the quality of the analytical results in the specimen’s near-surface region is limited by the properties of the embedding-material. Due to their high electrical conductivity and only slight tendency to form gaps between near the sample surface, warm curing embedding-media are usually best suited. Hot embedding-presses use relatively high pressures at elevated temperatures that can be detrimental for sensitive materials or coatings. Cold embedding with conventional embedding-media, which does not require high pressure mounting, requires compromising for a material with a lower electric conductivity, a higher amount of pores in the material, and inferior interfacial connectivity to the specimen. For this reason, the development of alternative electrically conductive and cold hardening embedding-media is of great interest for metallographic sample preparation of electron microscopy specimens. In the present study, various embedding-media were evaluated with respect to their suitability for scanning electron microscopy and a novel conductive mounting compound has been identified and qualified.

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Qualifying Electrically Conductive Cold Embedding-Media for Scanning Electron Microscopy. / Besserer, Hans Bernward; Boiarkin, Viacheslav; Rodman, Dmytro et al.
in: Metallography, Microstructure, and Analysis, Jahrgang 5, Nr. 4, 08.2016, S. 332-341.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Besserer, HB, Boiarkin, V, Rodman, D & Nürnberger, F 2016, 'Qualifying Electrically Conductive Cold Embedding-Media for Scanning Electron Microscopy', Metallography, Microstructure, and Analysis, Jg. 5, Nr. 4, S. 332-341. https://doi.org/10.1007/s13632-016-0286-9
Besserer, H. B., Boiarkin, V., Rodman, D., & Nürnberger, F. (2016). Qualifying Electrically Conductive Cold Embedding-Media for Scanning Electron Microscopy. Metallography, Microstructure, and Analysis, 5(4), 332-341. https://doi.org/10.1007/s13632-016-0286-9
Besserer HB, Boiarkin V, Rodman D, Nürnberger F. Qualifying Electrically Conductive Cold Embedding-Media for Scanning Electron Microscopy. Metallography, Microstructure, and Analysis. 2016 Aug;5(4):332-341. Epub 2016 Mai 10. doi: 10.1007/s13632-016-0286-9
Besserer, Hans Bernward ; Boiarkin, Viacheslav ; Rodman, Dmytro et al. / Qualifying Electrically Conductive Cold Embedding-Media for Scanning Electron Microscopy. in: Metallography, Microstructure, and Analysis. 2016 ; Jahrgang 5, Nr. 4. S. 332-341.
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