Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 2013-2016 |
| Seitenumfang | 4 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 54 |
| Ausgabenummer | 9-10 |
| Publikationsstatus | Veröffentlicht - 1 Sept. 2014 |
Abstract
Embedding passives in PCB permits to gain in integration density while enhancing electromagnetic compatibility performances. The choice of the dielectric film is fundamental for large frequency band stability of embedded capacitances. However, these materials are prone to water absorption, which can lead to functional parameter degradations and additional stresses at the interfaces. This paper presents experimental capacitors embedded in FR-4, and finite element simulations of moisture absorption in various dielectric materials. Technological choices, as well as the qualification procedure, can be improved thanks to the simulation results.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
in: Microelectronics reliability, Jahrgang 54, Nr. 9-10, 01.09.2014, S. 2013-2016.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Qualification procedure for moisture in embedded capacitors
AU - Frémont, Hélène
AU - Kludt, Jörg
AU - Wade, Massar
AU - Weide-Zaage, Kirsten
AU - Bord-Majek, Isabelle
AU - Duchamp, Geneviève
N1 - Funding Information: The work was supported by PROCOPE PKZ 55888031 and PHC 28245YB. This program is founded by the DAAD-Germany financed by the BMBF-Germany and French Ministry of Foreign Affairs . Publisher Copyright: © 2014 Elsevier Ltd. All rights reserved. Copyright: Copyright 2014 Elsevier B.V., All rights reserved.
PY - 2014/9/1
Y1 - 2014/9/1
N2 - Embedding passives in PCB permits to gain in integration density while enhancing electromagnetic compatibility performances. The choice of the dielectric film is fundamental for large frequency band stability of embedded capacitances. However, these materials are prone to water absorption, which can lead to functional parameter degradations and additional stresses at the interfaces. This paper presents experimental capacitors embedded in FR-4, and finite element simulations of moisture absorption in various dielectric materials. Technological choices, as well as the qualification procedure, can be improved thanks to the simulation results.
AB - Embedding passives in PCB permits to gain in integration density while enhancing electromagnetic compatibility performances. The choice of the dielectric film is fundamental for large frequency band stability of embedded capacitances. However, these materials are prone to water absorption, which can lead to functional parameter degradations and additional stresses at the interfaces. This paper presents experimental capacitors embedded in FR-4, and finite element simulations of moisture absorption in various dielectric materials. Technological choices, as well as the qualification procedure, can be improved thanks to the simulation results.
KW - Embedded capacitors
KW - FEM
KW - Moisture
KW - Qualification
UR - http://www.scopus.com/inward/record.url?scp=84908500004&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2014.07.117
DO - 10.1016/j.microrel.2014.07.117
M3 - Article
AN - SCOPUS:84908500004
VL - 54
SP - 2013
EP - 2016
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-10
ER -