Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 5-8 |
| Seitenumfang | 4 |
| Fachzeitschrift | CIRP Annals - Manufacturing Technology |
| Jahrgang | 61 |
| Ausgabenummer | 1 |
| Publikationsstatus | Veröffentlicht - 19 Apr. 2012 |
| Extern publiziert | Ja |
Abstract
In the assembly of microsystems, a reliable, precise, and fast joining process remains an open challenge. An approach using hot melt adhesives to join these micro parts is investigated within this article. A relevant issue with hot melt adhesives is introducing heat into the assembly process. This heat management can be achieved using either an active or passive concept. These concepts and their influence on process design are discussed. The realization of active heat management within a gripper is discussed in detail. Experimental results from an exemplary process show the applicability of the hybrid assembly process using hot melt adhesives.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Maschinenbau
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
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in: CIRP Annals - Manufacturing Technology, Jahrgang 61, Nr. 1, 19.04.2012, S. 5-8.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Process development for the assembly of microsystems with hot melt adhesives
AU - Raatz, Annika
AU - Rathmann, Sven
AU - Hesselbach, Jürgen
N1 - Funding information: Fig. 6 shows the measured assembly uncertainty A MU is 7.57 ?m at 2?. It is notable that the uncertainty in the y-direction is larger than in x-direction. This is due to the thermal expansion of the gripper. The thermal expansion along the x axis does not influence the position of the part whereas the thermal expansion in the y axis causes an offset in this direction of about 3 ?m. This interpretation was supported by additional thermal FEA simulations.
PY - 2012/4/19
Y1 - 2012/4/19
N2 - In the assembly of microsystems, a reliable, precise, and fast joining process remains an open challenge. An approach using hot melt adhesives to join these micro parts is investigated within this article. A relevant issue with hot melt adhesives is introducing heat into the assembly process. This heat management can be achieved using either an active or passive concept. These concepts and their influence on process design are discussed. The realization of active heat management within a gripper is discussed in detail. Experimental results from an exemplary process show the applicability of the hybrid assembly process using hot melt adhesives.
AB - In the assembly of microsystems, a reliable, precise, and fast joining process remains an open challenge. An approach using hot melt adhesives to join these micro parts is investigated within this article. A relevant issue with hot melt adhesives is introducing heat into the assembly process. This heat management can be achieved using either an active or passive concept. These concepts and their influence on process design are discussed. The realization of active heat management within a gripper is discussed in detail. Experimental results from an exemplary process show the applicability of the hybrid assembly process using hot melt adhesives.
KW - Assembly
KW - Joining
KW - Miniaturization
UR - http://www.scopus.com/inward/record.url?scp=84861647022&partnerID=8YFLogxK
U2 - 10.1016/j.cirp.2012.03.104
DO - 10.1016/j.cirp.2012.03.104
M3 - Article
AN - SCOPUS:84861647022
VL - 61
SP - 5
EP - 8
JO - CIRP Annals - Manufacturing Technology
JF - CIRP Annals - Manufacturing Technology
SN - 0007-8506
IS - 1
ER -