Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Micro-Assembly Technologies and Applications |
| Untertitel | International Precision Assembly Seminar |
| Seiten | 199-206 |
| Seitenumfang | 8 |
| Publikationsstatus | Veröffentlicht - 26 März 2008 |
| Extern publiziert | Ja |
Publikationsreihe
| Name | IFIP International Federation for Information Processing |
|---|---|
| Band | 260 |
| ISSN (Print) | 1571-5736 |
Abstract
The paper presents a size-adapted assembly system for the automated precision assembly of active microsystems. The part sizes of the microsystems can reach centimeter range, but they must be assembled with an assembly accuracy of about a few micrometers. The results of a sensor guided assembly process using a 3D vision sensor are shown. This process reaches a positioning uncertainty of 1.2 μm and an assembly uncertainty of 36 μm.
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- Entscheidungswissenschaften (insg.)
- Informationssysteme und -management
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Micro-Assembly Technologies and Applications: International Precision Assembly Seminar. 2008. S. 199-206 (IFIP International Federation for Information Processing; Band 260).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Precision assembly of active microsystems with a size-adapted assembly system
AU - Schöttler, Kerstin
AU - Raatz, Annika
AU - Hesseibach, Jürgen
PY - 2008/3/26
Y1 - 2008/3/26
N2 - The paper presents a size-adapted assembly system for the automated precision assembly of active microsystems. The part sizes of the microsystems can reach centimeter range, but they must be assembled with an assembly accuracy of about a few micrometers. The results of a sensor guided assembly process using a 3D vision sensor are shown. This process reaches a positioning uncertainty of 1.2 μm and an assembly uncertainty of 36 μm.
AB - The paper presents a size-adapted assembly system for the automated precision assembly of active microsystems. The part sizes of the microsystems can reach centimeter range, but they must be assembled with an assembly accuracy of about a few micrometers. The results of a sensor guided assembly process using a 3D vision sensor are shown. This process reaches a positioning uncertainty of 1.2 μm and an assembly uncertainty of 36 μm.
KW - Assembly system
KW - Precision assembly
KW - Sensor guidance
UR - http://www.scopus.com/inward/record.url?scp=40949107803&partnerID=8YFLogxK
U2 - 10.1007/978-0-387-77405-3_19
DO - 10.1007/978-0-387-77405-3_19
M3 - Conference contribution
AN - SCOPUS:40949107803
SN - 9780387774022
T3 - IFIP International Federation for Information Processing
SP - 199
EP - 206
BT - Micro-Assembly Technologies and Applications
ER -