Printing of laser-generated conductive copper tracks on 3D components

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Autoren

  • Ejvind Olsen
  • Ludger Overmeyer

Organisationseinheiten

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Details

OriginalspracheEnglisch
Titel des Sammelwerks2021 14th International Congress
UntertitelMolded Interconnect Devices, MID 2021 - Proceedings
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)9781728175096
ISBN (Print)978-1-7281-7510-2
PublikationsstatusVeröffentlicht - 2021
Veranstaltung14th International Congress Molded Interconnect Devices (MID 2021) - online, Virtual, Nurnberg, Deutschland
Dauer: 8 Feb. 2021 → 11 Feb. 2021
Konferenznummer: 14

Abstract

This research combines laser sintering and cleaning for the additive manufacturing of copper conductors on three-dimensional (3D) components. An application example shows the production of a conductive copper grid on a 3D antenna cover. The approach consists of full-surface coating with a primer and copper ink layer, followed by laser processing. The primer is applied to compensate for surface defects, ensure adequate insulation, and achieve thermal stability. Laser sintering creates conductive traces using the copper ink coating. In the last step of the production, laser cleaning removes the remaining non-sintered ink to ensure optimal electromagnetic characteristics. Finally, the 3D sintered conductive trace grids on an acrylonitrile butadiene styrene component results in an electrical resistance lower than 15 \Omega across the grid.

ASJC Scopus Sachgebiete

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Printing of laser-generated conductive copper tracks on 3D components. / Olsen, Ejvind; Overmeyer, Ludger.
2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. 9361618.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Olsen, E & Overmeyer, L 2021, Printing of laser-generated conductive copper tracks on 3D components. in 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings., 9361618, Institute of Electrical and Electronics Engineers Inc., 14th International Congress Molded Interconnect Devices (MID 2021), Virtual, Nurnberg, Deutschland, 8 Feb. 2021. https://doi.org/10.1109/MID50463.2021.9361618
Olsen, E., & Overmeyer, L. (2021). Printing of laser-generated conductive copper tracks on 3D components. In 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings Artikel 9361618 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MID50463.2021.9361618
Olsen E, Overmeyer L. Printing of laser-generated conductive copper tracks on 3D components. in 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2021. 9361618 doi: 10.1109/MID50463.2021.9361618
Olsen, Ejvind ; Overmeyer, Ludger. / Printing of laser-generated conductive copper tracks on 3D components. 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021.
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title = "Printing of laser-generated conductive copper tracks on 3D components",
abstract = "This research combines laser sintering and cleaning for the additive manufacturing of copper conductors on three-dimensional (3D) components. An application example shows the production of a conductive copper grid on a 3D antenna cover. The approach consists of full-surface coating with a primer and copper ink layer, followed by laser processing. The primer is applied to compensate for surface defects, ensure adequate insulation, and achieve thermal stability. Laser sintering creates conductive traces using the copper ink coating. In the last step of the production, laser cleaning removes the remaining non-sintered ink to ensure optimal electromagnetic characteristics. Finally, the 3D sintered conductive trace grids on an acrylonitrile butadiene styrene component results in an electrical resistance lower than 15 \Omega across the grid. ",
keywords = "3D printed copper, copper ink coating, electromechanical 3D components, laser cleaning, laser sintering, priming",
author = "Ejvind Olsen and Ludger Overmeyer",
note = "Funding Information: ACKNOWLEDGMENT The authors would like to thank the Federal Ministry for Economic Affairs and Energy (BMWi) for funding the project {"}3D-CopperPrint{"} of the AiF (Arbeitsgemeinschaft industrieller Forschungsvereinigungen {"}Otto von Guericke{"} e.V.) within the IGF (Industrielle Gemeinschaftsforschung), with the IGF project number 20133 N, and the German company {"}deister electronic GmbH{"} for working on a practice-oriented application example. The authors also thank all other members of the project committee for supporting the project. ; 14th International Congress Molded Interconnect Devices, MID 2021 ; Conference date: 08-02-2021 Through 11-02-2021",
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